ARS CO.,LTD.

At a glance

Company profile

ARS CO.,LTD. is a Japan-based electronics and semiconductor manufacturing-services company founded in 1972, with one-stop activities spanning wafer testing, semiconductor package assembly, EMS mounting and assembly, power products, and embedded-system development and manufacturing. Its semiconductor and electronics business structure includes OSAT semiconductor assembly, wafer test, EMS manufacturing, and switching power supply activities, positioning the company as a testing, assembly, and electronics-manufacturing partner in the semiconductor supply chain. The company's business portfolio also covers reliability testing and analysis, prototype services, and manufacturing outsourcing, adding development support and verification work around its core testing and assembly operations. In EMS mounting and assembly, ARS CO.,LTD. combines manufacturing technology with design and development, procurement, mounting, and assembly services and reports manufacturing experience in industrial equipment, medical, communications, and amusement fields. For embedded systems, the company supports both software and hardware development in coordination with its other businesses, including design-only work and small-lot prototyping within a development system that considers reliability from prototype through mass production. For power products, アルス株式会社 carries forward the Eater brand and applies its analog-technology expertise to power-supply development, with standard and custom products forming part of the broader electronics-manufacturing portfolio. The company also performs reliability testing and analysis associated with its internally developed semiconductor-package products and offers those established test and analysis techniques for customer problems from one-unit spot requests through mass-production inspection.

Exhibits

ARS CO.,LTD. performs electrical testing on customer wafers and, using tester and prober systems, supports 100 mm to 300 mm wafers in logic, analog, and mixed-signal test domains with an established testing environment and quality-control system. Its wafer-test and laser-trimming test environment includes mixed-SoC tester platforms from ADVANTEST such as T6575, T6577, T2000-LSMF, T7721, V93000 A-TH, and EVA100 P-Model, with individual configurations covering different I/O counts, frequencies, power, measurement, and analog functions. Analog-test resources include ShibaSoku WL22, WL25, and WL25V and SPANDNIX SX3010 systems, while prober resources include Tokyo Electron P-8 and P-12 series and ACCRETECH UF200 / 2000 and UF3000 series for multiple wafer sizes and temperature configurations. The listed prober environment covers 100mm, 125mm, 200mm, and 300mm wafer configurations, with high- and low-temperature capability reaching -40°C to 150°C on several platforms and -55°C to 200°C on listed UF3000-series configurations. Laser trimming uses ESI esi9275 at 1047 nm for 100mm to 200ｍｍ wafers, esi9350 at 1342 nm for 100mm to 200ｍｍ wafers, and esi9820 at 1342 nm for 150mm to 200ｍｍ wafers. Back grinding and laser grooving resources include DISCO DFG8560 for 150mm, 200mm, and 300mm wafers with #2000 / #6000 / #8000 finishing wheels, and DFL7161 for the same wafer sizes with a water-soluble protective film. Additional supporting equipment includes Camtek Falcon530 automated optical inspection for 200mm and 300ｍｍ, Espec PVHC-231M clean oven, Tiatech HOTEI PAT judgment for SPAT, DPAT, SBL, and SYL classification, and Harmotec HWC-0812-01 ultrasonic air cleaning and vacuum extraction. In semiconductor package assembly, ARS CO.,LTD. manufactures and inspects standard packages including SOT, SOP, SON/DFN, and QFN and also supplies custom packages and modules for sensor and communication devices, power devices / PMICs, and ultra-compact, low-profile, high-density designs from prototyping through mass production. Package-assembly support extends from process design and equipment or material selection through prototyping, mass production, and continuing quality assurance, with the company describing its role as an OSAT provider for new development requirements. Its domestic one-stop semiconductor back-end production system covers wafer testing, semiconductor assembly, SMD PCB assembly, and electronic-device assembly, and it can provide individual processes, partial processes, or integrated production flows. Laser Grooving Equipment supports wafers with Low-k films or wafers that are difficult to process by conventional blade dicing, Vacuum Reflow Equipment is listed for automotive-related assemblies such as power modules and PMICs, and Ball Mounting Equipment supports BGA packages and custom modules. Final-test services cover low-pin-count through high-pin-count devices, with experience in Logic, Mixed-Signal, and Analog devices, tester selection based on product specifications, and test-only service when requested. The same back-end service can scale from single-unit spot prototyping and small-volume trials to small-lot mass production, while storage services cover temporary or long-term storage with temperature and humidity management plus dust and ESD countermeasures when required. Beyond semiconductor back-end work, the EMS business provides a continuous service from design and development through procurement, mounting, assembly, and logistics-related needs for electronic equipment across industrial, medical, communications, and amusement applications. The power business lists 230 AC/DC standard models and 320 DC/DC standard models, together with experience developing more than 500 custom power-supply models for customer-specific specifications. Embedded-system services include software and hardware development, design-only support, and small-lot prototypes, with development organized around reliability from prototype work toward mass production. Reliability-test and failure-analysis services apply techniques established through the company's own semiconductor-package products and are available from one-piece spot requests to mass-production inspection. Prototype services use production equipment held across the company's businesses to support experiments and prototyping needed for semiconductor and electronic-component development, from spot fabrication through assistance toward mass production. Manufacturing-outsourcing services additionally support material procurement, manufacturing production, distribution processing, and inspection across multiple fields, combining customer and ARS technical capabilities and ideas in contract manufacturing work. Across these activities, ARS CO.,LTD. offers a connected path from wafer electrical test and laser trimming through package assembly, SMD and electronic-device assembly, reliability verification, prototyping, and outsourced production rather than limiting its role to a single back-end process.

Capabilities and products

• 100–300 mm wafer electrical testing
• Logic, Analog and Mixed-Signal wafer testing
• wafer laser trimming
• wafer back grinding and laser grooving
• 200/300 mm wafer automated optical inspection
• SOT, SOP, SON/DFN and QFN package manufacturing and inspection
• custom semiconductor packages and modules from prototyping to mass production
• one-stop semiconductor back-end contract manufacturing
• SMD PCB assembly
• electronic device assembly
• vacuum reflow for power modules and PMICs
• ball mounting for BGA packages and custom modules
• final testing for low- to high-pin-count devices
• electronic component reliability testing and failure analysis
• embedded software/hardware development and small-lot prototyping
• integrated EMS design, procurement, mounting and assembly services
• standard AC/DC and DC/DC power supplies
• custom power-supply development
• experimental prototyping through mass-production support
• outsourced procurement, manufacturing, distribution processing and inspection
• material and product storage and shipping services

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