At a glance
| Booth | K3176 |
| Country | TW |
| Website | www.efctw.com |
Company profile
Easy Field Corporation develops automatic inspection technology in response to semiconductor manufacturing processes moving toward nanotechnology and the resulting need for higher inspection resolution. The company links higher inspection-resolution requirements with increased dependence on automatic inspection. To meet market demand, it expands the applications of existing machines and actively develops new technologies in the AOI industry. Easy Field Corporation has developed an automatic inspection machine that combines machine vision and image-processing technology for semiconductor-market requirements. Its inspection approach is fast and non-contact and is used to detect wafer-surface defects. The inspection method can reduce inspection time while improving wafer throughput and yield rate. 易發精機股份有限公司 also develops integrated process equipment for high-technology industries, with fully automated precision production equipment used mainly in optoelectronics, semiconductors, and power batteries. Its equipment-development model combines R&D responsiveness with rapid customer-service support for production-equipment users.
Exhibits
The COF punching machine provides automatic feeding and receiving of material. It supports automatic COF flipping with designated front-side and reverse-side orientation. Output inspection automatically determines whether punching succeeded and whether punching precision exceeds the specified limit. The COF punching machine has external dimensions of 2580 (L) mm * 2190 (W)mm *2154 (H)mm and a weight of 2000KG. For product sizes from 50mm*70mm to 60mm*70mm, the listed T/T is 4.5sec~7sec when paired with a 380mm*380mmTray. For product sizes from 60mm*70mm to 63mm*100mm, the listed T/T is 7sec~8.5sec. Punching precision is X/Y±0.1mm. The maximum punching product size is COF 100mm*63mm, with the external dimensions provided by the mold manufacturer. A barcode reader links to product-production programs and is operated by personnel using a handheld device. The machine supports SECS/GEM communication. A separate PUNCH machine automatically cuts roll-form COF products for feeding or automatic tray arrangement. The PUNCH machine lists material-strip stability of X,Y±0.2mm. It includes a no-material detection system and lists a Tact Time of 6sec/pcs. The product pages also reference a 3-8-inch FOG hot-press machine identified as FG2004 within the panel-industry equipment navigation. Across its equipment scope, fully automated precision production equipment is used in optoelectronics, semiconductor, and power-battery applications, while AOI inspection combines machine vision and image processing for wafer-surface defect detection.
Capabilities and products
- fast non-contact AOI wafer-surface defect inspection
- automatic COF punching equipment
- automatic roll-form COF cutting and tray arrangement
- 3-8-inch FOG hot-press equipment
- SECS/GEM communication for COF punching equipment
- COF punching accuracy X/Y ±0.1 mm