At a glance
| Booth | P5107 |
| Country | SG |
| Website | www.capconsemicon.com |
Company profile
Capcon Limited Co., Ltd is an equipment manufacturer serving the advanced semiconductor assembly and packaging industry with high-end products and solutions for backend manufacturing applications. Its stated global service presence covers Singapore, Taiwan, Philipine, Beijing, and Shenzhen, giving the company service coverage across several locations in Asia. Capcon Limited Co., Ltd links its equipment development to strong market demand for advanced assembly and packaging processes and states that its team provides unique solutions with state-of-art technologies for those process requirements. The company states that its product line is well reputed among OSAT, IDM, and Memory Manufactureres, identifying those groups as customer types for its advanced assembly and packaging equipment. Capcon Limited Co., Ltd serves a range of advanced assembly and packaging process requirements within its stated semiconductor backend market focus. The company positions its work in the advanced assembly and packaging portion of the semiconductor backend market and develops equipment configurations around the diversity of those processes. Capcon Limited Co., Ltd states that the flexible configuration of its products is intended for process diversity and user customization, allowing equipment configurations to be adapted to different process requirements. Alongside its technical products, Capcon Limited Co., Ltd provides personalized customer care and immediate support and states that customers can be sure their investment is safe with this combination of products and support.
Exhibits
The equipment lineup includes Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, and Multi-Chip Die Bonder for advanced semiconductor backend assembly and packaging. Flip-Chip Bonder is part of the stated solution set for advanced assembly and packaging, together with Chip-on-Wafer Bonder and Package-on-Package Bonder. Stack Die Bonder, Pannel-Level Die Bonder, and Multi-Chip Die Bonder extend that lineup to stack-die, panel-level, and multi-chip bonding requirements within the same backend market focus. The equipment is associated with processes including FOWLP(Face Up/Down), POP, MCM, EMCP, Stack Die, SiP, 2.5D/3D, FCCSP, and FCBGA, providing a product set for varied assembly and packaging flows. Capcon Limited Co., Ltd describes its major products as high-precision, high-speed, and high-relaibility equipment designed to ensure high prductivity in the targeted assembly and packaging processes. The products can be flexibly configured for process diversity and user customization, and the equipment offering is accompanied by personalized customer care and immediate support.
Capabilities and products
- Flip-Chip Bonder
- Chip-on-Wafer Bonder
- Package-on-Package Bonder
- Stack Die Bonder
- Panel-Level Die Bonder
- Multi-Chip Die Bonder