At a glance
| Booth | K2576 |
| Country | TW |
| Website | www.chromaate.com |
Company profile
Founded in 1984, Chroma ATE Inc. supplies precision test and measurement instrumentation, automated test systems, intelligent manufacturing systems, and test and automation turnkey solutions under the Chroma brand. Its served markets include semiconductors, photonics, LED, photovoltaics, video and color, flat-panel displays, power electronics, passive components, electrical safety, green batteries, electric vehicles and thermoelectrics. The company's market scope also includes automated optical inspection and intelligent manufacturing systems for ICT and cleantech industries. Chroma ATE Inc. maintains branch offices in Europe, the United States, Japan, Korea, China and Southeast Asia to support global customers. Its semiconductor portfolio spans equipment used from R&D through mass production, including large ATE test systems, IC handlers and compact PXI/PXIe test platforms. Semiconductor test applications cover consumer devices such as microprocessors, audio chips and computer or mobile-device peripheral chips. The application range also includes power-management ICs such as linear regulators, DC converters, AC converters and LED drivers, plus RF devices for wireless networking, Bluetooth and mobile communications. Additional specialized applications include image sensors, RFID, system-level testing and CMOS image sensor testing.
Exhibits
The 3680 Advanced SoC Test System provides flexible configurations and broad test coverage so multiple device types can be tested on one platform. It is designed for high-throughput and high-parallel testing for fabless companies, IDMs and testing houses. The 3680 targets consumer devices, high-performance microcontrollers, analog devices and SoC devices with comprehensive test capability, high accuracy, software tools and reliability. Its architecture provides 24 interchangeable slots for digital, analog and mixed-signal applications. The 3680 supports data rates up to 1Gbps, as many as 2048 sites in parallel and up to 2048 digital I/O pins. Chroma ATE Inc. also offers a 2D/3D WLP/PLP Metrology System built on patented BLiS TM technology for nanoscale, non-destructive and fast surface-profile measurement and analysis. That optical metrology platform is intended for advanced-packaging applications and can be configured with WLI, COLOR CONFOCAL, AFM and DUV probes. Model 7980 is a 2D/3D Wafer Metrology System using BLiS technology for nanoscale, nondestructive and rapid surface-profile measurement and analysis on wafers up to 12 inches with EFEM and SECS/GEM. Chroma's semiconductor test solutions address higher-speed, higher-pin-count devices using functions such as high-speed digital testing, high-performance power sources, low-noise mixed-signal testing, CMOS image sensor testing, true wireless stereo testing and radio-frequency testing. The company also develops PXIe instruments and software to use the size and flexibility of PXIe for semiconductor test applications. Model 3650-S2 is a SoC/Analog Test System with 12 universal slots for digital, analog and mixed-signal applications. The 3650-S2 provides up to 768 digital I/O and analog pins, 50 / 100 MHz clock rates and 100 / 200 Mbps (MUX) data rates. Its listed digital capabilities include edge-placement accuracy of ±300ps, 32 MW vector memory, 32 MW pattern-instruction memory, per-pin PPMU and frequency measurement, scan features to 2G depth per scan chain, and an ALPG option for memory test. High-voltage and power options include up to 48 high-voltage I/O pins, floating-ground VI resources, 64-CH / board HDDPS2, a maximum 3750V stacked HVVI option and up to 320A pulse mode when MPVI resources are ganged. Other analog options include 8-CH AWG and 8-CH Digitizer ASO for mixed-signal audio-band testing, 32-CH / board VI45 and 8-CH / board PVI100. The 3650-S2 supports Windows 7 and Windows 10, C++ and GUI programming, CRISP software tools, test-program and pattern converters, STDF data output, and conversion kits that accept DIBs and probe cards from other testers. The platform is described for power-management chips and ICs, high-performance devices, microcontrollers, analog ICs, consumer SoC devices, wafer sort, compound semiconductors and MCU devices. Its parallel electronics can perform identical parametric tests on multiple pins, with 64 digital pins integrated on one LPC board and any-pin-to-any-site mapping supporting up to 32 sites. The 3650-S2 architecture can integrate dedicated third-party instruments, and its air-cooled tester-in-a-test-head design uses a compact footprint and can support package or wafer test with an optional manipulator. CRISP integrates test-program development, execution control, data analysis and tester management and provides GUI tools for templates, C++ editing and automatic scaling to multi-site parallel testing. CRISP debugging and analysis tools include System Control, Plan Debugger, Datalog, Waveform, Scope, SHMOO, Pin Margin, Wafer Map, Summary, Histogram and STDF tools. The software suite also includes Test Condition Monitor, Pattern Editor, ADDA, Bit Map and OCI tools for runtime debugging, analog or ALPG work and production operation. The 3650-S2 communicates with handlers and probers through GPIB and TTL and lists supported equipment from CHROMA, SEIKO-EPSON, HONTECH, SHIBASOKU, MULTITEST, ASECO, DAYMARC, TEL, TSK and OPUS. Application support can be customized for production ramp-up, emerging-market opportunities, productivity improvement or testing-cost reduction through Chroma ATE Inc.'s worldwide customer-support team. Model 3650 provides application coverage for PMIC, ADDA/Memory, Controller, MCU and consumer devices, with an expandable platform of up to 640 channels. The 3650 offers 50 / 100 MHz clock rates, 100 / 200 Mbps (MUX) data rates and high-density analog, ADDA, mixed-signal and TIA options. Model 3380P provides a 100Mhz clock rate, 512 I/O channels expandable to 576 pins and up to 512 sites of parallel testing. Model 3380D provides a 100 MHz clock rate, 256 digital I/O pins and up to 256 sites of parallel testing. Model 3380 provides a 100Mhz clock rate, 1024 I/O channels expandable to 1280 pins and up to 1024 parallel test sites. PXIe support products include Model 33011 Universal Relay Driver Control with 32CH direct relay drivers and two lanes of SPI relay-control interface. Model 33020 is a PXIe Programmable Device Power Supply with eight channels per card, while Model 33021 is a High Voltage Device Power Supply with a maximum 48V DC output and two channels per card. Model 33010 is a High Speed PXIe Digital IO Card with a standard PXIe bus connector, a 100MHz maximum clock rate and 32 channels per board. The handler portfolio includes Model 3210, an SLT handler for early device design and engineering validation with a compatible kit for production scaling and ATC tri-temperature testing from -40℃ to 150℃. Model 3200 is a modular, cross-generation testing platform with customizable test environments. Model 3110 is an FT and SLT compatible single-site handler with auto tray loading and unloading, device sorting, and ATC tri-temperature operation from -40 to 150 ℃, with optional -55 to 150℃ and -70 to 150℃ ranges. Model 3110-FT supports Final Test or System Level Test from -40~125℃ for packages from 3x3mm to 45x45mm. Model 3111 is a tabletop single-site handler supporting two fixed JEDEC trays, package sizes from 5x5mm to 45x45mm and software-configurable binning. Model 3240-Q integrates an RF/Wireless isolation chamber into an automatic handler. Model 3112 is a Pick&Place bare-die test handler with multi-plate input, automated test sorting, an X/Y/Z/θ adjustable probe stage and a stage remain-die check function. The 3160-C tri-temperature handler uses Nitro TEC thermal technology, has a 0.6 sec index time, provides active thermal control and uses a chamber-less design. Model 3180 supports up to eight parallel test sites, up to 9000 UPH and temperature testing from ambient to 150℃. Model 3240 is an automated system function tester for high-volume multi-site system-level IC testing and can test up to four devices in parallel at high temperature with ATC from 50°C to 125°C. Model 3260 is a tri-temperature SLT handler for package sizes from 3 mm × 3 mm to 45 mm × 45 mm, with optional ranges up to 55 mm × 55 mm and 70 mm × 70 mm. Model 3270 is a miniature IC handler for high-volume multi-site system-level testing, particularly for CMOS Image Sensor testing. The Model 31000R/31000K Series Temperature Forcing System covers -70°C to 150°C and includes software integration and configurable rack mounting. Chroma ATE Inc.'s System Level Testing approach covers the process from lab to fab and focuses on production efficiency, defect reduction, product quality and faster time to yield. Its SLT work addresses market requirements such as contact-leveling control and thermal-precision control as semiconductor device and packaging complexity increases. The company combines SLT solutions with customer collaboration and a global support network, using recurring customer needs to define product requirements and customized solutions aligned with customer roadmaps. The Chroma 3200 FT & SLT Hybrid Test System supports 5x5~120x120mm devices, multiple sites, -40 ~ +150℃ @Tc, TSD (Tj), and optional warpage detection and OHT integration. The Chroma 3210 Single Site Test Handler supports 3x3~120x120mm devices, -40 ~ +150℃ @Tc, 450 kgf contact and TSD (Tj). The Chroma 3110 Gen2 Hybrid Tri-temp Test Handler supports 3x3~120x120mm devices, -70 ~ +150℃ @Tc, 450 kgf contact and TSD (Tj). The 3650-S2 received a 2025 Taiwan Excellence Award and a Best Product of the Year award at EE Awards Asia 2023. Its hardware features also include increased load-board component area and a larger tester power supply. Each 3650-S2 LPC board contains 16 Chroma PINF ICs, and each PINF IC supports a four-channel timing generator. An adaptor-board solution allows the 3650-S2 to accept DIBs and probe cards from existing testers, reducing the need to manufacture new load boards and probe cards when migrating platforms. The CRISP execution controller can switch between System Control and Plan Debugger, with debugging functions including breakpoint, step, step-into, step-over, resume, variable-watch and variable-modify. Test Condition Monitor and Pattern Editor can change test conditions or pattern data during runtime without interrupting the test or modifying source files. For production operation, OCI can be configured in advance through Production Setup so an operator can select the planned process and start mass production. Model 3111 includes a test-head air chamber designed to absorb and reduce the impact of downward contact force. The 3160-C provides site choices of 1, 2 or 4 in addition to its active thermal-control functions. Model 3260C is a tri-temperature system-board test handler with high-speed Pick&Place operation, synchronized dual pickup and dual placement, IC-residue detection, a universal fixture design and Nitro TEC active temperature control. The 3260C is also designed for faster heating and cooling response. System Level Testing responds to the risk that growing chip-design complexity can reduce yield and increase packaging expense. The SLT approach moves beyond single-element testing toward a system-level method that evaluates core functionality together with contact-leveling and thermal-precision requirements. Continuous SLT optimization is presented as a way to maintain quality as technology complexity increases while improving production efficiency and reducing defects.
Capabilities and products
- Customized measurement instruments
- Automated production line integration
- Intelligent manufacturing system integration
- SoC and analog IC test systems with up to 2048 parallel sites
- VLSI test systems
- Power management IC testing
- Radio-frequency IC testing
- RFID IC testing
- True wireless stereo IC testing
- Compact PXI/PXIe semiconductor test platforms
- PXIe relay driver control modules
- PXIe programmable device power supplies
- High-voltage device power supplies
- High-speed PXIe digital I/O cards
- Pick & Place bare-die test handlers
- Hybrid FT/SLT tri-temperature test handlers
- Tabletop single-site IC test handlers
- Automatic handlers with integrated RF isolation chambers
- Octal-site logic test handlers
- Tri-temperature system-level test handlers
- Multi-site parallel PCB-level functional testers
- Miniature IC test handlers for CMOS image sensors
- Temperature forcing systems from −70°C to 150°C
- Sub-nanometer nondestructive 2D/3D surface metrology for 12-inch wafers
- 2D/3D WLP/PLP surface metrology systems for advanced packaging
- ATC/PTC temperature control for IC testing
- Large-array-packaged IC handling technology
- ALPG memory-test options
- AD/DA converter testing
- Mixed-signal audio-band test options
- Stacked high-voltage analog test options up to 3750V
- Ganged pulse-mode analog test options up to 320A
- Compound semiconductor testing
- MCU IC testing
- Wafer and packaged-device testing
- Software for IC test-program development, debugging and data analysis
- Cross-platform conversion of ATE test programs and patterns
- Cross-tester adaptation of DIBs and probe cards
- Hybrid FT/SLT test systems
- Turnkey CIS testing solutions
- Multiple-scan-chain IC testing
- GPIB/TTL communication integration for test handlers and probers
- STDF output of IC test data
- Warpage-detection options for IC testing
- OHT integration options for IC testers