At a glance
| Booth | N1188 |
| Country | TW |
| Website | www.ableprint.com.tw/en |
Company profile
AblePrint Technology Co., Ltd. was established in 2007 with registered capital of NTD 3 million and has positioned itself as a process solution provider for advanced-packaging manufacturing challenges. From its early development, the company identified process voids, warpage, heat dissipation, and high-temperature reflow soldering as major issues that advanced packaging would need to address. Its core technology is the pneumatic and thermal modulation of high-pressure and low-pressure gas at high and low temperature, a platform used to develop solutions around packaging-process conditions. Using this technology, AblePrint Technology Co., Ltd. expanded from process de-void solutions into package-warpage suppression, void-free soldering, and heat-dissipation solutions for high-power and high-efficiency packaged chips. The company horizontally integrates these process technologies with Automated Production Handling System and Process Performance Integration System business units. Its cost-reduction approach includes redefining equipment and material specifications, simplifying processes, increasing production capacity, saving materials, improving yield and quality, shortening processing time, and introducing rapid mass production. AblePrint Technology Co., Ltd. states that it has positioned itself as a process solution provider rather than a supplier of me-too equipment, and that every product provides at least one process solution. The company reports that its void-process solution system has reached nearly 80% global market share in the semiconductor-packaging market. Its quality system applies ISO 9001 quality-management principles in departmental daily work, with quality objectives, implementation plans, management-system understanding, and continued operation of the ISO 9001 quality-assurance system. In 2007 the company introduced the first-generation VFS: Void Free System for leading-edge packaging, followed by the second-generation VTS: Void Terminator System for wafer-level packaging automated bubble removal in 2014. In 2016 it achieved ISO9001 Quality Management System certification and launched a bubble-removal system for Fan-Out Panel Level Packaging applications. In 2019 it introduced PIoneer & PRO models for high-temperature vacuum-pressure environments in bump processing and reflow processes, and it received the 19th Golden Peak Awards for Top 10 Outstanding Enterprises and Top 10 Outstanding Innovations. In 2021 AblePrint Technology Co., Ltd. achieved ISO27001 Information Security Management System certification, adding information-security management to its formal certifications. In 2022 it introduced the 3.5th-generation LEAPSolve Platform, established a Shanghai subsidiary for pneumatic and thermal process equipment, and invested in ABLEPRINT TECHNOLOGY HONGKONG LIMITED. In 2023 it introduced the 4th-generation LEAPSolve Platform, relocated headquarters to Xiangshan, Hsinchu, established a Zhunan Branch, and received the 77th Golden Merchant Award. In 2024 the company introduced the 4th-generation RTS-chiplet for chiplet-integration packaging challenges, launched BMAC as a high-power burn-in system, and offered WSS for wafer- and panel-level warpage suppression.
Exhibits
AblePrint Technology Co., Ltd. organizes its supplied scope into Pneumatic & Thermal Process Solutions, Automation System Solutions, and Process Performance Integration Solutions. Its process-solution positioning includes bubble elimination, bubble-free metal welding, and warpage suppression to reduce process barriers, support rapid production, and reduce cost across industries. Within advanced packaging, its broader process work also addresses voids, heat dissipation, high-temperature reflow soldering, void-free soldering, and high-power packaged-chip thermal performance. The automation portfolio includes a CIM System Overview and structure together with MES Master and RMS Master functions as part of the software architecture around automated manufacturing. Its Automated Material Handling System provides complete hardware and software integration for smarter manufacturing and automatically transfers materials to designated equipment for processing. The AMHS supports first-in, first-out handling to optimize production efficiency and also supports priority scheduling and flexible scheduling output. The hardware side of the automation system includes OHT, rail-module setup, and AS/RS elements, while the product scope also includes dispatch-flow, software-and-hardware, and system-architecture diagrams. The process platform history includes VFS for leading-edge packaging, VTS for automated wafer-level bubble removal, PIoneer & PRO for high-temperature vacuum-pressure bump and reflow environments, and LEAPSolve platforms for high-performance advanced packaging. Recent named systems include RTS-chiplet for severe chiplet-integration packaging challenges, BMAC for high-power pre-burn-in testing, and WSS for wafer- and panel-level warpage suppression. The company has also developed and patented technologies related to bubble-removal ovens, adhesive-layer bubble removal, gas-concentration control for pressure vessels, material-warpage suppression using differential pressure, electronic-component heating and pressurizing furnaces, anti-warping reflow furnaces, OHT dust collection, and gas recovery. Taken together, the supplied range covers de-void equipment for semiconductor packaging, pneumatic and thermal process solutions, automation system solutions, process-performance integration, material handling, warpage control, soldering-process support, and thermal-management-related process equipment.
Capabilities and products
- semiconductor packaging de-void process solutions
- package warpage suppression
- void-free soldering process
- high-power packaged-chip heat-dissipation process
- pneumatic and thermal modulation of high- and low-pressure gas
- automated material handling system (AMHS)
- process performance integration system
- high-power burn-in test system