At a glance
| Booth | I2130 |
| Country | TW |
| Website | www.atotech.com |
Company profile
Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, the Atotech portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. Its solutions serve a wide range of end markets, including datacenter, consumer electronics and communications infrastructure, together with industrial and consumer applications such as automotive, heavy machinery, and household appliances. With well-established innovative strength and an industry-leading global TechCenter network, MKS delivers pioneering solutions through the Atotech brand, combined with unparalleled on-site support for customers worldwide. In electronics, Atotech develops, produces and sells plating chemicals and equipment for printed circuit boards, package substrates, semiconductors, leadframes and connectors, and works directly with customers, OEMs and Tier 1 suppliers to understand market, technology and future product requirements. The global TechCenter network keeps technical support and consultation close to customers, while a worldwide service and support network extends assistance to installed production equipment. In Taiwan, listed operations include a main office and sales office in Taipei, a sales office in Taoyuan, a customer support lab in Kaohsiung, and TechCenter Electronics plus chemistry production in Guanyin. The wider network includes a European regional headquarters with research and development, TechCenter Electronics, TechCenter General metal finishing and sales functions in Berlin; equipment manufacturing, research and development, a TechCenter and sales in Feucht; and production and chemistry production in Neuruppin. In Asia, listed capabilities include TechCenters in Shanghai and Guangzhou, chemistry production and equipment manufacturing in Guangzhou, chemistry production in Yangzhou, a Far East regional headquarters and TechCenters in Yokohama, chemistry production in Koda and Jangan, an FEC competence center and TechCenter Electronics in Singapore, and chemistry production in Penang. The network also lists chemistry production and sales in Gurugram, research and development plus electronics and general metal finishing TechCenters at the Atotech Development Center in the Gurugram area, customer support laboratories in Bengaluru, and customer service laboratories in both Ho Chi Minh City and Hanoi. In the United States, Rock Hill is listed with regional-headquarters, chemistry-production, TechCenter Electronics and TechCenter General metal finishing functions, while the Detroit-area operation includes a customer analytics laboratory and warehouse.
Exhibits
Atotech provides advanced wet chemical processes, production equipment and service for manufacturing printed circuit boards, package substrates, semiconductors, leadframes and connectors, with portfolio areas spanning surface treatment, desmear and metallization, electrolytic plating, final finishing, leadframe and connector solutions, semiconductor solutions, equipment and industrial digital solutions. Its horizontal equipment and wet chemical process technologies cover surface treatment, metallization, electrolytic plating and final finishes as well as pad metallization, copper pillar, RDL, TSV and dual damascene plating, while the combined horizontal and vertical portfolio addresses growth areas including next-generation smartphones, electrical and autonomous vehicles, the Internet of things, 5G, virtual reality and artificial intelligence. For advanced mobile devices, the chemical process technologies and equipment are used to build complex flex and rigid-flex, multilayer and HDI printed circuit boards using mSAP technology, as well as package substrates, semiconductors, leadframes and connectors. For automotive applications, the product range supports manufacture of printed circuit boards, package substrates, semiconductors, leadframes and connectors used in engine and body control units, power train, mechatronics, lighting, information and entertainment systems, sensors, radar, cameras and ADAS modules. The Optimize the interconnect℠ approach combines Atotech plating equipment and process chemistries with ESI laser drilling systems, bringing Atotech systems technology and chemical processing expertise together with ESI via-drilling expertise for complex PCB and package-substrate manufacturing and future roadmaps. Uniplate® PLB is a systems solution for advanced substrates that is designed to minimize consumption of energy, water and chemistry and is optimized for high automation, repetitive high-quality production results, and the next phase of industrial internet of things and Smart Factory production. Featured electronics products include ViaKing® as an enhanced graphite-based direct metallization process, Silvertech® C for highest wear-off performance and longer lifetime, Spherolyte® Cu UF5 for high-speed copper pillar plating with outstanding uniformities, and vPlate® as vertical continuous copper plating equipment. After-sales support covers the path from product selection through installation and ongoing support, including service, retrofit and spare parts for production equipment. For semiconductor manufacturing, Atotech offers integrated wet chemical processes for pad metallization, copper pillar, RDL, vias and dual damascene, including electrochemical deposition processes and equipment, plating for RDL, vias, pillars and solder applications, electroless deposition for pad metallization and RDL housing in applications such as power semiconductors, and electrochemical dual damascene solutions for interconnect technology. Semiconductor applications include ENEPIG pad metallization for power chips and memory, RDL, micro-via and pillar plating for FOWLP and FC-CSP, micro-via and through-silicon-via plating for sensors and 3D stacking, double-sided metallization for power chips such as IGBT and MOSFETS, and interconnect metallization for logic, memory and power ICs. For advanced packaging RDL and micro-via plating, Spherolyte® Cu UF3 is a high-purity copper process for RDL and micro-via deposition, while Promobond® AP2 is an adhesion promoter for next-generation packaging. For pillar plating and soldering, Spherolyte® Cu UF 5 is a high-speed copper pillar process with outstanding uniformities, high purity and full shape control; Spherolyte® Ni provides an all-liquid process for nickel barrier-layer plating; Spherolyte® NiFe is an all-liquid ECD NiFe electrolyte for barrier plating and electromagnetic shielding; Spherolyte® SnAg 2 is a highly uniform and reliable tin-silver process for solder applications; and Spherolyte® Sn is a process for highly uniform, pure-tin solder-depot plating. For ENEPIG pad metallization and RDL housing, the Xenolyte® suite deposits hard, corrosion-free and stress-minimized metal stacks for under-bump metallization, helping protect underlying active structures and provide a robust, stable and low-resistance solder-joint connection to the IC substrate; Xenolyte® Ni covers low- to mid-Pd and high-temperature electroless nickel plating, Xenolyte® Pd deposits pure palladium electrolessly, and Xenolyte® Au provides cyanide-free and cyanide-based immersion and autocatalytic gold processes. For logic, memory and power-IC interconnect metallization, the portfolio addresses wet metallization compatible with extremely thin seed layers for copper damascene BEOL interconnects and void-free filling of pre-plate openings for copper and cobalt interconnects; Everplate® 2XT is an additive suite for advanced damascene copper technology nodes, and Everplate® Cu 300 FG provides low-temperature-annealing copper for next-generation bonding. High-purity chemistry for the semiconductor industry is produced according to the latest and most stringent semiconductor-industry requirements at a 1,500m² manufacturing facility near Berlin in Germany equipped with highly automated manufacturing equipment and enclosed production environments. For inline processing, the equipment portfolio covers printed circuit boards including HDI, MLB, flex and flex-rigid boards, IC substrates and advanced packaging, with a systems approach that supplies chemistry, equipment, process know-how, service and spare parts and lists two production sites in Germany and China. Uniplate® P provides horizontal permanganate desmear with high throughput for multilayers, thicker boards, HDI boards and bare laminate boards used in semi-additive processes, gives the best results with almost all available base materials except chemical non-resistant substrates and materials containing acrylic adhesives, and has more than 450 lines installed for high-volume production of MLBs, HDIs and IC substrates for high-end applications such as mSAP/amSAP, with transportation capability down to 25µm + 2×2µm Cu clad. The next-generation New Uniplate design builds on the Uniplate® PLB platform with reduced footprint, enhanced maintenance and user friendliness, energy-consumption reductions, new pump technology and sustainable process control, while fine-line capability is supported by solutions for particle avoidance and reduction. For Uniplate® P, equipment features include stainless-steel sweller and permanganate modules, integrated stainless-steel filtration, the patented Oxamat® permanganate-regeneration system with a resource-saving rinse concept, automation and process control using production data for FAB 4.0, and patented flood-bar technology. Polygon P-Line desmear equipment targets multilayer, rigid-flex and HDI panel processing and is available at line speeds up to 3.5m/min with transportation systems for 24“ and 28,5“ wide panels; it adds water- and chemistry-saving measures, ultrasonic devices for sweller and permanganate, steam or hot-water heating that can use existing customer heat sources, and patented flood-bar technology. Uniplate® LB is the leading horizontal electroless copper plating line and the world standard for classical horizontal through-hole metallization, with systems for a wide variety of board thicknesses and sizes, more than 405 lines installed for high-volume MLB, HDI and IC-substrate production in applications such as mSAP/amSAP, and transportation capability down to 25µm + 2×2µm Cu clad. The Uniplate® LB equipment set combines patented flood-bar through-hole metallization, efficient pump circuits, FAB 4.0-ready automation and production-data use, and chemistry analysis, while Polygon LB-Line adds line speeds up to 3.5m/min for 24“ and 28,5“ wide panels, throwing power in through holes and blind microvias, automated cup dosing, steam or hot-water heating and semi-automatic cleaning. Uniplate® NP is designed for the Neopact direct plating process and is suitable for all base materials including Teflon, supporting direct plating where broad substrate compatibility is required. Uniplate® CP is a horizontal conveyorized system for the Ecopact conductive-polymer direct plating process in HDI, MLB and flex or flex-rigid production; it is compatible with a wide range of base materials and supports BMV and direct-pattern plating, patented flood-bar through-hole metallization, efficient pump circuits, FAB 4.0-ready automation and a low space requirement. More than 1050 Uniplate copper platers have been purchased since the equipment was released in 1987, progressing from DC to InPulse1 and then Uniplate Cu InPulse2 for high-end mass production including through-hole filling, blind-microvia filling and conformal plating, with pulse rectifiers, frequency-controlled high current density, insoluble anodes, inline filtration and FAB 4.0-ready automation among the equipment features. vPlate® is a vertical electrolytic copper solution for touch-free manufacturing that supports technologies such as (a)mSAP, SAP, ETS and coreless production across HDI, substrate-like PCB, advanced-HDI and IC-substrate architectures; insoluble anodes with adjustable anode and cathode shielding provide plating uniformity better than ±8%, and touch-free transport handles ultra-thin panels down to 36µm + 2×2 Cu clad. vPlate® also provides a user-focused HMI and control system, fully automatic handling with automatic copper and chemistry replenishment, line-layout flexibility, and energy and water efficiency using specialized motors and cascade-rinsing technology. G-Plate® is a vertical desmear and electroless-copper platform for advanced package substrates and fine-line technologies that supports next-generation SAP, line-and-space capability down to ≤5/5 µm and materials such as ABF for ultra-thin laminates; its single-panel processing, equalised curtain flow and particle control support electroless copper deposition below 150 nm, nm-scale uniformity of ≤2% 1σ, high throwing power in blind microvias and a 100% filtered solution supply for clean-room-compatible production. The Horizon Bondfilm® family integrates bonding enhancement and surface treatment, including inner-layer bonding and improved CO2-laser absorption before laser direct drilling, together with chemical processing, thin-material conveyance and advanced fluid delivery; equipment features include automatic discharging, cascade rinsing, automated panel tracking, FAB 4.0-ready process control, analyzer monitoring with automatic dosing control and patented flood-bar technology. Polygon Stannatech LINE® provides immersion-tin deposition for printed circuit boards and sets the world standard in thinnest tin deposition, with verification by all major automobile manufacturers; Crystallizer™ and ConStannic™ control support multiple Pb-free soldering and press-fit technology, and more than 130 Horizon Stannatech lines form its installed reference base. With more than 1,100 production lines in operation worldwide, service offerings include maintenance, original spare parts, retrofit solutions and auxiliary equipment for Uniplate®, Horizon®, MultiPlate®, Polygon®, G-Plate® and vPlate® lines, with on-site technical assistance, fast parts delivery and installation, long-term service plans, proactive maintenance and customized retrofits available through the global service network. The Universal Transport System family, comprising UTS-XL, UTS-s, UTS-xs and UTS-xs+, is designed to let desmear, PTH and copper-plating equipment process a broad range of panel thicknesses, with UTS-xs+ extending safe thin-material transportation for Uniplate® P and LB lines.
Capabilities and products
- advanced surface modification process technologies
- electroless plating process technologies
- electrolytic plating process technologies
- PCB desmear and metallization
- horizontal electroless copper plating equipment
- PCB final finishing
- leadframe and connector plating
- semiconductor pad metallization
- copper pillar plating
- RDL plating
- TSV plating
- dual damascene plating
- plating chemicals and equipment supply
- graphite-based direct metallization process
- vertical continuous copper plating equipment
- plating-equipment service, retrofit and spare parts