At a glance
| Booth | S7238 |
| Country | TW |
| Website | www.detekt.com.tw |
Company profile
DETEKT Technology Inc. was founded in 2003 and specializes in 3D printing and medical-manufacturing technologies, developing highly customized solutions that integrate medical imaging, digital modeling, and advanced medical-material manufacturing. Its precision-medicine workflow is a one-stop integrated solution from preoperative planning and surgical-guide design through implant delivery for clinical teams. The surgical scope explicitly covers craniofacial areas including Midface, Mandible, Neuro, and TMJ and uses 3D-printing-assisted navigation, surgical guides, autologous-bone reconstruction, and PEEK and titanium-alloy implant manufacturing. The company describes this medical activity as the basis for a precision surgical support platform that brings together design, material processing, and manufacturing for customized clinical requirements. In parallel with precision medicine, DETEKT Technology Inc. is developing semiconductor printed-electronics packaging technology with 10μm-level electronic fine-line printing capability for high-density advanced-packaging needs. The stated semiconductor applications include RDL, Via, 3D Interconnect, µRepair, and µRe-work, linking direct-deposition and printed-electronics processes with advanced packaging and repair or rework requirements. Its self-developed multi-axis printing equipment has been applied to precision processes for mobile antennas, sensors, conductive circuits, panels, and wafer-level packaging. Services include development and contract manufacturing of micron-level printed-electronics processes, metal and non-metal functional inks and specialized consumables, and the design, manufacturing, and sales of semiconductor printing machines. The company continues to advance direct-deposition technology against advanced-packaging requirements for speed, resolution, and heterogeneous integration, combining its precision-manufacturing experience with semiconductor process development. DETEKT Technology Inc. states an operating philosophy of integrated innovation and precise manufacturing and continues advancing direct-deposition technology to meet advanced-packaging demands for speed, resolution, and heterogeneous integration.
Exhibits
For semiconductor and high-end manufacturing applications, DETEKT Technology Inc. presents capabilities in advanced packaging, materials and process integration, thermocompression and pressure processes, precision deposition, micro-nano manufacturing, optical components, and repair and rework. These capabilities are intended to address high-density interconnects, heterogeneous integration, material reliability, yield improvement, and introduction of special processes as AI, high-performance computing, Chiplet architectures, and advanced packaging develop. The company's high-precision manufacturing and specialty-process equipment experience is combined with cross-domain technology integration so materials engineering, process integration, equipment, and manufacturing applications can be developed together. Its semiconductor printed-electronics offering includes 10μm-class fine-line printing for RDL, Via, and 3D Interconnect and also includes µRepair and µRe-work for localized repair or rework requirements. The self-developed multi-axis printing platform is used not only for wafer-level packaging but also for mobile antennas, sensors, conductive circuits, and panels, demonstrating the same printing architecture across multiple precision-process applications. Micron-level printed-electronics process development and contract manufacturing are offered alongside functional inks, specialized consumables, and semiconductor printing-machine design and manufacturing, allowing process, material, and equipment work to be supplied together. DETEKT Technology Inc. also carries forward its experience in medical imaging integration, preoperative planning, surgical-guide design, PEEK implant manufacturing, and titanium-alloy implant manufacturing as a foundation in precision design, materials processing, and system integration for semiconductor and high-end manufacturing work. The combined portfolio therefore links medical-grade customized manufacturing experience with semiconductor advanced-packaging and direct-deposition technologies rather than treating the two development tracks as unrelated capabilities.
Capabilities and products
- advanced packaging process integration
- thermocompression and pressure processing
- precision deposition
- micro/nano manufacturing
- optical components and repair/rework
- 10μm-level electronic fine-line printing
- micron-level printed-electronics process development and contract manufacturing
- metal/non-metal functional inks and specialized consumables
- semiconductor printing-machine design, manufacturing and sales
- medical imaging integration and digital modeling
- surgical guide design
- PEEK and titanium-alloy implant manufacturing