At a glance
| Booth | Q5537 |
| Country | TW |
| Website | www.dcint.com.tw |
Company profile
Ding Cheng International Co., Ltd was founded in 2007 and describes more than a decade of work as a partner to foundries and research institutes in the global semiconductor industry. The company specializes in wet-process engineering and provides solutions ranging from spare parts to turnkey work for single-wafer process tools, with its earlier description also covering wet-station tools. By working with customers and understanding process requirements, Ding Cheng has developed patented add-on systems that can be applied to multiple tools for yield improvement or throughput enhancement. The company identifies Innovation and Quality as core values and links product and system development to close relationships with customers and partners. Its patent portfolio lists 11 patented technologies spanning motor monitoring, wet-processing chucks, wet etching, annular liquid collection, filtering, wafer detection and cleaning, wet-processing apparatus and methods, and wafer gripping. The listed patents include MOTOR MONITORING DEVICE M533739, CHUCK APPARATUS FOR WET PROCESSING PLATE-LIKE ARTICLE M540380, WET ETCHING DEVICE M541638, ANNULAR LIQUID COLLECTING DEVICE 1584368 and FILTERING APPARATUS M542508. Additional entries include WAFER DETECTING DEVICE AND WAFER CLEANING APPARATUS M558464, WAFER CLEANING APPARATUS M579375, FILTERING APPARATUS M586632 and 1687258, WET PROCESSING APPARATUS AND WET PROCESSING METHOD 1776399, and WAFER GRIPPING DEVICE M638400. Ding Cheng also lists ISO 9001:2015 as a current certificate.
Exhibits
Ding Cheng's supplied wet-process scope includes single-wafer process equipment, chemical-delivery systems, smart upgrades and monitoring, refurbished equipment, turnkey and labor services, and client-site construction-safety support. Ding Cheng organizes equipment, chemical delivery, smart upgrades, refurbished equipment and services as five layers of a single wet-process engineering capability that can be approached from either the product side or the process-condition side. T21 was created from customer feedback as a spin-process tool for etch and clean applications with an improved control unit and defect-defense system, and the company states that T21 is SEMI-approved. The Standard series is described as wafer-transfer equipment that automates front-end loading and unloading for 8-inch and 12-inch wafers. Ding Cheng also describes a 12-inch wet-etching single-wafer four-chamber process tool for etching and cleaning in semiconductor wafer fabrication. Its used-equipment capability includes reconfiguration and refurbishment of 200mm and 300mm wet-process core tools to customer-specific process requirements, with patented add-on systems available for integration on request. Equipment-relocation service is also listed as part of the company's wet-process support scope. The current single-wafer mainframe family includes T34 DS for 300 mm wet processing, T34 F for 300 mm thin-wafer tapeless processing, S312 for 300 mm dry cleaning and T21 DS for 150/200 mm wet processing. T34 DS uses the Mercurious platform for 300 mm wafers and supports both front-side and back-side processing with Twin Fluid Soft Spray and Ultrasonic spray modules. T34 DS lists unlimited spray-profile setup points, spray range up to 110%, one or two chemical sprays and optional modules including MTC high-precision chemical temperature control, SIS, DEB de-bubbling piping design, SBS suck-back and smart dosing or mixing design. Its listed T34 DS applications include byproduct removal, particle removal, wet etching and Ti/Cu processes. T34 F is a Mercurious-platform tool for 300 mm thin wafers in a tapeless configuration, using Bernoulli Handling for front-side processing with Twin Fluid Soft Spray. T34 F also lists unlimited spray-profile setup points, spray range up to 110% and one or two chemical sprays. S312 is a Mercurious-platform 300 mm high-throughput dry-clean system for front-side processing using CO2 Snow Flake Spray, with unlimited spray-profile setup points and spray range up to 110%. T21 DS operates on the Venus platform for 150/200 mm wafers, supports front-side and back-side wet processing, provides unlimited spray-profile setup points and spray range up to 110%, and lists one to three chemical sprays with Twin Fluid Soft Spray and Ultrasonic modules. Standard 1 is an EFEM configuration with 1-4 loadports, TDK/ASYST load ports and TCP/IP or EtherCAT user interfaces. Across the broader product map, the Mercurious 300 mm and T21 DS process platforms are paired with EFEM, chemical delivery and Local Pump Cart configurations as parts of the wet-process engineering stack. The process guide organizes applications around byproduct removal, particle removal and wet etching, including metal Ti/Cu, non-metal Si and organic Polymer residue conditions. Wafer-thickness categories include thin 50-280 μm front-side processing, standard 280-800 μm front- or back-side processing and thick wafers above 800 μm for front- or back-side processing. Process-temperature ranges are listed at 25-70 °C for normal and high temperature and 70-120 °C for ultra-high-temperature operation. Substrate geometry options include round wafers at 150, 200 and 300 mm, square substrates at 120×120 mm and rectangular substrates at 84×109 mm. For applications not suited to liquid cleaning, the product guide identifies CO₂ snow-flake sublimation for dry particle removal and states that the method avoids liquid-flow impact on product circuitry while being presented with ESG considerations. Chemical-delivery products include Standard CDS, Type S, Type C and LPC, with local chemical supply for mixing and temperature-control requirements. Type S Standard CDS and Type C Compact CDS both use Maglev plus Bellows process pumps, Diaphragm drain pumps and Inline Heater plus HEX temperature control; their listed tank volumes are 80 L and 50 L respectively. Type S also lists STD/Smart Dosing function, while local chemical supply can accept one or two chemicals from barrels or FAC supply and provide mixing and pre-heating functions. The smart-upgrade programme identifies MTC for high-precision chemical temperature control, WTG for wafer-temperature-gradient management, IPC for replacing an EOS control system, and SIS for signal integration. Other upgrade functions include changing plumbing and chamber materials to chemically resistant materials for new chemicals, DEB in-line bubble removal, SBS suckback, smart dosing or mixing design, and Cyber-Physical System (CPS) with Digital Twin. The system-upgrade environment also includes a T34 Digital Twin interface together with MTC, WTG, SIS and CPS modules. Refurbished models include SEZ 323 and SEZ DV34; public specifications are not provided for these models, and current availability should be confirmed for each unit. Contract services cover Turnkey & Labor Service for LAM, TEL and DNS Series, along with Upgrade, Overhaul and Relocation work. For undertaking assessment, Ding Cheng asks for system model, wafer size, site space and schedule as project inputs, and the service scope includes turnkey undertaking, on-site labor and on-site construction-safety support. Construction-safety support is listed for Class A Occupational Safety & Health, Class C Occupational Safety & Health, specified chemical-substance operations and organic-solvent operations.
Capabilities and products
- 150/200/300mm single-wafer wet-process equipment for front and back sides
- Tapeless Bernoulli handling of 300mm thin wafers
- CO₂ snow dry wafer-cleaning equipment
- Automated EFEM loading and unloading for 8/12-inch wafers
- Wafer wet-etching equipment
- Wafer process-byproduct and particle cleaning equipment
- Twin-fluid soft-spray modules
- Ultrasonic wafer-cleaning modules
- Chemical delivery systems (CDS)
- Local chemical mixing and preheated delivery equipment
- High-precision chemical temperature control
- Wafer temperature-gradient management
- Chemical piping debubbling design
- Chemical suck-back anti-drip systems
- Smart acid dosing and mixing system design
- Signal integration systems for wet-process equipment
- IPC and motion-control system upgrades for wet-process equipment
- Chemically resistant piping and chamber material replacement for wet-process conversion
- CPS and digital twins for wet-process equipment
- Refurbishment and reconfiguration of used 200/300mm wet-process equipment
- Equipment turnkey and on-site labor services (LAM/TEL/DNS)
- Wet-process equipment overhauls
- Wet-process equipment relocation
- Customer-site construction safety support
- Spare parts supply for single-wafer and wet-station equipment