At a glance
| Booth | S7330 |
| Country | US |
| Website | www.aehr.com |
Company profile
Headquartered in Fremont, California, Aehr Test Systems provides test solutions for testing, burn-in, and stabilization of semiconductor devices at wafer level, singulated-die level, and package level, with thousands of systems installed worldwide. Its solutions address quality, reliability, safety, and security needs in applications including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles and charging infrastructure, solar and wind power, computing, and solid-state memory and storage. Aehr Test Systems provides production solutions across the manufacturing flow to improve yield and reliability and brings more than 40 years of burn-in and test expertise to customized system-level test requirements.
Exhibits
The FOX-CP is a single-wafer, single-touchdown burn-in and test solution for high-volume production, with a Universal Channel Architecture in which channels support I/O, Power Supply, Clock, and PPMU functions, and it supports production burn-in screening plus HTOL, HTRB, and HTGB qualification testing. FOX-CP is optimized for DFT, BIST, and high parallelism and is used for full-wafer functional, stress, and burn-in testing of automotive ICs and low-cost full-wafer testing of discrete or embedded memories. The FOX-CP full-wafer system can test thousands of die in a single touchdown, identify failing logic, memory, and photonic die before final package integration, integrate wafer handling and stepping, and use a WaferPak™ contactor with a wafer prober and high-performance thermal chuck for high-power wafer requirements. FOX-CP channel configurations provide up to 2,048 Universal Channel resources with I/O, Clock, PPMU, and DPS functions and up to 1,024 high-voltage 29 V or high-current 2 A source resources; the system supports over-current and over-voltage protection, HTOL, HTRB, HTGB testing, 1000+ hours of test time, and high-precision individual-device monitoring. FOX-CP applications include Memory & Logic, Automotive, Flash Cycling, devices with BIST, DFT & Scan, and Silicon Photonics. The FOX WaferPak Contactor enables single-touchdown full-wafer test and burn-in for wafer sizes up to 300 mm, with more than 50,000 contacts per wafer, Al, Cu, Au, or solder-ball pad metallurgy, an ambient-to-150° C temperature range, up to 2,048 I/O and DPS channels, up to 4 amps per contact, up to 2 kW of power dissipation, and a field-repairable carrier. The FOX-XP is a multi-wafer burn-in and test platform for high-volume production that can test up to 18 wafers in parallel in one chamber using WaferPak Contactors and supports logic, memory, photonic, and power devices. FOX-XP configurations accommodate full wafers, panels, singulated dies, and modules, with up to 18 Blade slots for wafer or panel examination and up to 9 Blades for wafer, singulated-die, and module DiePak® carriers, plus up to 3,500 watts of power per wafer. Each FOX-XP Blade can use Universal Channel, High Voltage, or High Current modules, providing up to 2,048 Universal Channel resources with I/O, Clock, PPMU, and DPS and up to 1,024 high-voltage resources at up to 29V or high-current resources at up to 2A; per-channel protection guards against over-current and over-voltage. For singulated die and modules, FOX-XP uses FOX DiePak carriers and an optional automated DiePak Loader, accommodates hundreds of modules or dice per burn-in/test board, addresses small-die and CSP pad-contact and socketing challenges, measures optical light energy, and maintains thermal control of device-generated heat and optical light energy. For packaged parts, Sonoma and Tahoe systems provide modular, upgradeable, scalable test electronics, a high-power option up to 2000W per DUT, HTOL, HTRB, and HTGB testing, SPI, I2C, and PSI5 protocol-aware testing, DUT-level voltage/current/temperature monitoring, GUI-based programming, and enterprise database management and automation. System Level Test (SLT) evaluates devices in complete integrated systems and can increase test coverage for multi-function and non-deterministic devices; Aehr Test Systems develops customized SLT solutions that can incorporate larger-form-factor handling, interacting subsystems, RF, protocol testing, and optical sensing. FOX-NP is a compact high-power verification and test system for full wafers, panels, singulated dies, and modules, using dual Blade capability with WaferPak™ contactors or DiePak® carriers and the same configurable Universal, High Voltage, and High Current resource approach for logic, memory, photonic, and power devices. The Automatic WaferPak Aligner loads, aligns, and unloads wafers between FOUPs or cassettes and WaferPak contactors, handles up to 50 wafers through a dual FOUP/cassette interface, supports wafers up to 300 mm, can be used with FOX-XP or FOX-15, uses optical barcode reading and multi-camera alignment, and shares wafer and test-result traceability with FOX-XP.
Capabilities and products
- Supply of single-wafer full-wafer test and burn-in systems
- Supply of multi-wafer test and burn-in systems for up to 18 wafers in parallel
- Supply of singulated-die and module test and burn-in systems
- Supply of packaged semiconductor device test and burn-in systems
- Supply of semiconductor system-level test and burn-in solutions
- Supply of automated wafer loading, unloading, and alignment equipment
- Supply of full-wafer test and burn-in contactors
- Supply of die and module test carriers
- Supply of automated DiePak loading and unloading equipment
- Supply of panel-level test and burn-in systems