At a glance
| Booth | M1048 |
| Country | TW |
| Website | www.enr.com.tw |
Company profile
E & R Engineering Corporation has provided fine-automation engineering and semiconductor packing materials since 1994. Its work includes customized design and machine manufacturing for semiconductor, SMT, IC substrate, LED, and passive-component production. Packing-material supply is part of the same business scope for these electronics-manufacturing sectors. The company describes its Automation and Electronics business units as operating in dynamic environments with an emphasis on quick response, short delivery, product quality, and service. 鈦昇科技股份有限公司 provides customized, flexible laser and plasma processing solutions that cover IC-level and wafer-level processing. Its laser and plasma equipment business covers both front-end and back-end semiconductor-process requirements and extends from equipment integration through after-sales service. Femtosecond-laser processing is used for high-precision cutting and grooving where reduced heat effects and improved cutting quality are required. The company invests 6% of annual net profit in R&D and states that it intends to maintain or exceed that proportion. Current advanced-packaging development includes TGV and TSV solutions for 3D/2.5D packaging with a target of ±1 micrometer precision. Development work also includes advanced laser and plasma solutions for third-generation materials such as SiC and GaN. Professional service teams are established in Asia, Europe, and the United States, with locally hired service engineers supporting communication between customers and R&D teams. The company also works with customers on joint development throughout equipment use. Its sustainability activities include solar-panel installation, continued implementation of a 2024 energy-saving and carbon-reduction plan, community activities, and cooperation with universities on employment and internship opportunities. The broader product organization includes laser solutions, plasma technology, laboratory testing equipment, FPC equipment, and tape and reel.
Exhibits
Laser marking is supported by more than twenty years of experience across different products and materials, with complete solutions provided to customers. Wafer-level laser processing includes laser cutting for different materials and applications. The same wafer-level processing scope includes laser drilling. Laser grooving is also included in the wafer-level laser-processing solutions. The laser-solutions portfolio groups laser marking and laser processing, with the marking category again emphasizing more than twenty years of experience across different products and materials. The laser-processing category provides wafer-level cutting, drilling, and grooving solutions for different materials and applications. High-end inspection instruments are offered for stress and material-ratio analysis in high-precision advanced processes. The laser-processing page lists Wafer & Frame Form as one application group. It also lists L/F – Substrate and other laser-processing applications. Advanced laser offerings include professional laser marking, while plasma offerings include plasma etching technology with products and services adjusted to customer requirements. Together with custom machine design and manufacturing, the company’s semiconductor support scope also includes packing-material supply for production environments.
Capabilities and products
- custom semiconductor machine design and manufacturing
- semiconductor packing-material supply
- multi-material laser marking
- wafer-level laser cutting
- wafer-level laser drilling
- wafer-level laser grooving
- advanced-process stress and material-ratio analysis
- femtosecond-laser high-precision cutting and grooving
- laser and plasma processing solutions for SiC/GaN
- laser and plasma equipment integration and after-sales service