At a glance
| Booth | R8020 |
| Country | TW |
| Website | www.efd.com.tw |
Company profile
EFD Corporation provides thermal-resistance measurement equipment and services for LED, Logic IC, Diode, MOSFET, and IGBT devices. The company also provides power-cycling testing services for high-power devices. EFD Corporation operates a TAF-certified thermal-characterization laboratory and a TAF-certified power-cycling laboratory. The company serves as a professional agent for FloTHERM, T3Ster, FloTHERM XT, FloEFD, STAR-CCM+, Altair, Simcenter 3D, Flomaster, ROM, HEEDS AI, KeenusDesign, and PADS product lines. Its training services include basic and advanced FloTHERM courses as well as courses for FloTHERM XT, STAR-CCM+, FloEFD, FloVENT, Simcenter 3D, Simcenter HEEDS, and E-Machine Design. The thermal laboratory can measure LED, Logic IC, Diode, MOSFET in discrete or module form, IGBT in discrete or module form, and other powered devices that show a voltage difference. Available measurement results include Rthjc, Rthjb, Rthja, ΔTj, Zth, Structure Function, Pulse Thermal Impedance, and SOA. Using JEDEC JESD 51-14 measurement and analysis, the laboratory can compare thermal resistance through package layers, examine process yield, and compare process variation after packaging-material changes. Laboratory equipment includes T3Ster and T3Ster SI, a Booster with 150V/10A and 11V/240A power supplies, a 0 to 100°C thermostat, a large temperature-controlled cold plate rated for 400 to 500 W, a JEDEC-compliant Still Air Chamber, and KeenusDesign PELNUS temperature-control equipment and fixtures.
Exhibits
EFD Corporation supplies electronic-cooling and thermal-flow analysis software including Simcenter Flotherm, Simcenter FLOEFD, Simcenter Flomaster, and Simcenter STAR-CCM+. Its engineering software portfolio also includes Simcenter HEEDS and HEEDS AI Simulation Predictor for multidisciplinary design optimization, Simcenter HyperMesh for CAE meshing and preprocessing, Simcenter OptiStruct for structural topology optimization, and Simcenter SimSolid for meshless structural analysis. Additional simulation and engineering tools include Simcenter Feko for high-frequency electromagnetic analysis, PBS Professional for high-performance-computing management, PhysicsAI for AI-enabled engineering, Simcenter 3D for multiphysics simulation, Simcenter ROM for model order reduction, Simcenter EDEM for particle and bulk-material simulation, and Simcenter Amesim for 1D multiphysics design analysis. The electronic-design portfolio includes PADS Professional Premium, PADS Standard and Standard Plus, HyperLynx, and Simcenter E-Machine Design for motor design analysis. Semiconductor thermal-resistance measurement equipment includes Simcenter T3Ster SI, T3Ster Booster 240A, and Thermal Quality Tester, while power-device reliability equipment includes Simcenter Power Tester 1500A, 1800A, 2400A, and 3600A systems. The measurement portfolio is supported by customized T3Ster accessories such as PELNUS precision temperature control, measurement platforms, pressure fixtures, and fixtures for small packaged devices, together with Power Tester accessories including standard and no-cold-plate configurations and a Delta Tc accelerated-measurement fixture. Other supporting equipment includes TECNUS precision temperature control, KTC cooling circulation systems, and tools for controlled connector torque. A SiC JFET cascode combines wide-bandgap switching characteristics with the flexibility and durability of a Si MOSFET and can directly replace power devices in conventional systems or be used in next-generation power converters and inverters. Simcenter T3Ster provides thermal-characterization data for semiconductor packages within minutes and measures transient thermal behavior for packaged semiconductors and other electronic equipment, including LED products, ICs, stacked-die devices, system-in-package devices, and other semiconductor components. One IGBT case applies testing to a water-cooled plate used for heat dissipation in a high-power IGBT module, addressing package-reliability concerns associated with demanding operating environments and thermal management. For silicon-based GaN power devices, GaN HEMT uses gallium nitride as the current path and belongs to the wide-bandgap material family together with SiC. The GaN HEMT structure is associated with a high-electron-mobility channel, higher dielectric strength, high-frequency performance, and temperature capability, and its applications include 5G technology, fast charging for 3C products, high-frequency power amplifiers, and high-power-density power systems. The GaN case also notes that packaging still uses Si-device packaging technology, which limits operating-temperature performance, and that current collapse under applied drain voltage VDS can change resistance and therefore alter thermal behavior, making T3Ster thermal characterization important for GaN HEMT evaluation. MicReD Power Tester Series performs automated production-line testing and diagnosis of power-device failure causes, applies tens of thousands to nearly one million power cycles, and records and diagnoses failure-in-progress in real time. The power-cycling application is relevant to consumer and industrial power-electronics systems including aviation, electric vehicles, high-speed rail, generators, and renewable-energy industries. 康舒科技 uses Simcenter Flotherm for power-supply product development and uses T3Ster measurements to obtain more accurate MOSFET model parameters for feedback into Simcenter Flotherm CFD-model calibration. For LED development, T3Ster and TeraLED are used to measure optical and thermal characteristics, addressing the relationship between waste heat, junction temperature, and LED luminous efficiency. The FloEFD LED module can read T3Ster measurement data to build an LED database, accept an input current, and calculate actual LED heat generation and lumen output for thermal design work. A Power MOSFET thermal-resistance case uses MOS-Diode and Rds_on measurement modes, includes K Factor characterization, heats the device above a 120°C temperature rise, records the cooling-temperature change, analyzes overall thermal resistance, evaluates Rthjb with different interface materials, and measures Rthja in a Still Air Chamber. A Schottky-diode case combines FloTHERM thermal-flow simulation with T3Ster thermal-resistance measurement and uses the FloTHERM-T3Ster Auto Calibration module for automatic CFD-model calibration; the diode application also cites operation from 200kHz to 2MHz in switching power supplies. MicReD was originally created by the Institute of Electronics at Budapest University of Technology and Economics and later became a Mentor Graphics department focused on thermal characterization of IC packaging. The MicReD team’s measurement scope includes single and array LEDs, stacked chips, multi-chip packages, high-power semiconductor devices, thermal-interface materials, and complete electronic systems. MicReD products are used in semiconductor, electronics, and LED applications, with named customers including IBM, Infineon, LG, Philips, Siemens, Samsung, Lumileds, Osram, KOPTI in Korea, and ITRI in Taiwan. T3Ster is designed for semiconductor, electronic, LED, and R&D applications and can characterize not only packaged semiconductor devices but also PWB, MCPCB, other substrates, thermal-interface materials, and cooling components. T3Ster applications include reconstructing heat-flow paths, checking die-attach quality, evaluating stacked-chip packages and Power LED characteristics, determining material properties, validating thermal models, performing in-situ nondestructive failure analysis, and supporting reliability tests through power and structure-function analysis. The system directly measures actual heating and cooling curves for semiconductor-package thermal transients instead of constructing the final response from separate responses, with temperature resolution stated at 0.01°C and test accuracy at 1 millisecond. T3Ster supports JEDEC thermal-test standards, real-time thermal-transient measurement, structure-function analysis for rapid detection of die-attach faults in stacked packages, local-language technical support, and test-consulting services. Its scalable hardware and software options cover an approximate test range from 100mW to kW, JEDEC-compliant thermal-resistance and transient characterization, thermostat options for K-factor calibration, thermal-flow-path detail, and a built-in thermal-resistance material database. Available T3Ster accessories include temperature-control devices, double-sided cold plates, multi-channel power-output modules, booster and regulated-power systems, measurement-channel acquisition cards, thermocouple preamplifiers, a MIL-STD 750E measurement interface, a JEDEC natural-convection chamber, and PELNUS temperature control. Thermal Quality Tester was developed by Siemens in 2021 and applies T3Ster transient thermal-resistance measurement technology to monitor the thermal characteristics of products on a production line and support sorting. The system is designed for faster testing and high throughput, with an example showing thermal-characteristic measurement completed in as little as 4ms depending on the monitoring points selected for the product. Thermal Quality Tester uses a touch-panel software interface similar to Power Tester, guiding users through step-by-step setup for different device types. The software can set upper and lower limits for product thermal characteristics so production users can monitor quality and analyze differences between good and bad devices. Beyond the main measurement system, the hardware configuration can be customized for customer needs, including measurement-circuit-board layouts and robotic-arm designs. For current 5G, automotive-electronics, and consumer-electronics applications, the Thermal Quality Tester use case links production quality control with Tj management because device reliability and failure can be strongly affected by temperature.
Capabilities and products
- thermal-resistance measurement equipment and service for LED/IC/Diode/MOSFET/IGBT
- power-cycling testing service for high-power devices
- electronic cooling and thermal-flow analysis software agency
- multidisciplinary design-optimization software agency
- semiconductor thermal-resistance measurement equipment agency
- power-device reliability measurement equipment agency
- EDA electronic-design software agency
- motor-design analysis software agency
- CAE and thermal-flow simulation software training
- JEDEC JESD 51-14 package thermal-resistance analysis