At a glance
| Booth | L0510 |
| Country | TW |
| Website | www.zeiss.com |
Company profile
Carl Zeiss Co., Ltd. operates in optics and optoelectronics and develops, produces, and distributes solutions for industrial metrology and quality assurance, microscopy for life sciences and materials research, and medical technology for diagnostics and treatment in ophthalmology and microsurgery. Its Semiconductor Manufacturing Technology segment covers a variety of key processes in microchip production and brings ZEISS semiconductor-manufacturing expertise across major stages of chip production. ZEISS technology is described as supporting the development of microchips that become increasingly smaller, more powerful, more energy-efficient, and more affordable as semiconductor manufacturing advances. ZEISS Semiconductor Mask Solutions focuses on dedicated solutions for the mask-making industry with the objective of enabling production of zero-defect photomasks. Smart software applications increase automation and enhance tool capabilities, while a dense global network of sales and service sites provides support for semiconductor-industry customers. ZEISS Semiconductor Manufacturing Technology includes development and production activities in Germany at Oberkochen, Jena, Wetzlar, Rossdorf, Aachen, and Coswig, with additional development and production or R&D sites in Zurich, Dublin, and Bar Lev. Its sales and service companies and service locations extend across the US, China, Taiwan (region), South Korea, and Japan, including Hsinchu, Tainan, and Taichung in Taiwan (region) among the listed semiconductor support locations. ZEISS SMT works with a network of more than 1,200 partners and suppliers, and its supplier management coordinates the supplier value chain while aligning with requirements from OEM and end-user markets.
Exhibits
ZEISS has enabled technologies of tomorrow with semiconductor manufacturing equipment for over 50 years and describes itself as a driver of global digitalization through technologies used in microchip production. ZEISS measurement technology ensures perfect results in industrial sectors where precision, quality, and efficiency are essential success factors, linking measurement capability with production quality requirements. ZEISS optical, electron/ion, and X-ray microscopes are used to visualize the smallest structures and the fastest processes. The ZEISS Semiconductor Manufacturing Technology portfolio is organized around Lithography optics, Photomask solutions, and Wafer fab solutions, covering several phases of chip development and production. Lithography optics, laser optics, mirror blocks, and other optical systems enable wafer exposure at resolution in the nanometer range, forming a basis for smaller, more efficient, and more powerful microchips. The lithography portfolio includes High-NA-EUV lithography, EUV lithography for cost-effective and energy-efficient microchips, DUV lithography for efficient high-volume microchip production, synchrotron optics for research, and high-precision optical modules and components for wafer inspection. ZEISS SMT optics and mirrors are also used in synchrotrons for fundamental physical research, extending the optical-system portfolio beyond semiconductor exposure applications. Photomask solutions detect, analyze, and repair defects on photomasks and measure and optimize specific mask properties so that defect-free photomasks can be produced for microchip manufacturing. Mask repair solutions repair hard and soft defects, AIMS® evaluates mask defects according to their impact on subsequent production, PROVE measures the positional accuracy of structures on masks, and ZEISS tuning systems optimize specific mask properties. Digital solutions automate and optimize the photomask workflow, complementing the mask repair, qualification, metrology, and tuning functions in the photomask portfolio. Wafer fab solutions support sample preparation, global wafer shape control, and nanometer-accurate structure and defect review, with efficient 2D and 3D imaging used to stabilize processes and safeguard yield from front-end processing through advanced packaging. ZEISS NLX uses inline 3D X-ray laminography for non-destructive inspection and metrology of advanced-packaging structures on 300 mm wafers. ZEISS DUNE combines active wafer-shape control with integrated high-precision metrology to measure and correct global wafer warpage for advanced semiconductor manufacturing. ZEISS MultiSEM is a multi-beam scanning electron microscope for precise 2D analysis and fault diagnosis in semiconductor structures, with the portfolio description specifying 91 parallel electron beams for fast high-resolution 2D analysis. The 3D Metrology and Inspection Workstation uses FIB tomography to sample, analyze, and validate microchip volumes with nanometer precision. ZEISS Semiconductor Manufacturing Technology consists of three strategic business units: SMO for Semiconductor Manufacturing Optics, SMS for Semiconductor Mask Solutions, and SFS for Semiconductor Fab Solutions for high-volume wafer production. Within SMO, ZEISS develops highly precise optical systems including lithography optics for DUV, EUV, and High-NA-EUV, illumination systems, laser optics, optical modules for wafer and mask inspection, synchrotron optics, and X-ray gratings for research applications. Within SMS, the photomask portfolio covers metrology, tuning, qualification, and repair across a wide range of mask types and lithography techniques in the DUV and EUV spectral ranges. Within SFS, systems address inspection, metrology, defect analysis, and wafer-shape control, providing information used for analysis, process optimization, and problem resolution in manufacturing fine microchip structures. The SFS portfolio includes ZEISS INTUITIVE 3D and EXPLORE 3D FIB-SEM combinations for fast nanometer-accurate sampling and 3D analysis, together with ZEISS MultiSEM, ZEISS NLX, and ZEISS DUNE for complementary semiconductor process-control tasks. The portfolio also supports production of leading-edge microchips and chiplets, while the resulting microchips are used in household appliances, smartphones, computers, and tablets and underpin technologies such as automation, AI, and autonomous driving.
Capabilities and products
- DUV lithography
- EUV lithography
- High-NA-EUV lithography optics
- wafer-inspection optics
- photomask defect detection, analysis and repair
- AIMS® photomask defect-impact evaluation
- PROVE photomask pattern-position metrology
- photomask tuning
- photomask workflow automation
- 300mm-wafer packaging 3D X-ray laminography
- wafer shape and warpage metrology
- MultiSEM multibeam-electron 2D defect analysis
- FIB tomography 3D metrology and inspection
- semiconductor sample preparation