At a glance
| Booth | I2103 |
| Country | MY |
| Website | www.ecosphere.com.my |
Company profile
Ecosphere Clean Global Sdn Bhd is a Malaysian company, Company No. 202501038500, based in Kulim, Kedah, that provides advanced cleaning equipment for the semiconductor and electronics industry. The company develops cleaning solutions for the stringent contamination-control demands of modern manufacturing and describes its equipment as supporting higher yields, improved reliability, and cost efficiency. Its business includes semiconductor cleaning solutions and solder-flux cleaning equipment for the global semiconductor industry. A team of experienced specialists from Taiwan and Southeast Asia brings more than 20 years of technical expertise and process know-how in semiconductor cleaning technologies. In response to changes in the global semiconductor supply chain and demand for advanced packaging, the company states that it has carried out strategic upgrades and expanded its global footprint. Its technology approach integrates eco-friendly, cost-efficient, and advanced technologies with semiconductor processes including CoWoS, 2.5D and 3D packaging, 12-inch fabs, and large silicon-wafer applications. Ecosphere Clean Global Sdn Bhd has established a laboratory and manufacturing center in Malaysia to strengthen its capabilities and support global customers. The company combines the service capabilities of its team with supply-chain advantages from the Malaysia facility to manufacture semiconductor cleaning equipment with an emphasis on performance, reliability, flexibility, and responsiveness. Its service footprint is intended to support key markets across Asia-Pacific, North America, and Europe. The company serves semiconductor, electronics, aerospace, and automotive sectors, including EV and ADAS applications. For aerospace applications, its cleaning systems are used to remove microscopic contaminants from critical components in support of precision and reliability. For semiconductor applications, the company provides FOUP, spray, superfluid, and plasma cleaning systems to maintain ultra-clean manufacturing environments. For automotive applications, including EV and ADAS systems, its cleaning equipment is positioned for electronic and mechanical parts that must meet strict quality requirements. For electronics manufacturing, its solutions address particles, residues, and exhaust gases in cleanroom environments to protect product integrity. The company states core values of innovation, integrity, customer success, and sustainability, including support for eco-friendly manufacturing through efficient and responsible solutions.
Exhibits
The FOUP Cleaning System provides high-performance cleaning for front-opening unified pods to support contamination-free wafer transport. The Vacuum Spray Cleaning System provides targeted high-pressure cleaning with minimal chemical usage and strong particle-removal performance. The Superfluid Cleaning System uses supercritical CO2 technology for ultra-gentle, residue-free cleaning. The Plasma Wet Scrubber combines plasma and wet scrubbing to remove harmful gases and particles from exhaust streams. A CO2 Bubbling Machine is also included among the company's core product lines. The company's cleaning suite is engineered for semiconductor environments with an emphasis on cleanliness and efficiency across FOUP cleaning, vacuum spray cleaning, superfluid cleaning, and plasma wet scrubbing. Across these systems, the company describes particle-free results, minimal chemical usage, and process control as intended performance characteristics of its semiconductor cleaning technologies. The FOUP system addresses wafer-carrier cleanliness during front-opening unified pod transport, directly connecting the cleaning step with contamination control around wafer handling. The vacuum-spray system focuses cleaning energy through targeted high-pressure spray while limiting chemical use and removing particles from the cleaned item. The superfluid system applies supercritical CO2 where an ultra-gentle process and residue-free result are required. The plasma wet scrubber is an exhaust-treatment product rather than a surface-cleaning system, using the combined plasma and wet-scrubbing approach for harmful gas and particle removal. The product portfolio is presented for advanced semiconductor processes that include CoWoS, 2.5D and 3D packaging, 12-inch fabs, and large silicon-wafer applications. Manufacturing and support are backed by the company's Malaysia laboratory and manufacturing center together with service capabilities intended for customers in Asia-Pacific, North America, and Europe.
Capabilities and products
- FOUP cleaning systems
- vacuum high-pressure spray cleaning systems
- supercritical CO2 superfluid cleaning
- plasma wet-scrubbing exhaust treatment
- CO2 Bubbling Machine
- semiconductor solder-flux cleaning equipment