At a glance
| Booth | K3176 |
| Country | TW |
| Product categories | Die Bonding; Attach Equipment · Die Removal Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Wafer Level Bonders · Wafer Mount; Taping Equipment · Lamination; Sheet Laminating Equipment · Repair; Rework Equipment · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Die Inspection; Die Shear · Microscopes: Optical Microscopes |
| Website | www.efctw.com |
Company profile
Since semiconductor manufacturing process has comprehensively moved toward nanotechnology, the resolution of inspection also needs to be enhanced. This increases the dependence on automatic inspection. To meet the market demands, EFC expands the application of current machine, and develops new technologies actively in AOI Industry. EFC has developed the automatic inspection machine which combined machine vision and images processing technology to meet growing needs in Semiconductor market. The fast and non-contact inspection is used for detecting wafer-surface defect. It can dramatically reduce the inspection time and further improve wafer throughput and yield rate.
Capabilities and products
- automatic inspection machine with machine vision and image processing
- automatic optical inspection (AOI)
- non-contact wafer-surface defect inspection
- wafer-surface defect detection