At a glance
| Booth | L0310 |
| Country | TW |
| Website | www.EVGroup.com |
Company profile
EV Group (EVG) is a leading supplier of equipment and process solutions for semiconductor manufacturing, including semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. Its high-volume-manufacturing-ready products include wafer bonding, lithography and nanoimprint lithography, thin-wafer processing and metrology equipment, together with photoresist coaters, cleaners and inspection systems, supporting semiconductor front-end scaling, 3D integration, advanced packaging and other electronics and photonics applications. Founded in 1980, EVG supports a global network of customers and partners, has more than 1700 employees worldwide, and has fully owned subsidiaries in the U.S., Japan, South Korea, China, Taiwan and Singapore. Application labs and cleanrooms at its headquarters in Austria and in North America and Asia support global R&D and production customers from initial development through final integration at the customer's site. EVG precision mechanical engineering systems are used to create microchips and electronic, micromechanical and optical components on silicon, glass and similar substrates for products including camera sensors, position and motion sensors, microphones, displays, airbag sensors, advanced-driver-assistance components and microfluidic chips for blood or DNA analysis. Technology milestones include a double-side mask aligner with bottom-side microscopes in 1985, separation of wafer alignment and wafer bonding in 1990, a production wafer-bonding system for volume MEMS manufacturing in 1992, SmartView® face-to-face wafer alignment in 1999, GEMINI® in 2000, temporary wafer bonding and debonding technology from 2001, and a fully automated production wafer-bonding system for 300-mm wafers in 2007. Later developments include ComBond® in October 2014, HERCULES® NIL in July 2015, BONDSCALETM in December 2018, LITHOSCALE® systems with MLE™ technology in September 2020, and IR LayerRelease™ technology for ultra-thin chiplet and 3D layer stacking; the EVG®880 LayerRelease™ system received the 2024 Best of West award. EVG operates an Environmental Management System according to ISO 14001, began implementing an ISO 9001 quality-management system in 2002 and achieved its first certification in 2004, with the certificate subsequently extended or renewed through annual external audits. The company also states that it follows the Responsible Business Alliance (RBA) Code of Conduct and applies legal and regulatory requirements covering occupational health and safety, equality, accident prevention, equipment safety, environmental protection and anti-bribery and corruption.
Exhibits
EV Group Technologies MLE™ is maskless exposure technology developed by EV Group to move beyond traditional mask-based lithography toward digital lithography for future back-end lithography needs in advanced packaging, MEMS, biomedical and IC-substrate applications. MLE is described as the world's first highly scalable maskless lithography technology for high-volume manufacturing, providing design flexibility for short development cycles and addressing mask-related difficulties and costs in development and production. It is intended to support heterogeneous integration and adaptive patterning for chiplet design and integration on silicon or packages, while keeping specific designs and layouts confidential because they do not need to be sent externally. The digital-lithography approach bridges R&D and production and dynamically addresses die-level and wafer-level designs for markets including advanced packaging, MEMS, biomedical and HDI PCB. EVG's MLE technology enables high-resolution exposure better than 2 µm line/space, with stitch-free maskless exposure of the entire substrate surface, high throughput and low cost of ownership. The system scales for rapid transition from R&D to HVM, throughput optimization and different substrate sizes and materials, processing substrates from small silicon or compound-semiconductor wafers up to panel sizes. A flexible and scalable high-power UV laser source provides multiple wavelength exposure options and enables the same patterning performance regardless of photoresist. Features include full-resolution stitch-free dynamic photoresist patterning, programmable digital layouts for design freedom and data confidentiality, individual die annotations, wafer-level adaptive-registration compensation, operation on deformed or warped thick wafers, glass or organic substrates, smart and agile digital-lithography processing, and consumables-free technology. Related systems listed with the technology include EVG®620 NT Smart NIL®, EVG®6200 NT SmartNIL®, EVG®720 Automated SmartNIL®, EVG®7200 Automated SmartNIL®, EVG®7200 LA Large-Area SmartNIL®, EVG®770 Step-and-Repeat Nanoimprint Lithography System and HERCULES® NIL Fully Integrated SmartNIL® UV-NIL System.
Capabilities and products
- wafer bonding equipment
- thin-wafer processing equipment
- lithography and nanoimprint lithography equipment
- semiconductor metrology equipment
- photoresist coaters
- wafer cleaning systems
- wafer inspection systems
- <2 µm L/S stitch-free maskless exposure
- temporary bonding and debonding
- eutectic bonding
- transient liquid phase (TLP) bonding
- anodic bonding
- metal diffusion bonding
- hybrid and fusion bonding
- die-to-wafer fusion and hybrid bonding
- room-temperature conductive oxide-free covalent bonding
- ultra-thin chiplet LayerRelease stacking
- ultra-thin 3D LayerRelease stacking