At a glance
| Booth | I2808 |
| Country | TW |
| Website | www.els-tech.com.tw |
Company profile
ELS System Technology Co., Ltd. was established in April 2005 after Tekstarter Co., LTD., which had represented photo-processing equipment and materials for 15 years, invested in ELS System Technology Co., Ltd. to introduce Japanese technology and integrate local specialists in mechanical design, software, vision processing, electrical control and chemical pipelines in response to equipment-localization trends in Taiwan's semiconductor and optoelectronic industries. The company specializes in front-end fully automated photo-process mass-production equipment and develops equipment around the irreversible characteristics of semiconductor processes. ELS System Technology Co., Ltd. states that domestic equipment manufacturers had neither the ability nor the intention to develop this equipment category and that it advanced the equipment from workable to applicable and useful while adapting to the irreversible characteristics of semiconductor processes. With continuing customer guidance and technical support, 150 specialized colleagues developed lithography track systems according to customer needs. ELS System Technology Co., Ltd. positions itself as a photo-process total-solution provider and has developed Spin Coater, Mask Aligner, Spin Developer, Spin Etcher and Spin Stripper equipment. The company states that it has a high market share in the LED industry and has also served passive components, diode components, advanced packaging, MEMS, 3DIC and other semiconductor-related industries with customized photo-process equipment for different process requirements. Its stated goals are to be a systematic equipment integrator rather than a precision-machinery manufacturer and a service-based company rather than a manufacturing-based company. ELS System Technology Co., Ltd. combines integration capabilities with a continuously evolving workflow and a KM, Knowledge Management, IT system to turn customized equipment into standardized and modular equipment. The company emphasizes reliable equipment, efforts to keep manufacturing costs down, and long-term partnership with customers.
Exhibits
ELS System Technology Co., Ltd. began in the Taiyuan Technology Park in Zhubei, Hsinchu and has built a software-and-hardware technical team over 20 years that integrates mechanical design, electrical-control systems, PC/PLC control, vision processing, automated transport and chemical-pipeline capabilities. Alongside standard machines, the company specializes in customized semiconductor process equipment for customer photolithography and wet-process requirements, drawing on more than 20 years of experience serving those production lines and continuing to refine flow-field design, fluid and temperature control, and process-flexibility planning. Practical understanding of photoresist, acidic and alkaline chemicals and complete processes is used to translate customer requirements into implementable equipment solutions; process modules use PLC control for stability, C++ software supports flexible full-machine automation and high-throughput output, and PLC and PC work together for motion control and safety logic. The company records design, manufacturing, process-parameter, design-change and design-exception histories and uses self-designed ERP and project-management systems. The equipment range covers wafer coating, exposure, development, etching, photoresist stripping, cleaning and mask cleaning, supports wafers from ⌀ 50 mm to ⌀ 300 mm and diverse special-process applications, and can be configured to customer wafer size, process conditions, automation needs and facility-connection requirements. The L01 Spin Coater uniformly coats photoresist on wafer surfaces, supports high-viscosity photoresist and multilayer coating, and is available in fully automatic or semi-automatic models for 50–300 mm wafers. The L02 Mask Aligner is a UV exposure system that precisely aligns masks and wafers for compound-semiconductor, LED and special-wafer applications, with fully automatic or semi-automatic configurations for 50–300 mm wafers. The L03 Spin Developer develops photoresist after exposure while precisely controlling development time and chemical flow to support pattern quality and uniformity, with fully automatic or semi-automatic configurations for 50–300 mm wafers. The L04 Hot Plate is fully automatic wafer-baking equipment with Contact and Proximity heating modes for ⌀ 50 mm to ⌀ 150 mm wafers and an optional maximum baking temperature of 200°C. The L05 Spin Edge Scrubber removes thick-film photoresist and dry-film material from wafer edges as a process before advanced-packaging plating, uses fully automated transport and supports 200 mm and 300 mm wafers.
Capabilities and products
- front-end fully automated photo-process mass-production equipment manufacturing
- custom photolithography and wet-process equipment
- lithography track systems
- spin coaters for high-viscosity and multilayer photoresist
- UV mask aligners
- spin developers
- spin etchers
- spin strippers
- fully automatic wafer hot plates
- wafer edge scrubbers
- wafer and photomask cleaning equipment