At a glance
| Booth | N1285 |
| Country | SG |
| Website | www.sgapi.com |
Company profile
Advanced Packaging Interlink Holding Pte Ltd, API, is a global manufacturer of high-precision semiconductor equipment specializing in precision pick-and-place systems and advanced packaging systems, including Thermo-Compression Bonding (TCB) and Wafer-Level Hybrid Bonding (HB), for semiconductor backend processes and micro-component assembly. From its headquarters in Singapore, API operates a global service network spanning the United States, China, Malaysia, Austria, Japan, and other countries, providing technical support and consultancy for customers worldwide. Its teams include semiconductor-industry experts with backgrounds at YAMAHA, HITACHI, ASMPT, BESI, K&S, TDK, Goertek, and Keyence, engineers from the National Energy Laboratory of the United States and the Hong Kong University of Science and Technology Innovation Center, and management and engineering personnel with average industry experience of 10 to 30 years. API states that more than 52% of its technical workforce holds advanced degrees from Bachelor's through PhD level and that it has nearly 100 patents, with high-volume manufacturing capacity supporting more than 1000 installed machines and more than 84 HVM systems in the field. Its core technology investments cover motion control, precision machinery, thermo-flow simulation, optical imaging and vision, micro-nano manufacturing, industrial software, CAE, and motor technology, supporting applications such as HBM, high-performance CPUs and GPUs, and 2.5D and 3D packaging for AI. API's proprietary and specialized solutions include smart inline solutions for CIS-COB, ultra-thin-die stacking bonders, 3D multi-layer stacking thermo-compression bonders, and advanced bonders for multi-chip packaging, and it positions these capabilities for OSATs, IDMs, and camera-module manufacturers. The company states a mission to advance global precision intelligent manufacturing and an ambition to become a global leader in precision pick-and-place technology while remaining customer-focused in advanced semiconductor packaging. API's site metrics list 2 headquarters, 3 R&D centers, and 5 labs and offices.
Exhibits
API's precision-mechanics technology includes micro- and nano-scale positioning mechanics, vibration-suppression systems, and ultra-thin-die pick-and-place systems, while its software framework emphasizes modularization, extensibility, and teamwork. Its vision framework supports high-precision recognition, AOI for micro- and nano-defects, and deep learning, while its motion-control technology reaches 20G acceleration and 20m/s movement speed with highly customized motion systems. API also applies CAE simulation for efficient technology exploration and micro-mechanism-based optimization to reduce iteration time, together with compact and customizable high-performance motor technology. Its advanced-packaging products and process solutions include AP-Smart Inline, AP-M2000 Series, AP-M3500 Series, AP-TC2000 Series, smart inline CIS-COB solutions, ultra-thin-die stacking bonders, 3D multi-layer TCB systems, and advanced bonders for multi-chip packaging. These technologies are positioned for precision die attach and advanced semiconductor packaging, including HBM, high-performance CPU and GPU, and 2.5D and 3D AI-packaging applications. API describes its high-performance motor technology in terms of compactification, customization, and high technical barriers.
Capabilities and products
- precision pick-and-place system manufacturing
- thermo-compression bonding (TCB) equipment
- wafer-level hybrid bonding (HB) equipment
- CIS-COB smart inline solutions
- ultra-thin-die stacking bonders
- 3D multilayer stacking TCB equipment
- multi-chip packaging bonders
- micro/nano-scale precision positioning mechanics
- AOI for micro/nano defects
- 20G high-acceleration motion control
- 20m/s high-speed motion control