At a glance
| Booth | L0628 |
| Country | KR |
| Website | www.eotechnics.com |
Company profile
EO Technics Co., Ltd. has devoted more than 30 years to developing lasers and manufacturing laser-application equipment for laser-based industries, serving requirements that span semiconductor front-end and back-end equipment as well as other laser-processing markets. The company records its foundation date as 1st April, 1989 and describes itself as a total laser company active in semiconductor, PCB, display, macro, and laser business areas. Its laser-processing equipment and solutions cover marking, grooving and dicing, cleaning, drilling, cutting, annealing, patterning, welding, soldering, and bonding across the business areas identified by the company. For semiconductor work, EO Technics identifies marking, grooving and dicing, cleaning, drilling, cutting, and annealing, while its PCB activities include drilling, marking, and cutting. Its display business covers FPD, flexible, glass, TSP, and PV applications, and its macro business covers cutting, welding, soldering, bonding, and marking. The company also lists Fiber, DPSS, and DDL within its laser business and states that laser processing enables super-precision processing that traditional processing methods cannot achieve. EO Technics further states that laser processing can address environmental pollution associated with chemicals and that laser technology is being applied more widely to industries such as automobiles and machine parts. Headquartered in Anyang, Korea, EO Technics operates branch offices in Taiwan, China, Singapore, Philippines, Thailand, Malaysia, Japan, India, Vietnam, and USA to provide services to customers worldwide.
Exhibits
For semiconductor production, EO Technics supplies Wafer Laser Annealing, Wafer Grooving, Dicing and Drilling equipment, WLCSP Wafer Back Side Marker, Wafer Top Side Marker including Wafer ID Marker, and EMC Package Ablation, Drilling and Cutting Equipment. Its semiconductor marking range includes strip and tray markers built around SC, SVL, SFL, and SLD series laser technologies, with configurations extending from single-head and single-beam arrangements to multi-head and 4-beam marking. The 4-beam strip marker supports both slot and stack magazines for loading and unloading, can use shuttle or rail handling, and can be configured for loading and unloading patterns such as 1 in 1 out and 2 in 2 out according to customer requests. SC series uses a CO2 laser and an individual vision alignment module for marking materials such as EMC molds, plastics, and PCBs, while horizontal or vertical equipment types can be provided upon request. SVL series uses an end-pumped Nd:YVO4 laser with high peak power and vision alignment for EMC molds, plastics, PCBs, wafer, and metal, and its head configuration ranges from 1 head-1 beam through 2 head-2 beam and 4 beam marking. SFL series uses a fiber laser with an alignment vision module for EMC mold, plastic, metal, and ceramic marking and can be integrated into handlers or in-line systems, while SLD series uses a diode-pumped ND:YAG laser with individual alignment vision. Tray markers can be produced in compact U type form for a small footprint and short tray movement distance or in conventional I type form for larger lasers. CSM3200/3300 is a wafer-level chip-scale backside marking system designed to mark the wafer backside without chip damage, with automated calibration for scanner accuracy and automated inspection of marking results. The CSM combo configuration is applicable to both FFC and bare wafer in one system, while WTM200/300 marks reference die, bad die, and wafer ID on the wafer with high-speed processing and a user-oriented program. WM080/012 is a wafer ID marking system for cleanroom use with high stability, high-speed processing, and an OCR edit function that users can edit themselves. For wafer grooving, LMC3200G removes low-k material and metal pattern layers on the wafer sawlane to improve yield and reduce wafer chipping during blade dicing. For dicing, LMC3200D is specified for thin wafers of less than 200㎛ and uses a non-contact process intended to reduce chipping while enabling high-speed processing. BMC254 is package-cutting equipment for substrates that uses alignment vision, automatic scanner compensation, and flying processing to support accuracy and productivity. BMC204P drills package-on-package structures in strip and wafer formats and combines automatic inspection, scanner compensation, and flying processing. The wafer laser-annealing range addresses Si wafer crystallization, dopant activation, surface melting, and void seam removal, with selectable laser wavelength and optics, real-time process monitoring, customized beam shaping, and high-productivity features. Within that range, LAton provides melting and void-seam removal, crystallization, and dopant activation; LAton-R adds improved energy stability, jitter stability, and pulse-shape uniformity; and LApollon includes the basic and advanced features with 25% higher productivity than LAton-R. Power-device annealing is described for nickel silicide creation for SiC ohmic contact and dopant activation for an IGBT backside, with ULA-200A listed for nickel silicide creation, crystallization, and dopant activation. WD400U/BMDB400UPN is a WLP/PLP laser-debonding system for thin wafers and panels that are highly warped and handled with a carrier, with the stated aim of high productivity and low stress during detachment. EO Technics also supplies laser markers based on Fundamental IR, Green, UV, CO2, ps, and fs lasers with its own built-in vision alignment systems, and applies multi-beam solutions to laser markers, wafer-grooving machines, and laser-drilling systems. In its DPSS range, EV10/EV10G is an end-pumped solid-state laser for general marking, wafer marking, and photovoltaic scribing, using air cooling and a design suitable for handlers and in-line systems. V20/V20G/V30 is a marking device for high-speed marking, engraving, and etching, with the green-marker configuration identified for LED package marking and micro-precision marking. LV100/LV150/LV100G/LV150G is an end-pumped solid-state ns-laser family, with green and UV wavelength variants described for metal and semiconductor cutting and PCB drilling equipment. LEO180n combines fiber and solid-state laser technologies in a hybrid design covering IR, UV, and Green wavelengths, with pulse-control technology and high-repetition-rate operation in the hundreds of kHz. The i200/i400/i1000 diode-pumped solid-state laser family provides 400W to 3200W output at 1064nm and maximum 3 kW peak power, with a robust head and customized control system for OEM equipment and industrial applications. g200/g400 provides high average output power and pulse energy at 532nm, while u40/u80 provides up to 180W at 355nm; both are described with robust-head and customized-control-system approaches for industrial applications. The ESL016/020/050/100 picosecond series offers pulse width below 15ps and 10W to 100W average power across IR and UV wavelengths with a stable beam and pulse-control functions. LEO10f is an optical-fiber femtosecond laser with 10W average power and below 400fs pulse energy for ultra-fine processing, with solutions based on modulating IR, Green, and UV wavelengths. The DDL ED series covers power levels from hundreds of watts to hundreds of kilowatts in a compact format, supports soldering and plastic welding, and allows selection of CW or QCW operation together with air or water cooling. Beyond semiconductor equipment, the supplied range also includes CO2 and UV Laser PCB Via Hole Drillers, PCB Strip and Panel Markers, PCB Cutters, display systems such as Laser Cleaner, Laser Lift-Off, GLA and ULA, Titler and Edge Exposure, ITO Patterning System, Glass Cutter and Glass Marker, plus general welding, cutting, and soldering machines.
Capabilities and products
- wafer laser annealing equipment
- wafer laser grooving equipment
- thin-wafer laser dicing equipment
- wafer laser drilling equipment
- WLCSP wafer backside laser marking equipment
- wafer frontside and ID laser marking equipment
- EMC package laser ablation equipment
- PoP package laser drilling equipment
- package substrate laser cutting equipment
- CO2 and UV laser via drilling equipment for PCBs
- laser marking equipment for PCB strips and panels
- PCB laser cutting equipment
- laser cleaning equipment for displays
- laser lift-off equipment for displays
- GLA and ULA equipment for displays
- edge exposure equipment for displays
- ITO patterning equipment
- glass laser cutting equipment
- glass laser marking equipment
- laser welding equipment
- laser soldering equipment
- multi-beam laser marking equipment for semiconductors
- tray-based laser marking equipment for semiconductors
- diode-pumped solid-state lasers
- picosecond lasers
- femtosecond fiber lasers
- DDL lasers with selectable CW/QCW operation
- laser annealing for SiC ohmic contacts and IGBT backsides
- WLP/PLP laser debonding equipment
- fiber and solid-state hybrid lasers