At a glance
| Booth | L1030 |
| Country | TW |
| Website | www.corning.com/worldwide/en/products/advanced-optics.html |
Company profile
Corning Incorporated is a materials-science innovator with a 175-year legacy of developing products and enabling technologies. The company applies expertise in glass, ceramic, and optical physics together with advanced manufacturing and engineering capabilities across industries that include semiconductor manufacturing. For semiconductor customers, Corning Incorporated's capabilities extend from precision glass wafers and panels to metrology, coatings, and optical design for solving complex technical challenges and accelerating development. Its advanced-optics work is based on understanding the properties of light, interactions between light and matter, and the instruments used to detect light. Corning Incorporated has collaborated in optics for decades across markets including aerospace and defense, semiconductor materials and optics, telecommunications, and glass ceramics. Customer collaboration is described as a hallmark of its operations, with offerings that range from individual optics technologies to complete complex systems. Corning Incorporated states that its semiconductor story traces back to the 1930s, when work on the PYREX® 200-inch Disk for the Hale Telescope led to a flame-hydrolysis process for an ultra-pure glass that became Corning® HPFS® Fused Silica. Ultra-pure glass from this development was first used in radar technology during World War II and later in space-shuttle windows and telescope mirrors before related material and process technology contributed to optical communications and semiconductor manufacturing. The historical gallery identifies 1934 with development of fused silica while working on the PYREX® 200-inch disk and identifies 1943 with Corning® ULE® Glass. A 2001 Corning time capsule made of HPFS commemorates the company's 150th anniversary and is scheduled to be opened in 2051. A 2024 National Geographic feature highlighted production of Corning® HPFS® Fused Silica and its use in directing light pulses during manufacture of very small microchips. Today, the Semiconductor Technologies & Solutions business continues to supply glass solutions intended to align with semiconductor technology roadmaps and the pursuit of Moore's Law.
Exhibits
Corning Incorporated supplies materials, components, and systems used at nearly every step of semiconductor chip manufacturing, spanning measurement, inspection, packaging, lithography, and related optical functions. For more than 50 years, its semiconductor products have supported chip manufacturing, with a dedicated semiconductor-materials unit applying glass-science expertise and customer relationships to advanced chip production. Inspection Optics include fully customised high-accuracy precision and inspection tools, including catadioptric long-working-distance micro-objectives designed for demanding specifications down to deep-ultraviolet wavelengths. Corning® Tropel® metrology instruments measure flatness and other critical dimensional characteristics of wafers and photomasks for semiconductor manufacturing. Those metrology tools provide non-contact, full-surface measurements with sub-micron to nanometer accuracy in seconds. Advanced Packaging and Optical Glass offerings include glass wafers and panels used for wafer thinning, fan-out packaging, advanced 2.5/3D packaging, and optical or imaging applications. Glass and crystalline materials include fused silica, ultra-low-expansion glass, and fluoride crystals in bulk and part form for semiconductor-component optics, industrial applications, and imaging. Lithography manufacturing materials support both DUV and EUV lithography using calcium-fluoride crystalline material, Corning® HPFS® Fused Silica, and Corning® ULE® Ultra-Low Expansion glass to help guide lasers used to form circuitry on chips. Corning Incorporated's lithography raw materials are selected for durability, high transmission, and low coefficient of thermal expansion so that light can be transmitted from a lithography tool's source to a semiconductor wafer with precision down to nanometer-sized features. Corning® Calcium Fluoride (CaF2) is described as an ultra-clear, durable crystalline material engineered to withstand and direct the short-wavelength laser light used in photolithography. Corning® HPFS® Fused Silica is an ultra-pure material used for illumination and imaging optics and is identified as a vital material in ArF and KrF lithography and stepper optics. Corning® ULE® Glass is a titania-silicate low-expansion glass tailored for mask and optical substrates in EUV lithography and is described as retaining shape and imaging performance in the thermal environment of an EUV stepper. The material portfolio assigns different optical roles to CaF2, HPFS®, and ULE® glass so that photolithography systems can manage high-energy deep-UV light, stringent imaging requirements, and thermal stability. Custom Size Optical Glass is offered for semiconductor applications, high-power laser processing, OLED display manufacturing, and laser debris shields. Corning Incorporated also supplies liquid lenses for demanding industrial applications that require lenses described as robust, accurate, fast, and long-lasting. Its advanced-optics portfolio supplies materials, components, and systems for semiconductor processes from measurement and inspection through packaging, while also serving aerospace and defense, telecommunications, and glass-ceramics markets. The company links its semiconductor materials with the industry's ability to create increasingly small features on advanced chips as demand grows for advanced and intelligent technologies. Corning® ULE® Glass is also identified as a material suited to extreme-ultraviolet lithography in semiconductor chip manufacturing. Corning® HPFS® Fused Silica is described as sufficiently pure for directing light pulses with high precision during manufacture of some of the smallest microchips. Across this portfolio, Corning Incorporated combines materials with inspection, metrology, optical design, coating capabilities, and system-level optics to support semiconductor manufacturing requirements.
Capabilities and products
- precision glass wafers and panels
- semiconductor inspection optics
- wafer and photomask flatness metrology
- glass wafers and panels for advanced packaging
- fused silica and ultra-low expansion glass
- DUV/EUV lithography optical materials
- Corning® Calcium Fluoride (CaF2) lithography crystal material
- Corning® HPFS® Fused Silica lithography material
- Corning® ULE® Glass for EUV masks and optical substrates
- custom-size optical glass for semiconductors
- industrial liquid lenses