At a glance
| Booth | P6200 |
| Country | US |
| Website | www.ekksc.com |
Company profile
EKK Eagle Semicon Components provides engineered solutions for semiconductor customers from concept through production and offers O-ring products and a complete range of semiconductor materials for different temperature- and chemical-resistance levels. Its semiconductor division was established in 2010 as EKK Eagle's sales and engineering division for semiconductor markets outside Japan. The company produces its own monomers for synthetic rubber, controls development from base monomer structure through polymerization to finished O-rings, performs the process from polymerization through finished molded parts in a clean-room environment, and does not require monomers or base resins from third-party vendors. This vertical integration gives EKK Eagle Semicon Components control over rubber development and performance as well as its price structure. Its Superior® elastomer range extends from FKM materials to next-generation plasma-resistant FFKM materials for semiconductor customers. Products are also offered in molded shapes, custom sizes, and Bonded Gates in VAT and Mono gate styles, while the company has a long history as an OPM for several OEMs for welded bellows, magnetic fluid vacuum seals, and rotary joint seals. Superior 486 is a cost-effective, high-performance semiconductor material with excellent plasma resistance and low particulation across a wide range of plasma environments. Superior 495 is a cost-effective, high-performance compound for wet-chemistry applications with excellent acid resistance and low extractables. Superior 485 is a cost-effective, high-performance semiconductor material with excellent plasma resistance and low particulation across a wide range of plasma environments. Superior® 301F is an extremely clean, unfilled perfluoroelastomer FFKM with excellent plasma resistance, minimal particulation, and unrivaled compression set for CVD, Etch, metallization processes and a wide range of industrial applications requiring chemical compatibility. Superior® FC605 is a newly developed high-temperature-resistant FFKM for thermal-process sealing locations up to 300°C with a maximum excursion temperature to 340°C, low outgassing and compression set, and applications including Diffusion, Lamp Anneal, and other industrial uses requiring chemical compatibility.
Exhibits
The Superior® perfluoroelastomer FFKM range includes 486 in white, 495 in black, 485 in black, 301F in violet, FC605 in black, and FC537 in white. Superior 486 is designed as a cost-effective, high-performance semiconductor material with excellent plasma resistance and low particulation in a wide range of plasma environments. Superior 495 is a cost-effective, high-performance compound for wet chemistries with excellent acid resistance and low extractables. Superior 485 is designed as a cost-effective, high-performance semiconductor material with excellent plasma resistance and low particulation in a wide range of plasma environments. Superior® 301F is an extremely clean, unfilled FFKM with excellent plasma resistance, minimal particulation, and unrivaled compression set for CVD, Etch, metallization, and chemically demanding industrial applications. Superior® FC605 is a newly developed high-temperature-resistant FFKM for thermal-process sealing locations up to 300°C and maximum excursion temperature to 340°C, with low outgassing and compression set for Diffusion, Lamp Anneal, and chemically demanding industrial applications. Superior® FC537 is a newly developed white FFKM with low compression set, temperature resistance, long-life design, high plasma resistance, low outgassing, and a maximum excursion temperature up to 260°C for Deposition, Metallization, Dry Etch, Asher, Lamp Anneal, and industrial applications requiring chemical compatibility. The Superior® FKM line uses a proprietary or patented cure system and includes F815, a specifically developed cost-effective, high-performance ultra-clean high-fluorine FKM with temperature resistance to 220°C, plasma resistance and low particulation, and F2815, a specifically developed cost-effective, high-performance ultra-clean unfilled FKM with plasma resistance and low particulation; the broader materials range also lists Silicone VMQ S70, Fluorosilicone FVMQ F70, Hydrogenated Nitrile HNBR, Extreme FKM CV75 in white and black, and Fluoroelastomer FKM V75 in black and white. RFN Treatment® is intended for elastomeric sealing components where high surface energy and coefficient of friction can create stiction, and it can benefit low-stiction, long-service-life applications such as valve seals and diaphragms. The ePTFE gasket material is 100% expanded PTFE with chemical compatibility across pH 0-14, temperature capability from -268 to 260°C, non-stick and dielectric properties, liquid sealing with air and gas permeability, flexibility beyond elastomers, low required compressive load, and tolerance of high compression. Teflon® PFA encapsulation of a Viton™ core provides encapsulated O-rings with chemical resistance, a wide temperature range, durability and low compression set for semiconductor, chemical-processing and industrial applications. The ESF® product line is designed for semiconductor sub-fab applications, uses the Superior® elastomer line to fit specific needs, and offers anodization in multiple colors to distinguish use locations. The magnetic fluid vacuum-seal line is backed by best-in-class material development, product design and manufacturing capabilities and uses high-performance, low-friction rotary seals for semiconductor applications, with magnetic force holding fluid around the shaft so the suspended fluid forms a hermetic liquid barrier to fluids and gases with very low friction and little contamination; the seals are designed for thermal resistance, minimum contamination, durability, and long life. Magnetic fluid vacuum-seal specifications include operation up to 200°C with a flange at 0.1 Pa without cooling systems, ultra-high-vacuum correspondence at 10–9Pa at 23°C, low vapor pressure and gas generation, peripheral velocity up to 1.0 m/sec, thermal resistance, minimum contamination, high-vacuum resistance, and non-burst performance. Applications for the magnetic fluid vacuum seals include LPCVD, APCVD, HDPCVD, PECVD, RPCVD, SACVD, ashing, plasma etch for poly, oxide and metal, PVD metalization, and ion implant; EKK Eagle Semicon Components is the OPM for TEL and HiKE diffusion furnaces, offers refurbishment programs for most models, and provides a High Temperature Fluid option. Precision edge-welded bellows are designed and manufactured at the EBJ Factory in Niigata, Japan and provide durability, flexibility and corrosion resistance across applications and corrosive environments including ultra-high vacuum, high pressure and extreme temperatures. The nested edge-welded bellows use ultra-thin metal-plate welding technology to secure a wide stroke in limited space for compact equipment, can be made almost completely from weldable materials, and are supported by fusion-welding and reverse-engineering capabilities, controlled manufacturing with testing and inspection, full assemblies, materials from stainless steel 316 to titanium, Hastelloy®, Inconel® and other exotics, special surfacing including EP, anodization and nickel plating, and sealing longevity based on corrosion, pressure and heat resistance. Hastelloy® is a registered trademark of Hayes International, Inc., Corp., and Inconel® is a registered trademark of Huntington Alloys Corp. The full line of Bonded Products is fabricated through a unique manufacturing process that bonds seal profiles directly to process-chamber gates; a special seal cross-section provides cushioning without metal-to-metal contact, reduces seal movement and process contamination, and is available in a wide range of compounds. Bonded gates eliminate rolling, twisting and abrasion associated with standard O-ring and groove designs, reduce premature seal failures from pop-out, extend service life and maintenance cycles, increase tool up-time, avoid machining standard or dove-tail O-ring grooves and substrate metal-particle contamination, and eliminate the difficult-installation issue associated with tight-fitting gate O-rings, which can otherwise perform poorly and cause unscheduled maintenance or possible product loss if installed incorrectly.
Capabilities and products
- semiconductor O-ring seals
- plasma-resistant low-particulation FFKM sealing materials
- acid-resistant FFKM sealing materials for wet chemistry
- high-temperature FFKM seals for 300°C thermal processes
- ePTFE gasket material
- PFA-encapsulated Viton O-rings
- semiconductor sub-fab sealing solutions
- magnetic-fluid vacuum seals for semiconductors
- precision edge-welded bellows
- bonded-gate seals for process chambers
- custom-size molded seals
- rotary-joint seals for semiconductors