At a glance
| Booth | R7412 |
| Country | TW |
| Website | www.clean.co.jp/news/semicon-taiwan-2026-%E5%87%BA%E5%B1%95 |
Company profile
CLEAN TECHNOLOGY CO., LTD. TAIWAN BRANCH (JAPAN) is the Taiwan branch of Japan's Clean Technology Co., Ltd., which specializes in exhaust-gas treatment systems for semiconductor and display production lines. The company develops products centered on exhaust-gas treatment systems used for environmental preservation in semiconductor and LCD production lines. Its business is framed around supporting advanced manufacturing sites and clean spaces while pursuing a sustainable society through technologies addressing both the global environment and human health. Its product range lists Wet Type Aqua IV, Plasma Type Thunder, Heater + Wet Type Sirius Kaiser Oz II, Heater + Wet Type Sirius Kaiser Oz, Exhaust / Drain Line Filter Unit Bariatron, and Dry Type Reo, together with customer support. The Japanese business profile also describes MA-T® airflow space-cleaning machine Doctor’e, an air-environment technology that cleans the space itself rather than relying on conventional filter filtration, and states that the technology was exhibited at the Osaka-Kansai Expo. Specialist staff provide product consultation and technical support through a support system intended to help customers use products with confidence.
Exhibits
CLEAN TECHNOLOGY CO., LTD. TAIWAN BRANCH (JAPAN) provides exhaust-gas treatment systems for harmful process gases and PFC gases from semiconductor manufacturing, with offerings for dry etching, CVD and MOCVD processes intended to combine cost reduction with high safety and support stable production-line operation. Powder traps and automatic pipe-cleaning systems address process residue and pipe clogging, strengthening peripheral management around exhaust-gas treatment systems to support continuous and stable production-line operation. The company lists PM2.5 countermeasures and NOx reduction as main themes. Plasma Type Thunder is a plasma exhaust-gas treatment system for process gas and PFC gas eliminated by etching systems; it is described as using the world’s first long-arc plasma and as allowing easy maintenance by unit replacement. Thunder uses a small plasma reactor with clamp connection and independent detachable units, and its long-arc plasma technology is described as achieving high treatment efficiency with minimum energy at an average reactor-inner atmosphere of 6000℃. The Thunder design allows up to two reactors in the same dimensions, supports a backup line, provides ignition treatment with no time lag, and can turn plasma on only during treatment-gas inflow to reduce component wear and energy consumption. Its shower area optimizes water consumption so that a large wet scrubber is unnecessary, the system is described as having low running cost, and it is SEMI Standards certified. Dry Type Reo is a dry exhaust-gas treatment system for gases from CVD, ion implantation and epitaxial processes and is described as a high-safety, cost-reducing model with control functions for smooth production-equipment operation and long-term processing. Dry Type Reo uses an abatement-column tank-swap replacement system with a proprietary tank so there is no regeneration waiting time, and the company states that deteriorated tanks are repaired and replaced at its expense. By developing and manufacturing catalyst in-house, the company states that catalyst cost was reduced to 1/3 to 1/10 of conventional cost; changes to tank production, industrial-waste storage and work equipment are described as reducing industrial-waste cost by 20% and refilling time by 30%. Dry Type Reo lists process gases including SiF4, PH3, B2H6, TEOS and Si2H6. Other listed exhaust-gas products include Wet Type Aqua IV, Heater + Wet Type Sirius Kaiser Oz and Sirius Kaiser Oz II, both described as safety-heater types with a spiral mechanism, and Exhaust / Drain Line Filter Unit Bariatron. Wet Type Aqua IV is described as providing space-saving and maintenance advantages.
Capabilities and products
- semiconductor harmful-process-gas and PFC exhaust treatment
- exhaust treatment for dry etch/CVD/MOCVD
- powder trapping and automatic pipe cleaning
- plasma exhaust-gas treatment system
- dry exhaust-gas treatment system
- PM2.5 countermeasures
- NOx reduction
- MA-T® airflow space cleaning