At a glance
| Booth | P5600 |
| Country | JP |
| Website | www.daihen.co.jp/en/products/cleanrobot |
Company profile
DAIHEN Corporation was established on December 1, 1919 and today manufactures, sells, and services power equipment, welding machines, industrial robots, RF generators for semiconductor manufacturing, EV charging systems, and other products across multiple industrial fields. The company lists an Osaka head office and a Tokyo head office, operates under a dual-head-office system established in 2024, reports paid-in capital of ¥10,596 million, net sales of ¥237,735 million for fiscal 2026 on a consolidated basis, and 4,542 employees as of March 2026 on a consolidated basis. DAIHEN Corporation began in 1919 as Osaka Transformer Co., Ltd. with specialized production of pole-mounted transformers, moved its main plant to its current Osaka location in 1930, and began producing electric welding machines in 1934, establishing power and welding businesses early in its history. The company expanded its manufacturing and corporate base through subsequent plants and subsidiaries, began selling arc-welding robots in 1980, and in December 1985 changed its name from Osaka Transformer Co., Ltd. to DAIHEN Corporation while establishing the corporate philosophy of Reliability and Creativity. In February 1986, DAIHEN Corporation began producing radio-frequency generators for semiconductor manufacturing equipment, and in November 1987 it received the Deming Execution Prize, adding a semiconductor power-technology milestone and a named quality-related award to its history. In 1989 the company began producing semiconductor wafer-transfer robots, and in 1996 it established DAIHEN Advanced Component, Inc. in the United States as a sales company for semiconductor-manufacturing-related equipment, extending its semiconductor equipment activity into an overseas sales base. DAIHEN Corporation later established DAIHEN Korea Co., Ltd. in 2002 as a semiconductor-equipment business base in Korea, established a manufacturing, sales, and after-service company for flat-panel-display transfer robots in China in 2009, and acquired the MECS wafer-transfer-robot business in 2010. The company continued expanding through wireless-power-transfer sales beginning in 2016 and through acquisitions of robot-system integrators in Germany, the Netherlands, and the United States between 2019 and 2024, while also acquiring a German welding-equipment manufacturer in 2024. In 2023, DAIHEN Corporation changed its reporting segments to Energy Management, Factory Automation, and Material Processing, and in 2024 it added a Tokyo head office and shifted to a dual-head-office system, reflecting later-stage changes in both business organization and management structure. For semiconductor and flat-panel manufacturing, DAIHEN Corporation provides sales and service of RF and microwave power supplies together with material-handling equipment, combining plasma-related power technology with clean transfer systems used around manufacturing tools.
Exhibits
DAIHEN Corporation's clean transfer robots handle semiconductor wafers and flat-panel displays in dust-free production environments, using high-speed and high-precision motion to support factory productivity, while its high-frequency power lineup provides multiple frequencies and output ranges for stable plasma used in fine semiconductor-device processing. The clean-transfer portfolio includes wafer-transfer robots, wafer aligners, FPD-transfer robots, vacuum-environment wafer-transfer robots, and atmospheric-environment wafer-transfer robots, with multiple robot families specified for wafers up to 300 mm. The ACTRANS UT-VSW3000NS series is a double-handled vacuum robot with a SCARA arm for wafers up to 300 mm, designed to save space in vacuum-transfer areas and to fit rectangular transfer modules. The UT-VSW3000NS series supports double-hand mounting for high-speed wafer exchange, uses a direct-drive motor to reduce vibration during arm operation, and uses steel belts on the arms to improve trajectory and positioning accuracy. Vacuum bulkhead seals are used instead of magnetic fluidic seals on the UT-VSW3000NS series to enable ultra-high vacuum and low outgassing, adding a vacuum-environment design feature to the robot's space-saving and positioning functions. UT-VSW3001NS and UT-VSW3002NS are listed as 5-axis SCARA models with friction wafer gripping, W2, W1, and B-axis ranges of 20 to 340°, an endless A-axis, Z-axis travel of 50 mm or 135 mm, and XYZ repeatability of P-P 0.05 mm each under the stated evaluation conditions. The UT-VSW3000NS specifications also list a 1.0 kg payload including hand and wafer, ISO Class 1 cleanliness, approximate masses of 260 kg and 285 kg depending on model, and an operating environment of 5-40°C for the robot body, 5-80°C for the arm, 20-70% humidity without condensation, and pressure down to 10-6 Pa. The ACTRANS UT-VDX3000NS series is a single-arm high-precision vacuum robot for wafers up to 300 mm; its direct-drive motor reduces vibration, its can-type vacuum seal supports ultra-high-vacuum operation, its endless θ-axis supports throughput, and it includes a built-in controller and wafer-center misalignment correction. UT-VDX3000NS is listed as a 2-axis cylindrical-coordinate robot with an 850 mm X-axis range, endless θ-axis, X-axis cycle time of 2.0 sec/850 mm, θ-axis cycle time of 2.5 sec/180°, XY repeatability of φ0.02 mm (3σ), 1.0 kg payload, ISO Class 1 cleanliness, 29 kg mass, and pressure down to 10-7 Pa. The ACTRANS UT-VDW3000HS series is a high-speed, low-vibration double-arm vacuum robot for wafers up to 300 mm and is specified for 650 WPH ultra-high-speed transfer in vacuum to improve equipment throughput. The UT-VDW3000HS uses direct-drive motors, a steel belt for arm trajectory and positioning accuracy, high-friction pads to prevent wafer slip, and wafer-center misalignment correction; its listed specifications include a 2 kg payload, ISO Class 1 cleanliness, 160 kg mass, and XYZ repeatability of ±0.1 mm each (3σ). UTVW-R2800H is a high-precision, low-vibration double-arm vacuum robot for high-temperature processes and wafers up to 300 mm; it uses a direct-drive motor on the θ-axis, supports low-vibration wafer transport for improved device throughput, and includes wafer-center misalignment correction. The UTVW-R2800H specifications include a 2.5 kg payload, ISO Class 3 (ISO-14644) cleanliness, 85 kg mass, temperature limits of 15-40°C on the atmospheric side and 15-80°C at the vacuum seal unit, and pressure down to 10-6 Pa. The ACTRANS UT-VFX3000NM series is a single-arm vacuum robot for wafers up to 300 mm with selectable arm length and selectable Z-axis presence, using standard and long-arm variants to support different equipment layouts. UT-VFX3000NM and UT-VFX3010NM list X-axis reaches of 510 mm and 720 mm, respective maximum X-axis speeds of 948 mm/sec. and 1339 mm/sec., θ-axis range of 340°, XYZ repeatability of ±0.1 mm each, 0.7 kg payload including the end effector, ISO Class 1 cleanliness, and pressure down to 10-6 Pa. For atmospheric transfer, the ACTRANS UT-AXW3000NS series is a vertically articulated SCARA-arm robot for wafers up to 300 mm that reduces transfer space in EFEMs, supports vacuum-chuck or pneumatic edge-clamp gripping, and provides access to 3 to 5 ports over a wide vertical and horizontal range. UT-AXW3000NS and UT-AXW3001NS are listed as 6-axis vertical-articulated robots with X travel of 550 mm, Y travel of 2200 mm or 2700 mm, Z travel of 1186 mm or 1436 mm, maximum X, Y, and Z speeds of 1500 mm/sec., XYZ repeatability of ±0.05 mm each, 1.0 kg payload, and ISO Class 1 cleanliness. The ACTRANS UT-AFX/W3000NM atmospheric robot family is a standard model for wafers up to 300 mm with power-line communication technology and available options; UT-AFX3000NM and UT-AFW3000NM are listed as 3-axis and 4-axis cylindrical-coordinate robots with 500 mm X travel and Z travel of 300 mm or 450 mm. The UT-AFX/W3000NM specifications include X-axis speed of 1000 mm/sec., θ-axis speed of 200°/sec., Z-axis speed of 250 mm/sec., XYZ repeatability of ±0.1 mm each, 1.0 kg/arm payload including the end effector, ISO Class 1 cleanliness, and single-phase 200-230±10% VAC, 50/60Hz, 5A power. The broader clean-robot lineup also lists ACTRANS UTM-R3700F for wafers up to 300 mm as an articulated robot with extensive movement, ACTRANS UT-AFX/W4000 as a high-payload model, ACTRANS UTW-REH5500 as a 450 WPH high-speed transfer robot, and ACTRANS UTX/W-RF5500RW as an IP64 waterproof model. DAIHEN Corporation also provides consultation before purchase and repair, inspection, and overhaul after purchase for clean transfer robots, and it maintains overseas locations that handle these robots, extending the product lineup with lifecycle support and an international service structure. For plasma applications, DAIHEN Corporation develops RF and microwave power generators and automatic matching units using years of power-electronics expertise and its Fine Plasma Technology to support repeatability, stability, and sophisticated plasma control in semiconductor and flat-panel processes. The AVANCER brand is described as a highly reliable RF power-generator family for next-generation semiconductor manufacturing processes, with functions that include pulsed RF output and power saving as semiconductor devices continue toward smaller dimensions and greater functionality. DAIHEN Corporation frames its Fine Plasma concept around stable and uniform plasma together with device-friendly operation, responding to high-density plasma processes that require repeatability, stability, and advanced plasma control. An in-house plasma evaluation chamber is used to develop fundamental technologies such as pulsed output and frequency tuning, evaluate standalone product performance, and improve product functions under actual plasma conditions. The company also evaluates entire RF power systems for multi-frequency applications and develops high-frequency systems for advanced plasma processes, moving evaluation beyond individual generators to system-level plasma operation. By conducting plasma evaluation before supplying evaluation machines to customers, DAIHEN Corporation aims to reduce the evaluation period required on customer equipment and uses operation and reliability verification under plasma load to build high-frequency circuit-design and control know-how optimized for plasma processes.
Capabilities and products
- sales and service of semiconductor RF power supplies
- sales and service of semiconductor microwave power supplies
- RF/MW generators and automatic matching units for plasma
- vacuum wafer-transfer robots for wafers up to 300mm
- atmospheric wafer-transfer robots for wafers up to 300mm
- wafer aligners
- FPD transfer robots