At a glance
| Booth | N1076 |
| Country | TW |
| Website | www.cmi-tw.com.tw |
Company profile
Cheng Mei Instrument Technology Co., Ltd. was founded in 1995 and develops manufacturing-automation systems for surface inspection and 3D measurement. Its technology work combines optics, metrology, software, and automation to address inspection and measurement tasks in compound semiconductors, semiconductors, microLED, mmLED, LED, advanced packaging, and related precision-manufacturing applications. The company focuses on complex wafer and die defects and features, developing surface-inspection equipment around optical performance, reliability, and wafer-per-hour processing requirements. Research and development personnel account for more than half of the company workforce, supporting the in-house development of optical inspection, measurement, image-analysis, and automation capabilities. Its development scope covers system integration as well as high-end inspection and metrology, with applications extending from advanced semiconductor packaging to microLED and compound-semiconductor production. The company serves both the Taiwan market and international markets with inspection and metrology systems built around its optical, software, and automation technologies. For advanced packaging, the company describes inspection as requiring not only high-speed defect detection but also flexible handling, warpage and thermal-stress measurement, complete data collection, and AI-assisted analysis as device integration becomes denser. Its semiconductor-facing technology scope therefore spans optical inspection, 2D and 3D metrology, defect review, statistical analysis, AI image analysis, equipment automation, and data management across wafer, die, package, panel, and optical-component workflows.
Exhibits
Argus is positioned for high-precision interposer RDL inspection, using an optical design and algorithms intended to suppress imaging interference created by multilayer structures and material differences. For fan-out and RDL inspection, Argus supports bright-field, dark-field, and TLI optical modes to detect opens, shorts, line-width abnormalities, particles, and other pattern defects. The RDL workflow also supports penetrating inspection of multilayer structures and detection of hidden defects in dielectric layers, extending inspection beyond surface-only pattern checks. FVI inspection covers solder-ball and package-edge conditions, complementing the RDL inspection functions for advanced packaging. Argus options include microbump 3D measurement, fluorescence inspection, film-thickness measurement, and machine-difference management. The Argus platform supports 8-inch and 12-inch wafers and panels up to 310 x 310 mm, with listed wafer thickness from 400 to 2500 micrometers. Its listed defect sensitivity is 0.7 micrometers, the RDL line-and-space capability is 2 micrometers by 2 micrometers, and the platform supports large chips up to 280 mm. Phantom targets large-panel RDL inspection for panel-level fan-out and CoPoS or Chiplet-related packaging flows where inspection must extend beyond conventional wafer formats. The Phantom platform combines large-panel inspection with 3D bump measurement and offers options including microbump 3D measurement and fluorescence inspection. Supported panel formats include 510 x 515 mm, 600 x 600 mm, and 700 x 700 mm, with listed panel thickness from 400 to 4000 micrometers and high-warpage handling below 10 mm. Its optical configuration includes a module for multilayer RDL inspection under multiple illumination conditions. Buffalo addresses post-dicing optical inspection, including cracks, chipping, and particle contamination that can arise after wafer or die separation. The post-dicing platform is presented around high-speed and high-sensitivity inspection so that edge and surface damage can be checked in downstream packaging workflows. OptiCore is the dimensional-metrology offering for silicon-photonics optical components and also supports multilayer film-thickness measurement for III-V semiconductor structures. For co-packaged optics and related photonic integration, the measurement topics include optical critical dimensions, III-V film thickness, and defects in optical structures. The product set connects these optical measurements with advanced-packaging workflows such as CoWoS, panel-level processing, CoPoS, and microLED manufacturing. The LUNA software ecosystem includes MERCURY for defect review, VENUS for statistical and trend analysis, and MARS for advanced-packaging 3D metrology and process monitoring. MERCURY can read and compare KLA, SINF, TSK, and custom inspection reports, perform defect-level and die-level verification, and apply review rules with Golden Die or CAD references. VENUS provides statistical, trend, yield, IQM, and defect-distribution analysis so inspection results can be evaluated at process and production level. MARS measures advanced-packaging features including bump height, bump diameter, and coplanarity as well as die and wafer warpage, while producing standardized CMIt data and reports for process monitoring. MOON provides 2D and 3D inspection and metrology functions within the broader software environment. The ACME AI platform includes RADON for inspection and classification AI and NEON for analysis AI, linking image-based inspection results with automated interpretation. The NOVA equipment-automation environment includes an EFEM, STELLAR bridging functions, and LUMIN automation functions for integrating inspection and metrology equipment into production flows. The software environment also supports parameter upload and download, server-based control, and version management across equipment, helping standardize recipes and operating settings. For 2.5D and 3D IC packaging, the inspection approach combines high-speed inspection, flexible handling, warpage and thermal-stress measurement, complete process data, and AI analysis for complex integration structures. These capabilities are presented for packaging requirements associated with HPC, AI, HBM, and silicon-photonics integration. For microLED, the microEagleEye and microPlayLight systems perform 2D inspection and metrology for missing, rotated, and shifted dies. The microLED workflow supports chip-on-wafer and chip-on-carrier handling on 4-inch and 6-inch wafers, including double-side flipping and full-wafer mapping of die shift and rotation. Optional fluorescence inspection distinguishes R-LED and GB-LED conditions, while edge-contact automation supports production handling. Across the exhibit portfolio, advanced optics, modular software, and AI image analysis are combined to inspect structures ranging from submicron RDL defects to large panels, diced components, photonic structures, and microLED arrays.
Capabilities and products
- Multilayer interposer RDL defect inspection with 2 µm/2 µm line width/spacing
- Large-panel RDL inspection up to 700×700 mm
- Microbump 3D measurement modules (optional)
- Fluorescence imaging inspection modules (optional)
- Optical defect inspection after chip dicing
- Optical component dimensional measurement for silicon photonics
- Multilayer thin-film thickness measurement for III-V semiconductors
- Chip warpage and thermal-stress effect measurement
- Through-layer and hidden-defect inspection of fan-out package RDL
- Final visual inspection FVI of packages
- 2D inspection and measurement of missing, shifted and rotated µLEDs
- Double-sided µLED inspection with optional flip module
- Fluorescence inspection modules for R-LED/GB-LED (optional)
- Edge-contact automated wafer transfer (optional)
- Semiconductor 2D/3D inspection and measurement software
- AI model development platform for semiconductor defects
- AI defect classification and model optimization
- Semiconductor AI data analysis
- Defect review and conditional re-verification software
- Defect comparison using Golden Die/CAD reference die images
- Cross-source inspection report comparison (KLA, SINF, TSK)
- Yield and trend analysis for wafer testing and packaging processes
- Multi-lot defect distribution and hotspot analysis
- 3D data analysis of bump height, diameter and coplanarity
- Analysis of die and wafer warpage measurement data
- EFEM integration and wafer-handling automation software
- Cross-equipment synchronization and version control of inspection and measurement parameters
- Compound-semiconductor surface inspection equipment
- 3D measurement equipment for compound semiconductors