At a glance
| Booth | Q6240 |
| Country | TW |
| Website | www.cermaxmaterial.com/e01 |
Company profile
CERMAX Co., Ltd is a Taiwan precision-ceramic and advanced-materials supplier and a semiconductor-materials supplier with ceramic-parts machining and manufacturing capabilities. The company was founded in 2013 and has integrated production capabilities spanning formulation, powder processing, forming, sintering, precision machining, and surface treatment. Its ceramic-product base includes alumina, silicon carbide, and aluminum nitride parts for applications in automation, aerospace satellites, semiconductors, and optoelectronics. CERMAX's combination of material preparation, ceramic forming and sintering, downstream precision machining, and surface treatment allows it to support ceramic and advanced-composite material solutions for performance and process-efficiency requirements. Within semiconductor applications, its stated capabilities include machining and manufacturing ceramic parts as well as supplying CVD SiC wafers and semiconductor components. The company's materials portfolio covers both precision ceramics and advanced composite materials, with solutions aimed at improving component performance and process efficiency rather than limiting the business to a single ceramic composition.
Exhibits
CERMAX supplies a 300mm CVD SiC wafer with density 3.21 g/cm³, thermal conductivity >250 W/m*k, resistivity 0.001-1 ohm-cm, heat capacity >600 J/kg*℃, and hardness >2400 Kg/mm2. The listed semiconductor-related offering also includes CVD SiC wafers and semiconductor components produced alongside the company's ceramic-parts machining and manufacturing work. Vacuum chucks with heaters are part of the supplied product range. CERMAX also lists an advanced uniform-heating system for Panel-Level Packaging, extending its offering from ceramic components and wafers into thermal-control hardware for panel-level packaging processes. The 300mm CVD SiC wafer combines the listed electrical, thermal, density, heat-capacity, and hardness specifications in a wafer format intended for semiconductor-component applications. The broader manufacturing foundation described for CERMAX covers formulation and powder processing before forming and sintering, followed by precision machining and surface treatment for finished ceramic components. This integrated sequence supports products based on alumina, silicon carbide, and aluminum nitride for semiconductor and other advanced-equipment applications. For semiconductor customers, the portfolio therefore combines precision ceramic parts, CVD SiC wafer and component supply, heated vacuum chucks, and a uniform-heating system for Panel-Level Packaging. The specified combination of >250 W/m*k thermal conductivity, 0.001-1 ohm-cm resistivity, >600 J/kg*℃ heat capacity, and >2400 Kg/mm2 hardness defines the 300mm CVD SiC wafer through multiple thermal, electrical, and mechanical properties rather than a size designation alone.
Capabilities and products
- ceramic part machining and manufacturing
- CVD SiC wafers and semiconductor components
- 300mm CVD SiC wafers
- heated vacuum chucks
- uniform heating systems for Panel-Level Packaging