EVIDENT CORPORATION

At a glance

Company profile

EVIDENT CORPORATION builds on more than a century of optical work carried forward from the Olympus era, during which its technologies supported scientific research, medical advances, and precise industrial applications. Today the company develops next-generation micro-imaging solutions that combine established optical technology with digital innovation for scientific, clinical, and industrial use. Its life-science portfolio supports research, clinical diagnostics, and education with imaging methods that range from brightfield and darkfield microscopy to fluorescence, 4D analysis, and digital pathology. For industrial microscopy, EVIDENT CORPORATION supplies laser-scanning, digital, and semiconductor microscopes for work ranging from routine inspection to quality control and manufacturing analysis. EVIDENT CORPORATION is headquartered in Tokyo and is supported by R&D and manufacturing centers in Japan, the United States, Germany, and China. Its global operating structure also includes dedicated sales and service centers around the world.

Exhibits

The equipment range includes industrial microscopes, industrial endoscopes, high-speed cameras, automated wafer inspection machines, 3D computed-tomography scanning microscopes, biological microscopes, slide-scanning systems, cleanliness-testing laboratory solutions, and related peripheral equipment. Industrial microscopes are included in the company's displayed product scope. Its semiconductor wafer and flat-panel-display inspection microscopes are designed for safe wafer transfer and are intended for semiconductor defect inspection. The semiconductor inspection microscope range is presented around fast start-up, easy operation, failure analysis, and expandability, with models covering both wafer and flat-panel-display inspection. The AL120 wafer-handler family transfers silicon and compound-semiconductor wafers, including silicon carbide (SiC) and gallium arsenide (GaAs), from a cassette to a microscope stage while retaining an ergonomic, user-oriented configuration. AL120-12 is positioned for lower-cost back-end inspection, supports both FOUP and FOSB handling, and is designed to transfer thin and warped wafers safely. MX63 and MX63L are modular inspection microscope systems for wafers as large as 300 mm as well as flat-panel displays, circuit boards, and other large samples, allowing components to be selected for the application. The same semiconductor inspection portfolio also includes digital microscope cameras for high-resolution imaging, MXPLFLN objectives that combine high resolution with long working distance, PRECiV image-analysis software, and laser confocal microscopes. For post-process inspection, AL120-12 combines top macro inspection, back macro inspection, and microscope inspection in a system designed around ease of use and operator ergonomics. Its robotic vacuum pick-up arm provides non-contact wafer centering for stage placement, wafers can be rotated through 360 degrees during microscope inspection, and centrally located controls are intended to support comfortable operation. The AL120 series includes a 200 mm model, a convertible 150 mm and 200 mm model, and a 150 mm model for wafers of 150 mm or less, with wafer transfer and microscope inspection supported across the series. AL120 operation is recipe-driven with 10 programmable system configurations, while the LCD shows handler parameters and recipe settings and the system provides non-contact optical centering plus notch or flat detection and alignment. A three-sensor system continuously monitors wafer position during retrieval, transfer, loading, and unloading, and the handler can interface with MX-series wafer-inspection microscopes that support brightfield, darkfield, differential interference contrast, and near-infrared observation. With PRECiV software, the MX63 series supports MIX observation that combines darkfield with methods such as brightfield, fluorescence, or polarization, multiple-image alignment for panoramic images, extended-focus imaging for all-in-focus images and height maps, and HDR processing for scenes with large brightness differences. The MX63 series is designed for cleanroom use, complies with SEMI S2/S8, CE, and UL requirements, and uses shielded motorized components plus antistatic treatment on the frame, tubes, breath shield, and other parts to reduce contamination risk. Wafer holders and glass plates cover 150 to 200 mm and 200 to 300 mm ranges, while different stages can accommodate 75 mm, 100 mm, 125 mm, and 150 mm wafers when production requirements change. Coded hardware records observation method, illumination intensity, and magnification with the associated images in PRECiV, while focus assistance, stored light-intensity settings, and automatic aperture control are intended to make settings easier to reproduce across operators. For optical performance, MXPLFLN objectives provide a 3 mm working distance in many higher-resolution 20X and 50X cases, the system uses high-intensity white LED illumination with consistent color temperature, and PRECiV supports automatic calibration, shading correction, and infrared observation with 5X to 100X IR objectives. For advanced packaging, EVIDENT CORPORATION addresses inspection targets as micro-bump pitches move toward 20 µm and more features sit beneath silicon, using near-infrared imaging for nondestructive inspection and non-contact 3D measurement for height, coplanarity, and step height. Wire-bond inspection can measure ball diameter, pad centering, loop height, and wire sweep with STM7 and DSX2000 systems, and the DSX2000 provides 2D and 3D measurement over a 21X to 7,300X range. Before flip-chip bonding, the LEXT OLS5500 measures bump height and coplanarity without contacting the sample and can acquire a full field of 20 µm bumps in about 10 seconds, while an infrared-configured MX63 can observe selected buried features through silicon up to 1.2 mm thick after bonding. The advanced-packaging workflow also covers wafer-level packaging, fan-out wafer-level packaging, 2.5D integration, and 3D stacking, with inspection targets including RDL surface defects and step height, die shift, interposer trace continuity, micro-bump alignment, TSV depth, and exposed surface topography. For subsurface TSV fill voids the material calls for complementary acoustic or X-ray inspection, while repetitive optical inspections on supported microscope systems can be recorded and replayed and results can be exported to Excel. In semiconductor circuit formation, oxidation, photoresist coating, pattern printing, etching, impurity diffusion, and planarization can introduce defects such as irregular resist coatings, flaws, and foreign substances. Automated wafer inspection can have insufficient optical resolution for small defects, so microscope inspection can use brightfield, darkfield, differential interference contrast, MIX, and polarized-light methods to select the condition that best reveals a defect. The DSX1000 multifunction console can display a sample under six observation methods from a button press or user-interface command so the operator can compare images and choose a suitable view more quickly. Most DSX1000 objectives support the available observation methods, reducing the need to change lenses between methods, and calibration by an EVIDENT service technician is required to guarantee XY accuracy. In the documented wafer-defect example, differential interference contrast makes a difficult defect clearly identifiable, and the related DSX1000 platform is described for faster failure analysis with accuracy and repeatability. For bare-wafer laser marks, pulse laser irradiation creates dents in the silicon lattice that form dot-matrix characters and codes, while increasing wafer density and decreasing thickness create demand for smaller and more accurate markings. The DSX digital microscope uses extended-focus imaging to capture multiple images at different focus positions at high speed and combine them so the full visual field, from wafer surface to the bottom of a laser mark, remains in focus. Its measurement functions can quantify laser-mark diameter, the length of a mark sequence, and the depth of a dot. The laser-mark application also lists high-definition and high-resolution image inspection, diverse image-processing techniques, differential interference contrast, and guidance functions intended to help users obtain consistent results. The documented laser-mark image was acquired with a 20x objective lens and 1.5x zoom, and DSX1000 is identified as the related digital-microscope product. For circuit-pattern inspection on wafer samples, the conventional approach alternates darkfield for circuit patterns and brightfield for wafer color, requiring separate image acquisition for each method when preparing a report. MX63 and MX63L use MIX illumination to observe circuit patterns and wafer color information at the same time, with the stated aim of improving inspection efficiency and report creation. The systems include workflow functions intended to support inspection from start to finish with performance suitable for a cleanroom environment. Focus assistance, light-intensity control, and aperture-control functions simplify adjustment of the inspection conditions and are described as enabling less experienced operators to work under appropriate observation settings. MX63 and MX63L combine clear, sharp imaging with a modular design that lets users select optical components for particular inspection needs instead of using a fixed configuration. For wafer-level chip-size packages, the inspection requirement includes precise measurement of wafer bumps, solder balls, and copper posts as high-density packaging is used in devices such as smartphones, digital cameras, digital audio players, laptop PCs, and watches. The LEXT 3D measurement microscope performs non-contact, high-resolution 3D measurement of wafer-level CSP shape and surface roughness and combines optical capability with software for measuring and detecting irregularities without damaging the device. Its product description emphasizes ultra-high resolution, high pixel density, and high inclination sensitivity for measuring complex and steep-sided component features. The related LEXT OLS5500 combines laser scanning microscopy, white light interferometry, and focus variation microscopy, offers guaranteed accuracy and repeatability for LSM and WLI when calibration conditions are met, and lists WLI throughput up to 40x faster than conventional LSM. LEXT OLS5100 is described for accurate optical measurement of shape and surface roughness at the submicron level with workflow-oriented tools. For flip-chip BGA surface mounting, the connection interface must be inspected, and sectioning followed by polishing can introduce fine surface irregularities that make conventional optical observation more difficult. The LEXT system is presented as a faster and more cost-effective BGA inspection option when manufacturers would otherwise turn to an electron microscope for these irregular polished surfaces. Its extended focal imaging combines multiple in-focus images along the Z-axis so the full field of view is in focus, with a minimum resolution of 0.12 μm and support for multicolor observation. The same LEXT description combines ultra-high resolution and high pixel density with microscopy and image-processing methods that can highlight a feature of interest and support accurate measurement. The related OLS5500 covers traceable surface measurement from the nanometer to micrometer scale with LSM, WLI, and FVM plus PRECiV integration, while OLS5100 addresses submicron shape and surface-roughness measurement. Across materials science and industrial inspection, EVIDENT CORPORATION offers laser-scanning, digital, and semiconductor microscopes for electronics, metallurgy, manufacturing, and semiconductor research, covering tasks from routine quality checks to failure analysis. Its industrial product categories include metallurgical microscopes, 3D optical profilometers such as LEXT OLS5500, digital microscopes including DSX2000, cleanliness-analysis microscopes, STM7 measuring microscopes, light microscopes, semiconductor wafer-inspection microscopes, AR microscopes, stereo microscopes, digital cameras, and objective lenses. Cleanliness-analysis systems are described for technical-cleanliness work under standards including ISO 16232 and VDA 19, while optional materials-analysis workflows support common standards including ISO, ASTM, JIS, and DIN. PRECiV image-analysis software supports image acquisition, measurement, documentation, and archiving, and optional AI tools include TruAI deep-learning functions plus Live AI for feature detection and image-quality improvement. Customized industrial microscope solutions can be configured around a user's sample shape or workflow, and the portfolio also includes darkfield-compatible modular microscopes for high-contrast observation across industrial and other microscopy applications.

Capabilities and products

• semiconductor wafer and flat panel display inspection microscopes
• wafer transfer and microscope inspection systems
• 300 mm wafer inspection
• safe transfer of thin and warped wafers
• non-contact wafer centering and notch/flat alignment
• 360° wafer macro inspection
• digital cameras for microscopes
• semiconductor wafer inspection objectives
• PRECiV image analysis software
• 3D optical profilometers
• laser confocal microscopes
• automated imaging and analysis with digital microscopes
• cleanliness and particle analysis microscopes
• microstructure inspection of metals and solid materials
• digital measuring microscopes
• light microscopes for materials science
• augmented reality microscopes
• industrial stereo microscopes
• microscope objective lenses
• customized industrial microscope solutions
• darkfield microscopes
• MIX multimode observation
• multiple-image alignment for panoramic stitching
• extended-focus all-in-focus imaging
• microscopy height-map generation
• HDR microscopy image processing
• automatic calibration for microscopy imaging
• microscopy image shading correction
• ISO/ASTM/JIS/DIN material analysis workflows
• TruAI deep-learning image analysis
• Live AI rapid feature detection
• microscopy image acquisition, measurement, documentation, and archiving
• near-infrared nondestructive through-silicon inspection
• non-contact 3D height, coplanarity, and step-height measurement
• wire-bond ball diameter, pad centering, loop height, and wire-sweep measurement
• wafer surface defect and contamination inspection
• non-contact measurement of RDL step height and bump profiles
• through-silicon inspection up to 1.2 mm thickness
• micro-bump alignment inspection at 20–40 µm pitch
• non-contact measurement of TSV depth, profile, and exposed topography
• wafer laser-mark dimension measurement
• wafer laser-mark depth measurement
• MIX observation of wafer circuit patterns and color
• 3D measurement of wafer-level CSP shape and surface roughness
• BGA cross-section inspection
• recording and replay of repetitive inspections
• inspection results export to Excel
• darkfield detection of minute scratches and flaws
• contamination and photoresist residue detection

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