At a glance
| Booth | Q5658 |
| Country | KR |
| Website | www.aurostech.com |
Company profile
AUROS Technology, Inc. was founded in 2009 and specializes in measuring equipment for semiconductor processes. In 2011, the company states that it achieved the first domestic mass production of overlay metrology equipment and then supplied its technology to major customers in the global semiconductor market. AUROS reports an excellence grade in the technical evaluation of a specialized assessment institution. It also states that it was selected as a small hidden champion in the materials, components, and equipment field, recognition that it associates with its measurement-equipment capabilities. The company is developing additional measurement and inspection equipment while continuing to enhance its overlay metrology technology. AUROS identifies creativity and a challenging spirit as core values and sets a goal of contributing to both domestic and global semiconductor markets through product development. Its stated strategy is to use advanced technology to compete in a measurement market currently occupied by global competitors and to develop products intended for use across markets worldwide. A stated purpose of the company's ongoing equipment development is to provide customers with solutions beyond its established overlay-metrology platform. AUROS presents its technical-development program as serving both the domestic semiconductor sector and the wider global semiconductor market. The company's measurement-equipment identity, its 2011 overlay-metrology milestone, and its subsequent development of inspection equipment form the main stages described in its corporate technology story.
Exhibits
AUROS organizes its semiconductor measurement portfolio into Overlay, Warpage, 3D Height, and Thickness product families. The Overlay family includes OL-1000n, OL-900n, HE-900 PAD, HE-900ir, and OL-100n systems. Its Warpage systems are WaPIS and TC WaPIS, while the 3D Height family includes MT-30T and METIS-PS. The Thickness family comprises AEliT F300 and AEliT F200. For the OL-1000n overlay system, AUROS highlights high throughput together with high-resolution imaging and a large field of view. The same OL-1000n feature set includes tunable wavelength or dual-band operation and a dual-camera system. OL-1000n is also listed as compatible with 12-inch automation and as a standalone system. Together, the named systems cover overlay metrology, wafer warpage, three-dimensional height, and thickness measurement needs across semiconductor processes. OL-1000n is listed with Highest Throughput, High Resolution & Large FOV Imaging, Tunable Wavelength / Dual Band, Dual Camera System, 12inch automation compatible, and Standalone System features. Highest Throughput and High Resolution & Large FOV Imaging are separately named in the OL-1000n feature list. Tunable Wavelength / Dual Band and Dual Camera System are also listed as OL-1000n features. The OL-1000n feature list also includes 12inch automation compatible and Standalone System. WaPIS and TC WaPIS are the named systems for warpage measurement, separating wafer-shape measurement from the company's overlay, height, and thickness product groups. MT-30T and METIS-PS are grouped under 3D Height, while AEliT F300 and AEliT F200 are grouped under Thickness. The product lineup includes named systems in Overlay, Warpage, 3D Height, and Thickness categories for semiconductor measurement work.
Capabilities and products
- semiconductor overlay metrology equipment
- wafer warpage measurement equipment
- 3D height measurement equipment
- wafer thickness measurement equipment