At a glance
| Booth | K2268 |
| Country | US |
| Website | ACMR.com |
Company profile
SPM Wafer Cleaning for Advanced Semiconductor Manufacturing Wafer cleaning is one of the most critical steps in the semiconductor process flow, especially as dimensions continue to shrink to below the 1-nanometer (nm) node. Photoresist residue and particulates can reduce yields in large-die AI chips, impacting the performance of the final product or causing the chips to be scrapped. The sulfuric acid hydrogen peroxide step, or sulfuric peroxide mixture (SPM), is essential for removing organic contaminants from post-etch substrates and ion-implanted films, as well as for platinum silicide residue removal. SPM processes traditionally have been performed in tanks […] Read More Delving Deeper into the ACM Semiconductor Planetary Family Product Portfolio Following the launch of our ACM Planetary Family™, which brings together a process-aligned portfolio for semiconductor manufacturing, we delve deeper here into each of the planet series and how they reflect our product lines. Our offerings are grouped into eight different series that represent the essential stages in front-end and advanced packaging, providing a clearer path to identifying the right solutions for specific needs. With this approach, customers can more easily find the […] Read More As the feature sizes and critical dimensions of logic, memory and analog semiconductor devices shrink with advanced technology nodes, the sensitivity to submicron contaminants has increased significantly. Consequently, the use of wet cleaning technology to remove particulates and contaminants is critical to the success of semiconductor manufacturers. Single-wafer and batch cleaning technologies are both used […] Read More Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging One of the most important shifts in semiconductor manufacturing today is not just the continued growth of wafer-level packaging (WLP), but the increasing reliance on enabling, highly specialized process technologies. As device architectures evolve toward heterogeneous integration (HI) and chiplet-based designs, key technologies such as wet processing, electrochemical plating (ECP), plasma-enhanced chemical vapor deposition (PECVD), […] Read More
Capabilities and products
- SPM wafer cleaning for advanced semiconductor manufacturing
- batch wet cleaning technology
- front-end and advanced-packaging process equipment portfolio
- ion-implanted film cleaning
- platinum silicide residue removal
- post-etch substrate cleaning
- single-wafer wet cleaning technology
- sulfuric peroxide mixture removal of organic contaminants