At a glance
| Booth | I2616 |
| Country | TW |
| Website | www.creativetw.com.tw |
Company profile
IonPad Physical Adhesion | CREATIVE TECHNOLOGY Ion Pad uses a special resin as its base material. Through the contact interface between the Ion Pad and the target object, it generates a combination of chemical and physical bonding to hold the object in place. By relying on the mutual interaction of the two interfaces, it can hold the target object without any external input such as electrical power or vacuum suction. Ion Pad can be used to hold and transport relatively flat products such as thin glass and warped wafers, or it can be applied to robotic arms during high-speed transport, providing anti-slip functionality so that wafers/products do not fly off or drop (slip). ION PAD is not a curing-type adhesive; it uses a highly stable special resin coating that can be reused. If dust adheres to it, it can be reused after cleaning, but if scratches or surface wear occur, it must be replaced. ION PAD currently comes in two types: an adhesive type with a smooth surface, and a non-adhesive type with fine surface irregularities. For holding glass and film, the adhesive type is mainly used, while the non-adhesive type is recommended for anti-slip functionality. The most suitable ION PAD is designed according to the object to be held, its application, and the operating environment. We focus not only on our core technology of "electrostatic adhesion" but also strive to provide one-stop solutions related to adhesion. A typical vacuum chuck creates an airflow circuit by forming grooves or holes on the suction surface to perform suction. However, for thin and delicate objects, localized suction force may cause deformation or leave suction marks. In contrast, because a porous chuck has micron-level pores covering its entire surface, it can achieve uniform suction and reduce problems such as object deformation and suction marks. A typical vacuum chuck achieves suction by utilizing the pressure differential between vacuum and atmospheric pressure; therefore, unless all grooves or holes on the suction surface are blocked, sufficient pressure differential—and thus sufficient suction force—cannot be generated. As a result, different-sized chucks must be swapped for objects (products) of different sizes. In contrast, because a porous chuck has dense micron-level pores, air leakage is less likely to occur; even if the target object (product) is slightly smaller than the porous chuck, the drop in suction force is reduced. We can provide the optimal usage recommendations based on factors such as the characteristics of the target object (product). We can perform custom design according to your application and requirements, such as shape, size, thickness, the type of product to be held, and material. If you have any needs, please feel free to contact us. We provide a variety of "adhesion technologies," including electrostatic chucks in addition to porous chucks, and the "IonPad" with gripping/anti-slip effects. We introduce the optimal holding tools suited to the product's application and propose a range of technical solutions, rather than being limited to a single adhesion technology. As CREATIVE TECHNOLOGY, a provider of one-stop solutions for adhesion, we help our customers achieve automation, labor reduction, and improved production efficiency. If you have any needs, please feel free to contact us.
Capabilities and products
- IonPad holding and transport for thin glass and warped wafers
- IonPad physical adhesion holding for wafers and thin glass
- adhesive and non-adhesive IonPad surface types
- anti-slip wafer transport on robotic arms
- electrostatic adhesion solutions
- electrostatic chucks
- porous chucks with uniform micron-level suction
- reusable special resin coating for IonPad