At a glance
| Booth | J3134 |
| Country | TW |
| Website | www.bondtronics.com.tw |
Company profile
Bondtronics Technology Incorporation's main business is bonding-related manufacturing processes, and the company presents itself as a supplier that helps customers address bonding requirements. Die Bonding is included in the company's bonding-related manufacturing scope. Wire Bond is also included among the bonding processes supplied by Bondtronics Technology Incorporation. Plasma clean is listed as another process within the company's bonding-related offering. Vacuum Reflow Oven capability is part of the same bonding-focused product and process scope. HotBar is likewise included in the company's listed bonding-related capabilities. The product coverage extends to SMT/PCB assembly, linking the bonding-related portfolio with electronics assembly applications. IC Packaging is another industry area covered by the company's products. The company separately lists semiconductor packaging within the industries served by its product range. LED manufacturing is included among the application industries addressed by Bondtronics Technology Incorporation. FPD is also included in the company's stated industry coverage. Solar Cell/Module applications are part of the same product-coverage list for solar cells and solar modules. Bondtronics Technology Incorporation serves customers in Taiwan. Its customer coverage also includes China. Academic units are included among the customer types served by the company. Scientific research units are also included in its customer base. Across these markets and customer groups, the company frames its role around providing solutions for bonding-related manufacturing needs. Its stated business objective is to provide customers with solutions and to become a partner that customers trust. The combined scope therefore brings multiple bonding process categories together with electronics assembly, packaging, display, LED, and solar-cell or solar-module industry coverage. The customer profile spans commercial customers in Taiwan and China as well as academic and scientific research organizations. The listed process mix combines die- and wire-bonding work with plasma cleaning, vacuum reflow, and HotBar capability under one bonding-related manufacturing focus. Its application coverage spans assembly and packaging activities as well as LED, FPD, and solar-cell or solar-module production environments. This customer and application scope places the same bonding-focused business across commercial manufacturing, academic use, and scientific research use.
Exhibits
Bondtronics Technology Incorporation supplies equipment with multiple pressure heads and stable pressure control. The multi-pressure-head equipment is presented specifically around the stability of its pressure-control capability.
Capabilities and products
- Die Bonding equipment and process solutions
- Wire Bond equipment and process solutions
- Plasma clean equipment and process solutions
- vacuum reflow ovens
- HotBar bonding equipment