At a glance
| Booth | M0438 |
| Country | NL |
| Product categories | Cut & Down Set; Trim; Form Equipment · Die Bonding; Attach Equipment · Die Removal Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Molding; Encapsulation; Decapsulation Equipment · Plating; Electro Chemical Plating for device assembly · Printing Equipment; Screen-printing; Alignment ; Film Printing · Solder Reflow; Soldering & Brazing Equipment · Wafer Level Bonders · Wire Bonding Equipment · Cells · Other · Thin Film · Stand-Alone Systems |
| Website | www.besi.com |
Company profile
BE Semiconductor Industries N.V. (Besi) with its members Datacon, Esec, Fico, and Meco, is a leading manufacturer of flip chip and multi-chip die bonding, die attach (epoxy and soft solder), die sorting, wire bonding, packaging and plating equipment. Besi offers the most complete advanced packaging solution from die sorting to singulation – all from one source.
Exhibits
Besi’s Hybrid Bonding platform Datacon 8800 CHAMEO ultra plus AC provides ultra-high accuracy at high throughput for the next generations of advanced packaging and high-end modules. Innovative cleanliness concepts in combination with exceptional optical alignment solutions ensure excellent placement performance, making it the tool of choice for high-density interconnects and 3D integration. Focusing on process development, Besi is the best partner to build up Hybrid bonding production capability with highest yield and performance standards in your production floors. By continuously investigating and developing the Hybrid bonding process with all its related aspects, Besi is maintaining the leadership in this emerging technology. Customers will profit from our in-depth knowledge starting at material preparation over tooling design to metrology. Demonstrations and sample builds with your material can be done on a live machine in one of our labs, either in Singapore or Radfeld (Austria). We are happy to invite you for a visit. Contact us today for more information. Allows for highest placement accuracy through innovative optical solutions in combination with high resolution cameras. Hybrid bonding requires highest cleanliness levels to ensure best yield performance, our machine can provide an ISO3 atmosphere in the working area. Knowledge in thin die handling from other Besi platforms integrated in this machine are available, as well as alternative ejection solutions. Yield and and throughput improvement by in-situ IR inspection capability, immediate feedback of placement accuracy without need of unloading material. Flexible production loading through multi chip handling with integrated toolchanging solutions. Full factory automation available, completely automatic product changeover triggered from the host system. Beside the stand-alone configuration of one bonder with EFEM loading, the unbeaten one-stop cluster integration solution in cooperation with our partner Applied Materials can be offered. Fully unleash the process know-how of the whole pre-processing landscape in combination with the leading bonding technology from Besi.
Capabilities and products
- Datacon 8800 CHAMEO ultra plus AC hybrid bonding platform
- ISO3 atmosphere working area for hybrid bonding
- advanced packaging solution from die sorting to singulation
- die attach equipment for epoxy and soft solder
- die sorting equipment
- flip chip and multi-chip die bonding equipment
- in-situ IR inspection
- optical alignment with high-resolution cameras for placement accuracy
- packaging and plating equipment
- wire bonding equipment