At a glance
| Booth | J2846 |
| Country | TW |
| Website | www.allring-tech.com.tw |
Company profile
All Ring Tech Co., Ltd., also identified as ART, was founded in 1996 and focuses on high-end technology automation equipment for semiconductor, passive-component, and LED manufacturing processes. The company has been certified to ISO 9001 since 2000 and was listed on the OCT market in 2002, providing two dated milestones in its quality and corporate development history. All Ring Tech Co., Ltd. has multiple locations across Asia, including its headquarters in Kaohsiung Science Park in Taiwan, a Kunshan plant in China, and a Shenzhen office in China. Under coordination and integration by the Kaohsiung headquarters, the company provides customized design, manufacturing, professional service, and cost-effective solutions to customers. Its process-technology platform is centered on precision engineering and process integration for semiconductor packaging equipment, combining dispensing, bonding, optical inspection, and automation to support high-density and high-power advanced packaging applications. Through integration of its core technologies, All Ring Tech Co., Ltd. states that it helps customers move from optimization of individual process steps toward scalable full-production capability with higher efficiency, yield, and stability.
Exhibits
The precision-control capability is built around alignment and force control, establishing the stable and high-accuracy process foundation used across the company's packaging-equipment platform. Micron-level positioning and precise motion control are used to reduce process variation and maintain stability and consistency in critical operations. The material-and-process capability supports a variety of adhesives and functional materials for heterogeneous-material integration and thermal processes. Integrated control of material behavior and process parameters is used to improve bonding quality and thermal-management performance. Optical inspection is centered on 2D visual inspection with real-time inspection and feedback during the process, enabling immediate quality judgments and abnormal-condition control. The integration-and-automation scope runs from standalone equipment to full production-line integration, linking dispensing, bonding, and inspection processes with automated handling and data connectivity. By connecting these processes through automation, the platform is intended to improve production-line efficiency and reduce variation introduced by human operation. The stated application fields include CPO photonics integration, precision dispensing, material attach for dissimilar-material integration, and thermal processes. The precision-control platform treats stable alignment and controlled force as the foundation for repeatable packaging operations, while micron-level positioning and precise motion control are used to keep critical process results consistent. For material integration, the company combines knowledge of adhesive and functional-material behavior with process-parameter control, using that combination to support heterogeneous-material attachment, thermal processes, bonding quality, and thermal-management performance. Its 2D visual-inspection approach does more than detect surface appearance: in-process inspection and immediate feedback are used for real-time defect judgment, abnormal-condition management, stronger process stability, and improved yield performance. At the line-integration level, automated handling and data connectivity link dispensing, bonding, and inspection so that the same core technologies can be applied from a standalone machine through a complete production line.
Capabilities and products
- semiconductor packaging dispensing and bonding automation integration
- micron-level positioning and precision motion control
- heterogeneous integration and thermal processes
- real-time 2D visual inspection
- full-line integration of dispensing, bonding, and inspection