At a glance
| Booth | G0001 |
| Country | TW |
| Website | www.cst888.com.tw/en/news/semicon_taiwan2026 |
Company profile
Founded in July 2004, Chia Sheng Technology Co., Ltd. is a professional semiconductor, LCD, and lithium-battery equipment manufacturer and distributor. The company also describes itself as an equipment manufacturer and agent for the semiconductor, LCD, and LED industries. It continues R&D on green-energy-related equipment and aims to grow as an integrated platform for technology development and process solutions. Its core businesses include R&D and fabrication of test fixtures, machining and manufacturing of precision parts, supply of customized equipment for semiconductor back-end processes, and system-control software development for test equipment. The company’s operating role therefore combines equipment manufacturing, equipment agency, precision-part production, customized back-end process equipment, test-fixture development, and control-software development.
Exhibits
Chia Sheng Technology Co., Ltd. supplies High Precision Bonding Solutions and Machines for Semiconductor. Its wafer-thickness measurement equipment is an automatic system designed specifically for in-process measurement of Wafer thickness. The wafer-thickness system can be applied in semiconductor front-end, back-end, packaging, and other semiconductor processes. It is intended to control Wafer-thickness variation and to help prevent process problems that could result in product loss. The equipment supports 8” & 12”Wafer. The probe measurement repeatability specification is ±0.5um. Robot warpage capability is +6 mm/-6mm, and the applicable Wafer thickness range is 430~980um. The measurement method is 360° measurement with a minimum measurement-angle setting of 1°. Equipment measurement repeatability is ±1um. The listed interface and automation compatibility includes E84 SPEC and SECS/GEM SPEC. Together with the company’s customized semiconductor back-end equipment and test-equipment control-software capabilities, the bonding and wafer-thickness offerings address automated semiconductor manufacturing and measurement tasks. The wafer-thickness platform combines robotic wafer handling with metrology specifications, including warpage capability, repeatability values, a defined thickness range, and full-circle angular measurement. Its stated process coverage is not limited to one manufacturing stage because the equipment is identified for front-end, back-end, and packaging use. The company’s test-fixture development, precision-parts machining, customized back-end equipment, and test-equipment system-control software form additional engineering capabilities around the semiconductor equipment business. The equipment-manufacturer and distributor role also covers LCD, LED, and lithium-battery fields while green-energy-related equipment remains an R&D direction.
Capabilities and products
- test fixture R&D and fabrication
- precision parts machining and manufacturing
- custom semiconductor back-end process equipment supply
- system-control software development for test equipment
- high-precision semiconductor bonding machines and solutions
- automatic wafer-thickness measurement equipment