At a glance
| Booth | P5107 |
| Country | SG |
| Product categories | Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems |
| Website | www.capconsemicon.com |
Company profile
Capcon Limited is an equipment manufacturer aiming to provide high end products and innovative solutions to the advanced semiconductor assembly and packaging industry. Our current global service presence in Singapore, Taiwan, Philipine, Beijing, Shenzhen. Driven by the strong market demand on advanced assembly and packaging process, Capcon provides unique solutions with state of art technologies by our excellent team. Our product line is well reputed among OSAT, IDM, Memory Manufactureres..etc. Process covers FOWLP(Face Up/Down), POP, MCM, EMCP, Stack Die, SiP, 2.5D/3D, FCCSP, FCBGA, etc. Positioned on the advanced assembly & packaging of semiconductor backend market, Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder, etc. Our major products have high-precision, high-speed, high-relaibility, ensuring high prductivity. The flexible configuration of our products is born for process diversity and user customization. Customers can be sure that their investment is safe with not only our strong technical products but also our personalized customer care and immediate support.
Capabilities and products
- Chip-on-Wafer Bonder
- FOWLP face-up and face-down process equipment
- Flip-Chip Bonder
- Multi-Chip Die Bonder
- POP, MCM, EMCP, Stack Die, SiP, 2.5D/3D, FCCSP and FCBGA packaging processes
- Package-on-Package Bonder
- Pannel-Level Die Bonder
- Stack Die Bonder
- advanced semiconductor assembly and packaging equipment
- die sorter, pick and place and flip chip placement systems