At a glance
| Booth | M0438 |
| Country | NL |
| Website | www.besi.com |
Company profile
Besi (BE Semiconductor Industries N.V.), together with its Datacon, Esec, Fico and Meco members, manufactures flip-chip and multi-chip die-bonding equipment, epoxy and soft-solder die-attach equipment, die-sorting equipment, wire-bonding equipment, packaging equipment and plating equipment. Besi provides an advanced-packaging equipment flow that spans die sorting through singulation from one supplier. The company is a supplier of semiconductor assembly equipment to the global semiconductor and electronics industries, with equipment positioned around accuracy, productivity, reliability and low cost of ownership. Its assembly processes and equipment address leadframe, substrate and wafer-level packaging applications across end markets including electronics, mobile internet, computers, automotive, industrial, LED and solar energy. Its customer base is described as primarily leading semiconductor manufacturers, assembly subcontractors, electronics companies and industrial companies. Besi organizes its main equipment offering around die attach, packaging, and plating and cleaning product groups. Besi Netherlands is headquartered in Duiven in the Netherlands and operates service centers in Europe, Asia and the USA.
Exhibits
The Datacon 8800 CHAMEO ultra plus AC Hybrid Bonding platform is designed for ultra-high placement accuracy at high throughput for next-generation advanced packaging and high-end modules. Its cleanliness concepts and optical-alignment solutions are used to support placement performance for high-density interconnects and 3D integration. Besi supports hybrid-bonding process development with knowledge spanning material preparation, tooling design and metrology. Demonstrations and sample builds using customer material can be performed on live machines in Besi laboratories in Singapore or Radfeld, Austria. High-resolution cameras combined with optical solutions are used to achieve high placement accuracy. For the hybrid-bonding working area, the machine can provide an ISO3 atmosphere to address the cleanliness requirements of the process. Thin-die handling knowledge from other Besi platforms is integrated into the machine, together with alternative ejection solutions. In-situ IR inspection provides immediate placement-accuracy feedback without unloading material and is used to improve yield and throughput. Flexible production loading is supported through multi-chip handling with integrated tool-changing solutions. Full factory automation is available, including completely automatic product changeover triggered by the host system. Beyond a stand-alone bonder with EFEM loading, Besi also offers a one-stop cluster-integration approach in cooperation with Applied Materials. The hybrid-bonding offering combines upstream pre-processing know-how with Besi bonding technology as an integrated production approach. Across die attach, Besi offers systems for multi-chip advanced packaging, epoxy and soft-solder bonding, high-precision flip-chip mass production, stacked-die bonding and die sorting. The named die-attach portfolio includes Datacon 8800 CHAMEO ultra plus AC for Hybrid Bonding and 9800 TC next for Thermo Compression Bonding. Multi Module Attach systems include Datacon 2200 evo, Datacon 2200 evo plus, Datacon 2200 evo hF, Datacon 2200 evo hS and Datacon 2200 evo advanced, with the advanced-packaging platform supporting die attach, multi-chip and flip-chip applications. Die Bonding systems listed include Esec 2100 hS iXplus, Esec 2100 sD advanced i, Esec 2100 hSi, Esec 2100 hS and Esec 2100 SC, together with Strip Mapping E142 on the Esec Die Bonder. Soft Solder Die Bonding models include Esec 2100 SSI, Esec 2009 SSIE and Esec 2009 fSE, and the soft-solder equipment is described as fully automated for the power-semiconductor mass market. Flip Chip systems include Datacon 8800 FC QUANTUM advanced, Datacon 8800 FC QUANTUM advX, Datacon 8800 CHAMEO advanced and Esec 2100 FC hS, covering mass-production and high-end flip-chip processes. Thermo Compression Bonding systems are positioned for precise and reliable advanced-packaging applications, while Hybrid Bonding is positioned for ultra-high accuracy and high throughput in next-generation semiconductor applications. The die-sorting equipment incorporates advanced technologies and is intended to cover a wide variety of sorting processes. The Fico Packaging product group designs and manufactures molding, trim-and-form and singulation systems that can process a wide variety of package types. Automatic and manual Fico systems use the same molds or tools, allowing a process to be optimized without changing production capacity for the tooling transition. Packaging machinery can be configured for customer-specific needs, and the system flexibility supports both high-volume device production and small production runs of specialized chips. The packaging equipment also supports the introduction of new package types. The molding lineup includes AMS-X, MMS-X, Fico Molding Line, Fico AMS-LM, Fico AMS-LM Top Foil, Fico MMS-LM, Fico MMS-LM Top Foil, Fico AMS-i and Fico MMS-i. Fico molding systems include automatic and manual configurations for high-volume output, while the Fico Trim & Form product line is designed to cut and form a wide range of lead shapes, including HD. Trim-and-form equipment includes Fico Compact Line - X and Fico Compact Line - P, and singulation is represented by the Fico Sawing Line. Packaging accessories and services include Process Technology, Fico Trim & Form Tools, Saw Conversion Kits and Fico Molds, supported by a dedicated Process Technology and Engineering Department. For plating and cleaning, Meco manufactures continuous plating and leadframe-cleaning systems for the electronics industry. The listed plating and wet-processing range includes Meco CDL 1500 and Meco FXL for leadframe wet processing; Meco ACP, Meco RTR Ag and Meco EDF/EPL for leadframe plating; and Meco Connector Plating for connector applications. Additional named Meco systems cover solar plating with Meco DPL, Meco PPL, Meco RTR Solar and Meco CPL, plus film-and-foil plating with Meco FAP. The chemistry and tooling list includes Mecodeflash 100, Surclean 201 - 204, Mecorinse 500, Mecostrip Au 2, Mecostrip Ag-ID 1(Alt) and Meco EPL 4.
Capabilities and products
- flip-chip and multi-chip die-bonding equipment
- epoxy and soft-solder die-attach equipment
- die-sorting equipment
- wire-bonding equipment
- high-accuracy high-throughput Hybrid Bonding equipment
- Thermo Compression Bonding equipment
- semiconductor molding equipment
- Trim & Form equipment
- semiconductor singulation equipment
- plating and leadframe-cleaning equipment