At a glance
| Booth | L0628 |
| Country | KR |
| Product categories | Deflashing; Degating Tools · Dicing; Sawing; Scribing; Separation Equipment · Marking; Imprinting; Labeling Equipment · Laser Treatment; Cutting Systems for Panels & Photocells · Cutting; Drilling; Laser ablation; Beveling Equipment · Welding Equipment · Etching; Stripping; Ashing - Dry and Wet Equipment · Wafer Identification; Marking Equipment |
| Website | www.eotechnics.com |
Company profile
EO Technics is the worldwide leader in the laser-based application industries with more than 30 years of dedication in developing laser itself as well as manufacturing laser application equipment. EO Technics is providing the qualified products and the very speedy commercialization to the world-wide customers ’ requirements with the various product ranges from the front end upto the back end equipment which are including: as for semiconductor tor market, Wafer Laser Annealing, Wafer Grooving / Dicing and Drilling equipment, WLCSP Wafer Back Side Marker, Wafer Top Side Marker (including Wafer ID Marker), EMC Package Ablation, Drilling and Cutting Equipment, all kinds of SEMI and Non-SEMI purposed Laser Markers (Fundamental IR / Green / UV / CO2 as well as ps lasers and fs lasers) by being supported by our own Built-in Vision alignment systems, as for PCB market, Laser PCB Via Hole Driller (CO2 and UV), PCB Strip & Panel Marker and PCB Cutter. as for Display market, Laser Cleaner, Laser Lift-Off (LLO), GLA & ULA, Titler and Edge Exposure, ITO Patterning System, Glass Cutter, Glass Marker, as for th e general laser application market, Welding, Cutting and Soldering machines. Especially, EO Technics is applying to the multi-beam solutions for laser markers, laser wafer grooving machines and laser drilling systems which can provide the cost- effective production. EO Technics has its headquarters in Anyang, Korea, as the world-wide international corporate center and has its own branch offices in Taiwan, China, Singapore, Philippines, Thailand, Malaysia, Japan, India, Vietnam and USA to provide all EO customers with the truly global services.
Capabilities and products
- CO2 and UV laser PCB via hole drillers
- EMC package laser ablation, drilling and cutting equipment
- IR, Green, UV, CO2, ps and fs laser markers
- WLCSP wafer back side laser marker
- built-in vision alignment systems for laser equipment
- laser lift-off (LLO) equipment for displays
- multi-beam laser solutions for wafer grooving and drilling systems
- wafer laser annealing equipment
- wafer laser grooving, dicing and drilling equipment
- wafer top side and wafer ID laser marker