At a glance
| Booth | S8030 |
| Country | TW |
| Website | www.c-tech.net.tw |
Company profile
C-TECH Technology Co., Ltd. was established in May 2010, initially as a manufacturer of electronic materials. The company identifies semiconductor business as one of its business areas and operates as a Taiwan supplier of semiconductor-related materials and thermal-solution products. Its business scope combines semiconductor-material categories with heat-solution categories, linking packaging-interconnect materials with thermal and electronic material needs. C-TECH Technology Co., Ltd. operates as a supplier of packaging interconnect materials and thermal or electronic materials rather than as a wafer fab or packaging house. Its product categories therefore cover both semiconductor packaging interconnect needs and heat-management needs for electronic applications.
Exhibits
C-TECH Technology Co., Ltd. makes heat-sink heat-dissipation pins from metal wire using cold-heading technology and forms them into required shapes, which helps keep tooling cost lower than with an extrusion process. After a head is formed on a pin made from round wire, the pin is brazed onto a heat-sink plate to form the heat sink. The company can handle different heat-dissipation pin lengths and different heat-sink-plate surface layouts, including long pins intended to provide high heat-dissipation capability. These pins are used for semiconductors, integrated-circuit parts, laminates, heat sinks, and other applications, with heat spreading and heat dissipation as their main purposes. Hybrid electric vehicles and electric vehicles use many electronic components that require heat dissipation, including control CPUs and inverters, and the company states that its heat-sink pins meet these requirements. For semiconductor packaging interconnects, C-TECH Technology Co., Ltd. can produce and sell copper pillars with diameters from 60μm to several hundred μm. These copper pillars are described as suitable for installation in next-generation fine-pitch 2.5D or 3D packaging. The company also identifies copper pins, posts, and pillars as interconnect structures inside semiconductor packages. Its semiconductor-material offering additionally includes copper pillars, copper columns, and copper chip micro terminals for packaging-interconnect uses, including use as bump alternatives. Listed application formats for these interconnect products include PoP, FOWLP, SiP, SoC, 2.5D, 3D, and interposers. Copper or copper-alloy terminals are available with plating options including Sn, Ni, Au, and SAC305. The same product range is presented alongside heat-solution products, allowing the company's semiconductor-material and thermal-product categories to serve both interconnect and heat-dissipation requirements.
Capabilities and products
- cold-heading heat-sink pin manufacturing
- heat-sink pin processing in different lengths and layouts
- 60μm-to-hundreds-μm copper pillars for 2.5D/3D packaging