At a glance
| Booth | K2570 |
| Country | TW |
| Website | ecbu.ecic.com |
Company profile
Everlight Chemical Industrial Corporation was founded in 1972, was publicly listed on the Taiwan Stock Exchange in 1988, and has developed chemical-synthesis technology as a core competency. The company positions itself as a high-tech chemical enterprise and continually develops high-value-added, low-energy-consumption, and low-polluting high-tech chemical products. Its photosensitive-product range includes positive photoresist, negative photoresist, shielding photoresist, insulator, overcoat, high reflective layer, and side protective seal ink. Product characteristics listed for the photosensitive range include coating uniformity, small dark erosion, surface impedance, adhesion, and strip ability.
Exhibits
The company offers G-line, I-line, and thick-film photoresists for photolithography processes in the semiconductor and packaging industries, together with photoresist developers and related products. Manufacturing is carried out in a tightly controlled cleanroom environment and supported by advanced analytical instruments to maintain consistent product quality. EPG 510 Series positive photoresists are listed for IC applications with high sensitivity, adhesion, thermal resistance, and a wide process margin. EPG 530 Series positive photoresists are listed for IC applications with high sensitivity, high resolution, adhesion, thermal resistance, and a wide process margin. EPG 550 is a positive photoresist for G-line metal-layer production with high resolution and metal-layer anti-reflection ability. EPG 590 Series are thick-layer positive photoresists for bumping manufacture, with chemical resistance, high viscosity, adhesion, and plating-process application. For display applications, Everlight Chemical Industrial Corporation develops TFT Array photoresists, thermally cured overcoat, light-shielding ink, glass-side protection adhesive, developers, and thinners. For upstream LED processing, the company supplies substrate-polishing slurries for sapphire substrates, silicon-wafer substrates, and stainless-steel materials in front-end and back-end polishing processes. For midstream LED photolithography, it supplies positive and negative photoresists. The company also supplies multiple photoresists for touch-panel processes. For touch-module processes, it separately supplies photoresists for protective and insulating layers, carbon-black photoresist, and related products. For LED manufacturing, photoresists are available for lift-off and PSS, Pattern Sapphire Substrate, processes together with related wafer-polishing slurries and developer. The LED-material quality approach includes ultra-clean manufacturing, pp-level analysis, and microlithography technologies. ESA 300 uses dispersed alumina abrasives with a special formulation for SiC substrate polishing with high removal rate. ESA 300 is also listed with good suspension, high dilution, re-dispersibility for work, surface roughness of Ra < 0.1 nm, and outstanding removal rate. The display-material development program is directed at meeting higher color-performance requirements through the combined TFT Array photoresist, overcoat, shielding-ink, edge-protection, developer, and thinner range. For the LED-related range, the company links photoresist, developer, and polishing-slurry supply with ultra-clean manufacturing, pp-level analysis, and microlithography technologies used to support product quality.
Capabilities and products
- G-line/I-line/thick-film photoresists
- photoresist developers
- TFT Array photoresists
- thermoset overcoat (OC)
- shading ink and glass-edge protective seal
- polishing slurries for LED substrates
- high-removal-rate SiC polishing slurry
- positive/negative photoresists for LED lift-off and PSS
- photoresists for touch-panel processes
- photoresists for touch-module protective and insulating layers
- carbon-black photoresists