Creative Technology Corporation

Exhibitor at SEMICON Taiwan 2026 · Booth I2616

Booth I2616Country TW16 product topics
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BoothI2616
CountryTW
Websitewww.creativetw.com.tw
Exhibitor profile

Company profile

Creative Technology Corporation lists semiconductor-equipment development, design, manufacturing, and sales together with material processing, surface treatment, bonding, and evaluation or testing services as its main service scope. Its customer group includes major semiconductor manufacturers worldwide, and its sold products include electrostatic chucks and refurbishment, semiconductor consumables, and parts such as Focus Ring, Baffle Plate, and Upper Electrode. The company lists capital of 3000万円, 2020 sales of 35億日圓, and 134 employees. Its management philosophy emphasizes developing employee expertise, understanding customer needs closely, and continuously providing products that satisfy customers while valuing customer gratitude and trust. Creative Technology Corporation describes its research and development approach as bringing multiple technologies together and using creative ideas to produce practical new products. Company milestones include beginning mass production of semiconductor-equipment ESC and ion-implantation equipment parts in 1995 after starting joint Micro Machining research with the University of Tokyo's Institute of Industrial Science. The history records development of a high-speed temperature-control ESC in 1996, a Poly ESC in 1998, and a 12-inch ESC in 1999. In 2000 the company changed its name to Creative Technology and established the Kyushu sales office, followed by establishment of the Miyazaki factory in 2001. Further milestones include successful G6-ODF Polyimide ESC development in 2002, the start of thermal-spray product sales and introduction of Plasma Etching equipment in 2003, and ISO9001 quality-management certification in 2004. In 2006 the history lists establishment of the wholly owned Korean PMT company, successful development of a G8-ODF Polyimide ESC, ISO14001 environmental-management certification, and the start of direct sales of original Nissin ion-implantation parts. A Taiwan office was established in 2008, and in 2010 the Taiwan branch was reorganised as a subsidiary. The company history also lists a Singapore office and launch of an ESC power controller in 2013, establishment of CREATIVE TRADING and launch of an insert-type capacitance Sensor in 2014, and registration of the ataraina consumer-goods trademark in 2016. In 2020 the history lists establishment of an Iwate office in northeastern Japan and a company-logo change, followed by establishment of a Europe office in 2021. The operating network includes the Kawasaki R&D Center, Miyazaki and Shiga factories, the Chubu branch, Kitakami and Kumamoto sales offices, CREATIVE TRADING in Japan, the Taiwan subsidiary, Creative Technology Shanghai Co., Ltd., Creative Technology USA, Inc., Creative Tech Asia Pacific Pte Ltd, and CTK Corporation in Korea. The Kawasaki R&D Center, Miyazaki factory, Shiga factory, and Chubu branch are identified as holding ISO9001 and ISO14001 certifications.

Exhibitor profile

Exhibits

Creative Technology Corporation provides new electrostatic chucks and refurbishment services for semiconductor equipment, including products for TEL, AMAT, and LAM platforms. Its electrostatic-chuck work covers 6-inch, 8-inch, and 12-inch sizes using polyimide film (PI), anodized, and ceramic thermal-spray materials, with both manufacturing and refurbishment available. For 150 mm equipment, the listed service catalogue includes 150mm AMAT MXP+ ESC, 150mm MxP Poly, 150mm Centura ESC, 150mm DPS ESC, 150mm Lam 9600 ESC, and 150mm Lam 4720 ESC. For 200 mm equipment, listed products include AMAT MXP+ ESC / STI Nitride ESC, AMAT DPS ESC, AMAT E-Max ESC, AMAT MXP GEN 2 ESC, AMAT STI MXP Poly ESC, AMAT Super E ESC, LAM9400 ESC, and Lam Exelan ESC. The 200 mm catalogue also lists Electrode Upper P-1 (DRM2), TEL 85DP ESC, TEL 85DD (PI) ESC, TEL 85DD (Ce) ESC, TEL SCCM Focus Si Ring, 3FB0229G-4, Shibaura CDE ESC, Novellus HDP ESC, and related new or refurbishment items. For 300 mm equipment, the catalogue includes LAM 608, LAM 611, LAM 374, LAM 577, TEL Long life ESC, TEL SCCM BSP ESC, TEL SCCM SE+ ESC, TEL DRM ESC, TEL SCCM SE ESC, TEL Vigus ATCC ESC, and TEL Vigus NX ESC. Additional 300 mm items include AMAT E-Max ESC, AMAT HDP ESC, 3FB0229G05, SHIBAURA CDE ESC, 2-A10839-*A/2-F03446-*A Hitachi AQTC ESC, AIBT ESC, and TEL Heater Ring. A transparent electrostatic chuck is offered for inspection equipment and bonding adjustment, using transparent material for the base, electrode, and adsorption surface. That transparent ESC is intended for backlight inspection, comprehensive appearance inspection, and bonding equipment in which an Alignment Mark on the transparent chuck is used to support process yield. The transparent ESC can be customised for use, shape, size, thickness, and target object in the same way as other electrostatic chucks. IonPad uses a special resin and interactions at the contact interface to hold target objects without electrical power or vacuum. IonPad can hold or transport relatively flat products such as thin glass and wafer products and can provide anti-slip performance during high-speed robotic transport to reduce flying or slipping of wafers and products. IonPad uses a stable special-resin coating rather than a hardening adhesive, can be reused after cleaning when dust adheres, and should be replaced when scratches or surface wear occur. Two IonPad types are described: a smooth adhesive type mainly for glass and film and a finely textured non-adhesive type recommended for anti-slip use, with selection based on the target, application, and environment. The company also offers porous chucks whose micron-scale pores spread suction across the surface, reducing local deformation and suction marks compared with conventional grooved or holed vacuum cups. Because the porous chuck has densely distributed micron-scale pores, it can reduce suction-force loss even when a target is slightly smaller than the chuck, and recommendations can be adjusted to target characteristics. Custom adhesion-tool design can cover shape, dimensions, thickness, target-product type, and materials, while the one-stop adhesion offering spans electrostatic chucks, porous chucks, and IonPad. The company also supplies aluminum processing, chamber parts, and Ion Implanter Parts, and its Particle collector is intended to prevent fine particles from re-adhering to products during pressure changes between vacuum and atmosphere in clean vacuum equipment. Electrostatic-chuck adsorption principles include Coulomb-force types that use high voltage and whose adsorption force is influenced by dielectric-layer thickness, with examples including TEL DRM, TEL SCCM, TEL Vigas, AMAT Centura Ultima HDP, and LAM Versys Kiyo374. Johnson-Rahbek types adjust dielectric-layer insulation so a small current moves charge toward the surface and creates a virtual electrode, enabling high adsorption force at lower voltage; examples include AMAT Centura DT-HART, AMAT Producer, LAM Exelan385, Novellus, and Hitachi(U). For difficult-to-machine high-melting-point metals, Creative Technology Corporation offers one-stop work from material through machining, inspection, cleaning, and packaging for semiconductor-manufacturing-equipment parts. The machining scope includes high-purity 99.95% tungsten, molybdenum, and tantalum, as well as high-melting-point alloys identified as MoL and WL, using cutting, drilling, and grinding processes. The company also designs and manufactures unit products assembled from materials with different properties, including high-melting-point metals, ceramics, carbon, steel, stainless steel, and aluminum, drawing on semiconductor and ion-implantation parts experience. It states that it has supplied domestic and overseas semiconductor-equipment and parts manufacturers stably for more than 20 years, maintaining quality from material supply through processing and shipment. Quality-control steps include dimensional and appearance inspection with coordinate-measuring and image-processing systems, ultrasonic cleaning with manual cleaning for fragile or detailed parts, storage in a class 1000 cleanroom, and packaging using oxygen absorbers, double packaging, and cushioning materials.

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