At a glance
| Booth | S8130 |
| Country | TW |
| Website | centrumtw.com |
Company profile
Centrum Technology Corporation was established in 2006 and focuses on high-precision inspection technology and equipment innovation. Its equipment combines automated intelligent inspection, precision positioning, stable operation, and AI-enabled process intelligence for advanced manufacturing. Centrum is headquartered in Taoyuan, Taiwan and operates multiple overseas locations to serve customers globally. The company uses intelligent equipment networking and real-time technical support as part of its global service model. Its core technologies include high-precision visual inspection using high-resolution image processing and intelligent algorithms. High-speed electrical testing combines electrical measurement and analysis with real-time data feedback for process control. Precision-fixture applications use high-stability and customized designs to improve process accuracy, repeatability, and production efficiency. The development history states that Centrum became a qualified global supplier to semiconductor customers in 2008 and a supplier partner for 12-inch semiconductor fabs in 2013. In 2014 the company acquired the Japanese electrical-testing company AI Technology and invested in independent IC development to strengthen core technology capability. In 2017 Centrum developed and manufactured dedicated electrical-testing equipment for IC substrates and mobile-phone HDI boards. Its service scope also includes inspection-equipment sales, customization and retrofit solutions, and professional technical services. Centrum states that its automated inspection equipment is intended not only to improve process efficiency but also to provide accurate alignment, consistent performance, and intelligent process optimization. The visual-inspection core uses high-resolution image processing for accurate recognition and real-time analysis, while the electrical-testing core is designed to return measurement data directly into process control. The electrical-testing platform is positioned for high-quality PCBs, IC substrates, and semiconductor packaging, combining precision measurement with intelligent integration for mass-production use. The company also offers fully customized solutions around its inspection technologies, including retrofit work and technical services for project-specific requirements.
Exhibits
For blind-via inspection on ABF substrates, CCL, and PCB, Centrum provides high-speed blind-via-bottom AOI with scanning speed up to 300 mm/s. The blind-via solution is intended to detect bottom residue, abnormal hole formation, and process deviation before they create downstream electrical, signal-loss, or end-application risks. Its vision algorithm is specifically described for quantitative identification of tiny blind-via-bottom defects and residue in high-density substrate production. The AI-Powered Auto Code Mapping Sorting System supports package types including LQFP and TQFP and integrates automated loading/unloading, OCR/OCV, 2D data-matrix scanning, and robotic pick-and-place sorting. The platform supports Standard Sorting, 2D Code Sorting, and Tray Mapping modes for classification from top markings, 2D codes, or full-tray character data. Optical-inspection-driven pick-and-place sorting is listed with an average unit processing time of approximately 0.1 s. The system automatically maps IC top-marking data to exact tray-pocket coordinates to support lot traceability and root-cause disposition. It is designed for multiple package geometries and tray configurations so automated sorting and device traceability can be applied across different form factors. The CoWoS / CoPoS 2D/3D Thickness & Coverage solution combines AI coverage analysis with 3D thickness measurement for wafers and advanced substrates. It quantitatively evaluates flux coverage, thickness, surface topography, process variation, and warpage-related risk before bonding. The 3D metrology uses Spectral Confocal technology with a listed Z-axis resolution of less than 100 nm for semi-transparent films and small thickness variations. Its 2D coverage function combines multi-directional illumination with grayscale-threshold algorithms for pad-submergence classification and coverage distribution analysis. Metrology data can be fed back to dispensing or jetting equipment for real-time tuning, with SECS/GEM and EFEM integration for inline production. The 3D Laser Underfill Inspection System measures underfill profiles, warpage, bump height, coplanarity, wire-bond loop height, and other 3D structures, with stated Z-axis accuracy down to 1 µm. It provides real-time cross-sectional profiles and 3D surface maps and supports sampling through 100% inline inspection without destructive sampling. The system lists 3 µm-level Z-axis resolution and a 100 mm × 120 mm scan area for large die and substrate warpage inspection. Centrum electrical-testing platforms combine hardware integration, precision measurement, contact testing, and non-contact testing for semiconductor, PCB, and IC-substrate applications. The electrical-testing range includes fixture testing, non-contact testing, and embedded testing for mass-production monitoring and yield control. The vision-inspection equipment combines high-resolution imaging, multi-angle illumination, and AI algorithms for defect detection, dimensional measurement, and quality control in semiconductor, PCB, and substrate manufacturing. For blind-hole structures, the vision platform uses a TDI camera, advanced imaging architecture, and proprietary algorithms to identify minute or sub-micron defects with real-time defect labeling and high-efficiency computing. The Non-Contact WB-BGA Wire Close Sweep sagging solution detects internal wire displacement after molding and targets wire sweep, wire sag, and insufficient wire-to-wire clearance. It supports non-destructive 100% pre-shipment inspection and is identified for automotive and industrial-control ICs. The IR Metrology & Inspection System uses SWIR / IR silicon penetration for non-destructive subsurface imaging of inner cracks, chipping, overlay shift, and embedded foreign particles. IR inspection is designed to characterize internal structures and defect depth without damaging wafer samples and to support inline quality control. The 2D Laser Line Profiler combines high-resolution optical inspection with dimensional measurement for surface defects, dimensional shifts, pattern abnormalities, and critical-dimension monitoring. Its listed measurement accuracy is ≥ ±1 µm, with a real-time inspection engine and optional AI classification module. The CoWoS RDL Sensor-to-Sensor Non-Contact Open / Short Test System is being developed for non-contact open/short inspection of high-density RDL and C4 layers without physical damage to wafer surfaces or fine-pitch metal traces. The RDL/C4 approach is intended to identify electrical defects early in 2.5D/3D advanced packaging so downstream yield loss and material scrap can be reduced. The Advanced Non-Contact Bonding Wire Inspection System uses a capacitive-coupling sensor to detect wire-close conditions and shorts after IC molding without damaging the sample. Its inspection sequence selects a target pin, applies a signal, reads the sensor signal, compares it with reference data, and outputs a Pass/Fail judgment; applications include WB-BGA post-mold and final pre-shipment inspection.
Capabilities and products
- visual inspection with high-resolution imaging and intelligent algorithms
- high-stability custom precision fixtures
- ABF/CCL/PCB blind-via bottom AOI (up to 300 mm/s)
- AI-powered automatic code mapping and sorting system
- CoWoS/CoPoS 2D coverage and 3D thickness metrology
- Spectral Confocal 3D metrology (Z <100 nm)
- closed-loop metrology feedback to dispensing/jetting equipment
- SECS/GEM and EFEM smart manufacturing integration
- 3D metrology for underfill, warpage, bump height, and coplanarity
- fixture, non-contact, and embedded electrical testing
- non-contact WB-BGA wire close/sweep/sagging inspection
- SWIR/IR silicon-penetration inspection
- 2D Laser Line Profiler systems
- CoWoS RDL/C4 non-contact open/short testing
- R&D, manufacturing, and delivery of custom semiconductor inspection equipment
- dedicated electrical testing equipment for IC substrates and mobile phone HDI boards
- inspection equipment sales
- inspection equipment customization and retrofit