At a glance
| Booth | L0909 |
| Country | KR |
| Product categories | Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Lead Frames & Headers: Etched; Stamped · Marking ink · Molding; Encapsulation; Potting; Resin Materials · Package Substrates; Laminate; Film based · Packages; Ceramic and Other High Temp Compounds · Packages; Plastic · Preforms; Lids · Printed Circuit Boards (PCB); Printed Wire Boards (PWB) · Printing Masks; Screens · Scribe Tools; Saw or Dicing Blades and Accessories · Solder; Solder Balls and other Soldering Materials · Tape Automated Bonding (TAB) Accessories · Thermal Interface Materials; Heat Sinks · Thick Film Pastes; Materials · Thin Film; Dielectric Film Materials · Materials, Nanotechnology |
| Website | www.e-port.co.kr |
Company profile
Since its establishment in 2010, Eport Co., Ltd. has been importing and selling thermally conductive ceramic powders such as spherical alumina and spherical silicon nitride, used as ceramic fillers in TIM (thermal interface materials). Furthermore, in 2018, Eport established its own R&D center and began developing high-purity spherical alumina using proprietary technology and supplying it to the semiconductor industry. This has enabled it to become a leading thermal conductive material company in South Korea. Leveraging its expertise in ceramic synthesis, spheroidization, grading, surface treatment, and compounding, Eport Co., Ltd. collaborates with customers to review and evaluate the suitability of thermal conductive materials, thereby providing innovative heat dissipation solutions. Eport also continues to invest in the development of fillers optimized for cutting-edge semiconductor packaging materials (EMC) such as GDDR7/HBM. To embrace the upcoming space age, AI (artificial intelligence), and autonomous driving era, Eport is committed to contributing to the advancement of human civilization through the development of sustainable new materials.
Capabilities and products
- ceramic synthesis, spheroidization, grading, surface treatment and compounding
- high-purity spherical alumina for the semiconductor industry
- spherical alumina and spherical silicon nitride ceramic fillers for TIM
- thermal conductive fillers for GDDR7/HBM EMC packaging materials
- thermally conductive ceramic powders