At a glance
| Booth | P5912 |
| Country | JP |
| Website | www.agc-electronics.com.tw |
Company profile
AGC Inc. applies technologies developed across its glass, chemicals, and ceramics businesses, including material design, processing, surface treatment, and molding technologies, to its electronic materials business and advanced electronics applications. The AGC Group has business foundations across Japan, Asia, Europe, and the Americas, and combines its Glass, Electronics, Chemicals, Ceramics, and other businesses with advanced production technologies and a broad customer base built over more than 110 years. Its mission is to remain a first-choice solution provider by building long-term, trust-based customer relationships through distinctive materials and solutions created from a wide range of material and production technologies. The Group traces its corporate spirit, 'Never take the easy way out, but confront difficulties,' to its founder in 1907 and describes that mindset as a continuing driver of its business activities. AGC Inc.'s Taiwan electronics operation started in 2007 as a Hsinchu sales branch for semiconductor-related materials and sits within the AGC Group's Advanced Materials Division. That operation mainly handles CMP slurries, SiC materials, and chemical products and describes its business as providing value to customers under the Group motto of confronting difficult challenges.
Exhibits
For semiconductor CMP, AGC Inc. provides cerium-oxide slurry and polishing solutions as an integrated manufacturer from abrasive-particle production through slurry formulation, using planarization and selectivity-control technologies for poly-Si, SiO2, SiN, metals, and resins in front-end, back-end, and packaging processes. Its CMP capabilities include abrasive-particle design and manufacture, glass-polishing technology, chemical-liquid design, manufacturing and analysis, polishing-performance evaluation, and CES-300 Series and 330F Series ceria slurry for STI and ILD applications. ROICERAM™-HS silicon carbide combines high purity, high strength, low thermal expansion, acid resistance, and heat resistance, and AGC Inc. states more than 30 years of experience supplying parts for semiconductor manufacturing furnaces, mainly for high-temperature processes. ROICERAM™-HS applications include Si and SiC power-device semiconductor equipment, high-temperature oxidation and diffusion furnaces, LPCVD furnaces, MOCVD equipment for LED production, high-temperature diffusion furnaces for solar cells, precision optical structures, and aerospace uses. Its listed U-grade ROICERAM™-HS properties include bulk density 3.0×103 kg/㎥, flexural strength 230 MPa, Young's modulus 366 GPa, coefficient of thermal expansion 4.4×10-6/℃, thermal conductivity 180 W/(m・K), specific heat 0.7×103 J/(kg・K), and volume resistivity at 20℃ of 1×10-1 Ω・cm. The Synthetic Fused Silica Glass AQ series is a high-purity, high-quality functional glass developed from AGC Inc.'s accumulated R&D in fine glass, fine chemicals, and fine ceramics and is produced by the VAD method to reduce Si-OH content. AQ series glass transmits deep ultraviolet light below 200 nm from i-line through KrF, ArF, and Xe excimer-lamp wavelengths and extends into the near-infrared range. It is also described with favorable compaction, rarefaction and polarization-induced-birefringence characteristics, heat resistance around 1000℃, and durability against high-energy laser beams. Additional AQ characteristics include thermal expansion as low as one tenth that of conventional glass, high uniformity, very high purity, low metal-impurity and OH content, chemical resistance, and low dielectric loss. AQ series applications include lenses for semiconductor and flat-panel lithography equipment, photomask substrates, other optical components, and glass wafers; listed properties include 100 wt% SiO2, CTE 0.6 ppm/K from 50 to 200℃, softening point 1600℃, annealing point 1120℃, strain point 1060℃, and refractive index nD 1.46. For semiconductor packaging, AGC Inc. supplies glass carrier substrates in wafer and panel formats for wafer-level and panel-level packaging, supporting φ300 mm-class wafers and approximately 500 mm-square panels together with high flatness, high smoothness, notches, ID marking, serial numbering, and contact or noncontact packaging requirements. Its Through Glass Via platform creates through vias in thin glass to customer patterns for semiconductor-packaging 3D integration, with non-alkali EN-A1 glass, wafer sizes φ150 mm, φ200 mm and φ300 mm, panels up to about 550×650 mm, sheet thicknesses 0.1 to 0.5 mmt, and through, blind, straight, tapered, or hourglass via configurations. TGV specifications list hole diameters from φ20 μm to φ150 μm and a minimum pitch of twice the hole diameter, while the glass is positioned for fine wiring, high-frequency communication, reliability with thermal expansion close to silicon, and wafer or panel productivity in semiconductor packages, glass interposers, 3D glass IPD, MEMS, and sensors. CYTOP® is an amorphous fluoropolymer with high transparency, electrical insulation, water and oil repellency, chemical resistance, refractive index close to water, no fluorescence, and electret characteristics for semiconductor, electronics, and life-science applications. Because CYTOP® dissolves in dedicated fluorinated solvents, AGC Inc. states that it can form coatings below 1 μm and can be applied by spin, dip, spray, dispensing, and die-coating methods depending on substrate geometry. CYTOP® dilution uses dedicated solvents because the resin is insoluble in ordinary solvents, with 180℃-boiling solvent for spin coating, 100℃-boiling solvent for dip coating, and a blend of both for spray coating. The dedicated CYTOP® diluent can also be used as a cleaning solvent when a CYTOP® coating needs to be removed. CYTOP® applications include gate-insulating films for organic semiconductors in flexible displays, UVC LED encapsulants, electret material for vibration power generators, and biochips for detecting cells, DNA, and proteins. Listed CYTOP® grades include CTL-809A, CTX-809A, CTL-109AE, CTX-109AE, CTL-809M, CTL-107MK, and CTX-809SP2, with solvent boiling points of 100℃ or 180℃, concentrations including 7% and 9%, and filtration accuracy including 5 μm and 0.2 μm, along with CT-SOLV180, CT-SOLV100E, and CT-SOLV100K solvents. Fluon® ETFE film is produced by AGC Inc. from raw material through finished film and combines heat resistance, chemical resistance, light transmission, non-stick behavior, weather resistance, release properties, stain resistance, and flexibility across electronics, aerospace, solar-cell, and other applications. The ETFE film is described as UL 94VTM-0 flame-retardant, usable from -200℃ to 200℃, resistant to most chemicals including strong acids and alkalis, and capable of more than 400% uniaxial elongation at room temperature; semiconductor-package and electronics release films are listed applications. Fine-Silica RESIFA™ H SERIES includes hollow low-Dk and solid low-Df silica fillers intended to reduce electrical and signal loss in coatings, films, molded plastics, potting compounds, PCBs, RF equipment, electric-vehicle motors, and batteries, with uses also including copper-clad laminates, circuit boards, packaging materials, and high-frequency components. High Refractive Index Glass Substrate M 100 Series combines high refractive index and high transmittance with low absorption loss, flatness, smoothness, and thermal and chemical reliability for waveguides in AR or MR smart glasses and automotive head-up displays. AGC Inc.'s DOE uses micro-structured surface-relief patterns to diffract and split laser light, drawing on optical-pickup and optical-communication component technologies and high-accuracy glass microfabrication. Its DOE engineering covers design, prototyping, evaluation, process optimization, and large-volume mass production using internally developed simulation tools and accumulated processing know-how. The DOE is described with low zero-order transmission, high efficiency and durability, wide field of view, high-density or large-number dot projection, multi-level processing, and glass-based resistance to heat, humidity, and laser damage. The Flat-Top Diffuser uses inorganic materials, making anti-reflective coating easier while supporting high efficiency, durability, heat resistance, and a high laser-induced-damage threshold compared with polymer diffusers. Diffuser design can provide flat-top or 1/cosnθ intensity profiles, rectangular or circular beam shapes, independent X and Y diffusion-angle control, wide field of view, and limited light outside the target area, with applications including sensing, AR/VR/MR, security, projectors, optical communications, lighting, laser beam shaping, and LiDAR. Glass Frit and Glass Pastes are offered as powders, pastes, preforms, and tubes for insulation, hermetic sealing, protection, bonding, coating, and sintering-aid roles in electronic devices and chip modules including capacitors, inductors, and MEMS. The broader product portfolio also includes IWAKI heat-resistant glass containers, described without sealing gaskets for easier cleaning and as suitable for microwave heating with the lid and for rice-cooker or oven heating after removing the lid. Fine-Silica RESIFA™ SUNSPHERE is a spherical silica filler made from SiO2 by synthetic granulation, with porous grades that scatter light, high elasticity for tactile modification, adsorption and desorption functions, high hardness, and silanol surface groups; listed mean particle sizes span 3 to 20 μm and oil absorption spans 30 to 400 mL/100g depending on type. M.S.GEL is a functional spherical silica for liquid-chromatography columns, covering precision analysis and production-scale preparation; it includes products for protein and polymer analysis and purification, balloon-free DM grade, high-throughput HPLC columns with reduced fines, and particle sizes down to 1.8 μm. M.S.GEL specifications include SiO2 purity from 99.9 to 99.99%, particle sizes from 1.6 to 200 μm in the stated general range, controlled pore sizes from 6 to 100 nm, and EP-DF, EP-DM, and D grades for analytical or semi-preparative HPLC, preparative chromatography, and flash chromatography. Fine-Silica RESIFA™ SUNLOVELY is a layered-silica material formed from nanoscale-thickness, micrometer-diameter flaky SiO2 particles, with SiO2 purity above 98%, primary-particle thickness below 0.1 μm, large surface area of 50 to 300 m2/g, pore volume of 0.1 to 0.7 cc/g, and dense surface silanol groups of about 30 μmol/m2. SUNLOVELY is supplied as powder and water-dispersed slurry, with functions including ion exchange, adsorption and support of ultrafine particles or drugs; slurry grades can self-assemble into layers and can add barrier, strength, hydrophilic, heat-resistant, and flame-retardant effects when blended into organic coatings. Fluon+™ EA-2000 is a thermoplastic PFA adhesive for high-frequency applications, combining fluoropolymer heat and electrical characteristics with adhesion for 5G-compatible printed circuit boards and listing dielectric constant 2.0, dissipation factor 0.001, moisture uptake 0.03%, and stable dielectric behavior across temperature and frequency. Fluon+™ EA-2000 is offered as film in 12, 25, 38, 50, and 75 μm thicknesses, powder with D50 particle size 2 to 3 μm, and water dispersion with 40 wt% solids, for applications including automotive radar, 5G feedlines and antennas, other mmWave systems, and high-speed digital uses. Glass Lid with AGC Solder is designed for hermetic sealing at lower temperatures than gold-tin solder, can bond heterogeneous glass and ceramic because of its lower Young's modulus, and is less prone to oxidation, supporting hermetic packaging of LEDs, LDs, chips, and related components under ambient atmosphere.
Capabilities and products
- ceria CMP slurry
- SiC parts for semiconductor high-temperature equipment
- synthetic fused silica for semiconductor lithography and photomasks
- glass carrier substrates for semiconductor packaging
- custom TGV through-via glass substrates
- CYTOP amorphous fluoropolymer thin-film material
- Fluon® ETFE high-function fluoropolymer film
- Low-Dk/Low-Df silica fillers
- high-refractive-index waveguide glass for AR/MR
- DOE/diffuser microstructured glass components
- glass frit/paste insulation and hermetic-sealing materials
- Fluon+ EA-2000 high-frequency PFA adhesive
- Glass Lid + AGC Solder hermetic sealing