At a glance
| Booth | R8118 |
| Country | TW |
| Website | www.thinklaserusa.com |
Company profile
DYT Taiwan Pte., Ltd. is a Taiwan-registered company with business categories covering machinery and equipment manufacturing, computer and peripheral-equipment manufacturing, electronic-components manufacturing, precision-instrument wholesale, electronic-materials wholesale, international trade and repair. These registered activities position the company across machinery, electronics and precision-instrument supply for industrial and electronics-manufacturing chains. Its listed offering includes ThinkLaser wafer-marking laser solutions, a fully automated soft and deep wafer-marking system made in the USA, and debris-free laser wafer marking.
Exhibits
The SC300 provides debris-free soft marking of 300 mm wafers for identification and traceability using proprietary SuperSoftMark® technology and a patented diode-pumped laser, with Class 1 cleanroom compatibility for high-volume production. The system combines a high-performance laser with system-level closed-loop control and automated data logging, with laser-performance data logged to SPC levels of mark quality. WaferMark® systems comply with SEMI wafer-marking standards T7, M12 and M13, and the SC300 can place multiple mark groups at any orientation within a 25 mm band around the wafer circumference. Marking mode is Dot Matrix Softmark in straight-line or arc formats; the SuperSoftMark® Process is listed at 0.02 particles/cm and 0.17 particle size measured over a 5 mm area, with dot diameter 50-70 μm +/- 10%, dot roundness <1.1 major-to-minor axis ratio and dot depth 2.4 μm +/- 0.4 μm. Throughput is 125-180 wph for single-pulse 5x9 dot-matrix 12-character marking, with optional edge-handling throughput of 70-110 wph under the same marking format, on polished, non-coated pure Si wafers. Utility requirements include 200-240 VAC single phase at 50/60 Hz and 23 FLA, process vacuum of 20 Hg to 25 Hg through a 3/8 in press-lock connection, mark-point exhaust up to 20 CFM (560 I/min) through a 2 in (50.8 mm) port, static charge up to 197 V/cm (550 V/in), and air-cooled operation at 12.8 to 27 °C (55-80 °F). System dimensions are 78 in x 64.6 in x 47.4 in [HxWxD] or 1981.2 mm x 1641 mm x 1204 mm, with EFEM weight of 1480 lb (671 kg) and mark-enclosure weight of 1145 lbs (519 kg). Standard marking fonts and functions include 9x17 Single-Density Dot Matrix, 10x18 Double Density Dot Matrix, 5x9 SEMI Single Density Dot Matrix, T1 SEMI Specs BC-412 Bar Code, T7 2D Data Matrix, user-selectable checksum and custom fonts. Marking capacity is 80 char/group max with a 50x50 mm mark field after wafer alignment, mark location within a 25 mm circumference band, repeatability of +/- 75 μm in X and Y relative to the primary fiducial, and SEMI M12/M13 character formation. The stainless-steel enclosure is ISO Class 5 clean-room compatible with an ISO Class 2 mini-environment; wafer handling supports 300 mm wafers with optional 200 mm bridge capability, optical high-resolution alignment, a pick-and-place robot arm with a single end effector and two 300 mm cassette ports. The PC configuration lists an Intel-Core CPU, Windows 10 32/64 Bit, DDR3 ECC memory, PCI, PCIe x1 and PCIe x16 slots, 10/100/1000 T LAN ports, USB 3.0 and USB 2.0 ports, RS232 ports with adapter plates, Intel 2.5 in solid-state drives, a two-drawer carrier for 2.5 in drives and a DVD/DL drive. The laser is an acousto-optic Q-switched TEM00Nd: YLF diode-pumped type at 1053 nm with pulse stability <0.5% at 1 khz, a flat-field focusing lens, 50 μm, 60 μm or 70 μm spot size and 2.4 μm to 5.0 μm depth. Controls include a keyboard and flat-panel display, menu-driven software, multiple job-file storage, fault and error logging, diagnostic indicators on the front panel and electronic console, a SECS II/GEM interface and a four-color programmable signal tower; certification listings include CE Mark and SEMI S2, S8 and S14.
Capabilities and products
- fully automated debris-free soft/deep wafer laser marking system supply (ThinkLaser)