At a glance
| Booth | L1030 |
| Country | TW |
| Product categories | Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Surface protection material; coatings · CMP; Grind; Lap; Polish; Abrasive materials · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Substrate Materials · Thin & Thick film substrates for MEMS · Sensors · Windows · Simulation; Characterization; Verification Software · Measurement; Inspection Service · Micro Machining services (small hole drilling and milling) · Plating; Electro Polishing; Coating; Surface Treatment · Sawing; Lapping; Grinding; Polishing Service · Flat Panel Display (FPD) Design & Manufacturing · Package Materials; Interconnect; Subcomponent; Subassembly Design Services · Wafer Handling · Device; Wafer; Display Panel Handling Products |
| Website | www.corning.com/worldwide/en/products/advanced-optics.html. |
Company profile
Corning Incorporated is one of the world’s leading innovators in materials science, with a 175-year legacy of developing life-changing products and enabling breakthrough technologies. Leveraging deep expertise in glass, ceramic, and optical physics, Corning combines advanced manufacturing and engineering capabilities to deliver solutions that support a wide range of industries, including semiconductor manufacturing. From precision glass wafers and panels to enabling capabilities such as metrology, coatings, and optical design, Corning helps customers solve complex technical challenges and accelerate development. Learn more at https://www.corning.com/worldwide/en/products/advanced-optics.html.
Capabilities and products
- coatings for semiconductor manufacturing
- glass, ceramic and optical materials science
- metrology capabilities for semiconductor manufacturing
- optical design for semiconductor manufacturing
- precision glass panels
- precision glass wafers