At a glance
| Booth | M0748 |
| Country | TW |
| Product categories | Backgrind; Slicing; Lapping; Polishing Equipment · Dicing; Sawing; Scribing; Separation Equipment · Cutting; Drilling; Laser ablation; Beveling Equipment |
| Website | www.disco.co.jp |
Company profile
DISCO is a team of professionals specializing in advanced Kiru, Kezuru, Migaku (Dicing, Grinding, Polishing) technologies. We see our specific role in society as bringing greater convenience, comfort, enjoyment and safety into people's lives through these technologies. Take semiconductors, electronic components, optical devices and micro-electro-mechanical systems (MEMS), for example. As these products become more integrated and offer higher performance, the need for more precise cutting, grinding and polishing of the silicon, glass, ceramics and other materials that go into them increases. Irrespective of the material, the degree of precision required and the difficulties involved, DISCO takes up every challenge to realize more advanced Kiru, Kezuru, Migaku solutions so as to meet these needs.
Capabilities and products
- backgrind, slicing, lapping and polishing equipment
- cutting, drilling, laser ablation and beveling equipment
- dicing technologies
- dicing, sawing, scribing and separation equipment
- grinding technologies
- polishing technologies
- precision cutting of silicon, glass and ceramics
Related product topics
- Polishing Equipment
- Lapping and Polishing Equipment
- Laser Cutting, Drilling & Ablation
- Dicing Sawing and Scribing Equipment
- Grinding, Dicing & Polishing Equipment
- Dicing, Sawing And Scribing Equipment
- Backgrind, Slicing, Lapping and Polishing Equipment
- Wafer Grinding & Slicing Equipment
- Backgrind, Slice, Lap and Polish Equipment
- SiC and Sapphire Wafer Grinding