At a glance
| Booth | J3134 |
| Country | TW |
| Product categories | Ball Placement; Attach Systems · Cleaning; Washing Equipment for Assembly & Packaging · Die Bonding; Attach Equipment · Die Removal Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Wire Bonding Equipment · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Wire Bonding Inspection; Test · Wafer Level Bonders · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Scribe Tools; Saw or Dicing Blades and Accessories · Solder; Solder Balls and other Soldering Materials · End-Sealing Material · Plasma; Ion Sources · Robotics; Transfer Systems |
| Website | www.bondtronics.com.tw |
Company profile
The company's main business is bonding-related manufacturing processes. About bonding, Bondtronics will help you. Whether it is Die Bonding, Wire Bond, Plasma clean, Vacuum Reflow Oven, HotBar... The products cover industries include SMT/PCB assembly, IC Packaging,semiconductor packaging, LED manufacturing, FPD, Solar Cell/Module solar cells/modules, Customers include Taiwan and China, also includes academic units and scientific research units. "Provide customers with the best solutions and become the best partner trusted by customers."
Exhibits
Equipment with multiple pressure heads has stable pressure control
Capabilities and products
- HotBar bonding processes
- bonding equipment with multiple pressure heads and stable pressure control
- bonding process equipment for IC and semiconductor packaging
- die bonding processes
- plasma cleaning processes
- vacuum reflow ovens
- wire bonding processes