Omni Matcher · SEMICON Taiwan 2026 · Exhibitor List

EVG-JOINTECH

Exhibitor at SEMICON Taiwan 2026 · Booth L0310

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At a glance

BoothL0310
CountryTW
Product categoriesCleaning; Washing Equipment for Assembly & Packaging · Die Bonding; Attach Equipment · Die Removal Equipment · Dispensing Systems · Hot Embossing System · Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Printing Equipment; Screen-printing; Alignment ; Film Printing · Wafer Level Bonders · Wafer Mount; Taping Equipment · Alignment Film Coating Equipment · Seal Patterning Equipment · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Double sided mask aligner · Equipment, Nanotechnology Tools · Bumping Systems · Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Coat; Develop; Resist Processing; Track Equipment · Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment · Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint · SOI Bonders; Temporary Bonders; De-Bonders · Spin on Glass (SOG); on Dielectric (SOD) Track systems · Transfer Systems for Wafer; Reticles or FPD's · Optical Test Systems · Package Test Systems · Transfer lithography masks; Polymer masks; templates (for Nanoimprint) · Chucks for Wafer and other Substrates · Lithography; Patterning service · Device; Wafer; Display Panel Handling Products
Websitewww.EVGroup.com

Company profile

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MSMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com。

Exhibits

MLE™ - Moving beyond traditional mask-based lithography toward digital maskless lithography technology EV Group Technologies MLE™ - Maskless Exposure Technology Moving beyond traditional mask-based lithography toward digital lithography technology MLE (maskless exposure) technology is a revolutionary next-generation lithography technology developed by EV Group to address future back-end lithography needs for advanced packaging, MEMS, biomedical and IC substrate applications. The world’s first highly scalable maskless lithography technology for high-volume manufacturing delivers unsurpassed flexibility to enable extremely short development cycles for new devices. Heterogeneous integration is gaining more attention and is seen as a forthcoming way of achieving higher computing performances and extended device functionalities without the need for continuous scaling. The demand for the continuous innovation of the chiplet design and its integration on silicon or on package can be addressed via adaptive patterning. This new industry vision will require new high-volume manufacturing tools that can quickly integrate new designs schemes as traditional back-end lithography suffers from several limitations restricting its applicability. Moreover, continuously increasing mask costs for various layout designs and mask inventory management represents a significant part of overall development and production costs. MLE technology invented by EV Group addresses this critical demand for design flexibility, as it surmounts mask-related difficulties in both development and production phases and thus shortens development cycles. Additionally, this technology keeps your specific designs and layouts confidential as they do not need to be sent externally. This innovative ‘digital lithography’ technology bridges the gap between R&D and production while offering a scalable solution capable of dynamically addressing die and wafer-level designs simultaneously and at the same time meet critical requirements for various markets, such as advanced packaging, MEMS, biomedical and HDI PCB markets. EVG’s MLE technology enables high-resolution (<2 microns L/S), stitch-free maskless exposure of the entire substrate surface with high throughput and low cost of ownership. The system scales according to user needs – for facilitating rapid transition from R&D to HVM mode, for throughput optimization, or for adaptation to different substrate sizes and materials – and is ideal for processing a range of substrates from small silicon or compound semiconductor wafers up to panel sizes. MLE achieves the same patterning performance regardless of photoresist thanks to a flexible and scalable high-power UV laser source, which provides multiple wavelength exposure options.

Capabilities and products

Related product topics

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