At a glance
| Booth | N0667 |
| Country | IL |
| Website | www.adt-co.com |
Company profile
Advanced Dicing Technologies Ltd is a world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and dicing processes for silicon-based ICs, hard-material Microelectronic Components (MECs), and package singulation, and it combines dicing equipment with annular dicing blades to provide complete dicing solutions. ADT has over 40 years of experience in dicing-equipment manufacturing, has operated since 1977 and was formerly K&S, and serves the semiconductor, microelectronic, and optical-components industries with equipment spanning different capabilities, configurations, automation levels, flexibility, and customization. As a one-stop shop, ADT carries out end-to-end research, development, and production in ISO 9001:2015 certified facilities, and its R&D organization combines technological know-how and experience to develop dicing solutions for special materials and applications. ADT also lists ISO 9001, ISO 14001, and CE among its quality standards. Its international headquarters is in Yokneam, Israel, with global marketing and sales, R&D and engineering, two main production facilities for blades and equipment, logistics, maintenance, and technical support, plus regional offices in Taiwan, the Philippines, Singapore and Malaysia, East Coast Pennsylvania and West Coast Arizona in the USA, and Shanghai, China. ADT supports customers through a worldwide network of distributors, sales agents, independent representatives, and a global service-support team, with representatives and distributors listed across India, Korea, Singapore, Malaysia, Indonesia, Thailand, Vietnam, the Philippines, Taiwan, Japan, France, Switzerland, Belgium, the Netherlands, Luxemburg, Germany, Austria, England, Scotland, Wales, North Ireland, Ireland, Ukraine, Kazakhstan, Italy, Greece, the Czech Republic and Slovakia, Spain and Portugal, Turkey, and South Africa.
Exhibits
ADT supplies dicing saws, blades, and peripherals for silicon-based ICs, package singulation, and hard-material MEC applications, including automatic saws, fully automatic single- and twin-spindle saws, special machines for tailored applications, resin, sintered, nickel, and hub diamond blades, plus water-cleaning systems, water-recycling systems, spindle water chillers, and semi-auto wafer mounting. Its fully automatic single-spindle range includes the 2-inch-spindle 7302 for products up to 12 inches round or a 9-inch by 12-inch square chuck and for up to 12-inch silicon wafers, PCB, QFN and BGA multi-panels, and LED packages. The 7222 for products and silicon wafers up to 8 inches, PCB, QFN and BGA multi-panels, highbrightness LED packages, and SAW filters; the 4-inch-spindle 7304 for hard materials with products up to 12 inches round or a 9-inch by 12-inch square chuck and applications including glass, sapphire, ceramic substrates, alumina, hybrids, and thick-film devices; and the 7224, compatible with 4-inch and 5-inch annular blades, for products up to 8 inches and applications including ceramic substrates, alumina, hybrids, and thick-film devices. The fully automatic twin-spindle range includes 80Ai; 80WT with 2-inch to 3-inch twin spindles for tapeless wettable-flanks QFN, silicon wafers, thin glass, and QFN and BGA multi-panels; 8030 with 2-inch to 3-inch twin spindles and products up to 12 inches round or a 12-inch by 12-inch square chuck for silicon wafers, thin glass, and QFN and BGA multi-panels; 80S2, described as reliable and high-performance with low cost of ownership; and 8020 with 2-inch to 3-inch twin spindles for products up to 8 inches, silicon wafers, and thin glass. For silicon-wafer and discrete-device precision dicing, ADT describes silicon wafers up to 12 inches in diameter, with 6-inch and 8-inch sizes most common and typical thicknesses of 200 to 800 micron, and identifies top-side and back-side chipping, cracking, ESD-related contamination, and poor cleaning as key considerations. The recommended wafer-dicing setup includes the 7222 fully automatic saw with WX3 wafer handling for better throughput and atomized cleaning, or the 7900 Duo automatic twin-spindle saw for double the throughput, together with hub and annular nickel blades with 2-inch OD, 1500 to 5000 mesh diamond grit, 0.015 to 0.120 mm thickness, feed rates of 10 to 120 mm/sec, spindle speeds of 30 to 50 krpm, blue or UV tape mounting, DI-water cooling with or without additives, and an optional carbon-dioxide bubbler. ADT's resin-bond dicing blades use a resin binder for blade-wear management, cover hard and brittle materials including QFN, thick ceramic substrates, LTCC, glass, and wettable QFN, span blade thicknesses from 75 µm to 2500 µm and diamond-grit sizes from 3 µm to 250 µm, and can be precision engineered to application-specific requirements. The resin-blade application table specifies 35 to 53 grit for ceramic packages and sensors in Alumina/AlN with C02/C07; 53 to 88 for QFN half-etched Cu and wettable QFN full cut in Cu leadframe plus molding with D02/D07; 53 to 88 for QFN full Cu in Cu leadframe plus molding with E01; 35 to 53 for DFN 0.3-0.5mm in Cu leadframe plus molding with E31/D02; 53 to 88 for wettable QFN first cut in Cu leadframe plus molding with P07; 30 to 45 for SAW devices and RF packages in HTCC with QKP/C02; 30 to 53 for CCD, filter, and lens applications in glass/quartz with QKP/E33; 45 to 63 for optical and electro-optical components in sapphire with QKP; and 30 to 53 for passive and active devices and communication modules in LTCC with QKP.
Capabilities and products
- semiconductor dicing saws
- laser scribing systems
- dicing blades
- package singulation dicing
- hard-material microelectronic component dicing
- fully automatic single-spindle dicing saws
- fully automatic twin-spindle dicing saws
- custom dicing machines for tailored applications
- resin-bond diamond dicing blades
- nickel and hub diamond dicing blades
- dicing-water cleaning and recycling peripherals
- semi-automatic wafer mounting equipment