At a glance
| Booth | J3046 |
| Country | KR |
| Website | www.apsystems.co.kr |
Company profile
AP Systems Semiconductor traces its foundation to 1994, when AP Systems Semiconductor began with accumulated know-how in equipment-control software and entered the semiconductor equipment market before expanding into display and broader manufacturing-equipment businesses. The company expanded from semiconductor equipment-control software into semiconductor equipment, mid- and small-sized LCD equipment, semiconductor process equipment for 300mm wafers, large-sized LCD equipment, AMOLED FAB equipment, and module equipment. For OLED panel production, AP Systems Semiconductor identifies ELA (Excimer Laser Annealing), LLO (Laser Lift-Off), and OLED Encapsulation as major equipment fields built on its equipment and laser-processing capabilities. Its business coverage includes Semiconductor, Display front-end process, Display back-end process, EV Battery, and Solar Cell equipment, reflecting a portfolio that extends beyond a single process or end market. Continuous and concentrated research and development is presented as the basis for creating new value in semiconductor and display manufacturing equipment, with continuing R&D investment tied to development of core equipment for changing industry requirements. AP Systems Semiconductor describes efficient equipment-control software, compatibility between software and manufacturing equipment, thorough follow-up management, leading technical development, and a broad process-equipment lineup as elements of its competitiveness. The company's stated philosophy emphasizes pioneering new fields through R&D and challenge, creating new value through technology, and maintaining trust with employees, clients, stockholders, and partner companies as it expands its business areas. AP Systems Semiconductor also identifies a future focus on smart-factory equipment groups that can contribute to the fourth industrial revolution, linking equipment development with automation-oriented manufacturing environments. Its domestic network includes Headquarters / Dongtan FAB1, Dongtan FAB2, Balan Branch, Cheonan Branch, and Cheonan FAB, while overseas corporations are identified in China, Vietnam, and the United States. The company presents ethical and legal task performance, fair standards in business activities, and a transparent corporate culture as part of its management framework alongside technology development and customer-oriented operations. Its stated vision includes growth in semiconductor and display manufacturing equipment together with equipment-control and automation technology, maintaining a direct link between its original software know-how and later equipment businesses.
Exhibits
AP Systems Semiconductor supplies a semiconductor equipment lineup that includes Rapid Thermal Process, Sputter System, Descum System, Laser Dicing, Laser De-bonder, Wafer Dicing, Laser Annealing, and Laser Ablation for processes including HBM, WLP, and PLP manufacturing. Rapid Thermal Processing (RTP) equipment heats wafers to high temperature for a short time with tungsten halogen lamps and is applied to processes such as implantation and diffusion. The Sputter System supports packaging structures that have progressed from wire bonding to Flip Chip, FOWLP/FOPLP, and 3D Packaging by depositing metal films identified as CPB, UBM, and RDL. The Descum System uses plasma treatment to remove scum from pattern sidewalls before electroplating or to modify the surface to improve adhesion when forming bumps for Flip Chip Bonding on a wafer. Laser Dicing uses lasers and high-precision scanner optics to cut and separate semiconductor chips mounted on a wafer into individual cells for semiconductor analysis processes. Laser De-bonder, identified as KORONA TM LD, uses laser technology, optical systems, and process modules to separate the device substrate from the carrier substrate in semiconductor HBM, WLP, and PLP manufacturing processes. Wafer Dicing is manufacturing-process equipment that cuts and separates semiconductor chips mounted on a wafer into individual cells. Laser Annealing selectively heat-treats the wafer surface with a triple-wavelength laser during front-end semiconductor processing for purposes including Dopant Activation and Silicidation. Laser Ablation is used in semiconductor packaging to selectively remove insulating materials, adding a laser-based material-removal function to the company's packaging equipment set. Beyond the semiconductor lineup, the equipment portfolio lists display front-end tools including Excimer Laser Annealing, Laser Lift-Off, Glass Encapsulation, ALD, Film Laser Cutting, and PECVD, plus back-end Module Lamination, Module Dispenser, and Module OCR Inkjet systems. The same business portfolio also lists EV Battery equipment including NG SORTER, TRAY WASHER, CELL TAPING, and CELL PACKING, and Solar Cell equipment identified as LEI, LDSE, and LCO. Across these systems, the company's equipment-control software background and continuing R&D are combined with process modules, optics, lasers, plasma treatment, thermal processing, and deposition equipment for manufacturing environments.
Capabilities and products
- Supply of rapid thermal processing (RTP) equipment
- Supply of semiconductor metal-film sputtering equipment
- Supply of semiconductor plasma descum equipment
- Supply of semiconductor laser dicing equipment
- Supply of semiconductor laser de-bonding equipment
- Supply of wafer dicing equipment
- Supply of semiconductor laser annealing equipment
- Supply of semiconductor packaging laser ablation equipment
- Supply of display excimer laser annealing equipment
- Supply of display laser lift-off equipment
- Supply of display glass encapsulation equipment
- Supply of display atomic layer deposition (ALD) equipment
- Supply of display film laser cutting equipment
- Supply of display plasma-enhanced chemical vapor deposition (PECVD) equipment
- Supply of display module lamination equipment
- Supply of display module dispensing equipment
- Supply of display module OCR inkjet equipment
- Supply of EV-battery NG sorting equipment
- Supply of EV-battery tray washing equipment
- Supply of EV-battery cell taping equipment
- Supply of EV-battery cell packing equipment
- Supply of solar-cell LEI equipment
- Supply of solar-cell LDSE equipment
- Supply of solar-cell LCO equipment