Zeon Corporation

At a glance

Company profile

Zeon Corporation is a chemical company headquartered in Tokyo, Japan. ZEON CSC is in charge of selling COP (Cyclo Olefin Polymer) resin and COP film in Taiwan. For semiconductor-related customers, Zeon identifies ZEONOR® COP resin as an exhibit material and states that its COP materials are useful in the manufacture of semiconductor products.

Exhibits

ZEONEX® is positioned for applications that use its low moisture absorption, good transparency and high-precision molding properties, including medical uses that take advantage of high purity and electrical insulating components that require low dielectric constant and low dielectric tangent. ZEONOR® is used in products such as light-guide plates and automotive parts by using properties that include high transparency, transferability and heat resistance. ZEONEX® and ZEONOR® are described as having water absorption below 0.01%, supporting dimensional stability under high-humidity conditions and precision molding. The Japanese product information states that ZEONEX® and ZEONOR® provide 92% total light transmittance and a specific gravity of about 1.01, combining transparency with lower weight than many general plastics. The product family is also characterized by low birefringence, heat resistance and moldability, while ZEONEX® K26R is specifically described as capable of fine-transfer molding for structures such as Fresnel lenses. ZEONEX® is used for optical parts such as camera components, printer components, optical pickups and mirrors, and ZEONOR® is used for light guides as well as other transparent engineering-plastic applications. Named optical applications include smartphone-camera lenses, automotive cameras, security and home cameras, digital-camera imaging lenses and finder prisms, AR and VR lenses, head-up displays, F-theta lenses, near-infrared cameras, LED lenses, light guides and optical mirrors. For medical, bio and analytical uses, ZEONEX® and ZEONOR® are applied where transparency, moisture barrier performance and low impurity levels are valued, including pharmaceutical packaging, microfluidics, biochips, analytical cells, cell-culture plates, bioprocess bags and microplates. The low moisture permeability of the materials can support long-term storage of moisture-sensitive materials, while their hydrophobic, low-surface-energy behavior is associated with low protein adsorption and reduced wetting. For semiconductor uses, ZEONEX® and ZEONOR® are described as very clean resins with very low impurity levels, low water absorption and low moisture permeability, and are applied to FOUP, FOSB, open cassettes, reticle pods and other sealed containers or components used in semiconductor manufacturing. ZEONOR® is also used for semiconductor transport containers, resin molds and multilayer barrier films by combining cleanliness, transferability, release characteristics, water-vapor barrier performance and transparency. In automotive applications, the materials are described as lighter than many general transparent resins and are used in applications such as headlamps and other automotive components. The optical-grade property table lists ZEONEX® grades K26R, K22R and T62R and ZEONOR® grades 360R and 1420R, with measured properties including specific gravity, refractive index, glass-transition temperature and melt-flow rate under stated ASTM, JIS and ISO methods. The medical-grade table lists ZEONOR® 1020R and ZEONEX® 5000, 690R and 790R and provides values for specific gravity, glass-transition temperature, water-vapor transmission rate and melt-flow rate, together with sterilization compatibility information. FDA DMF numbers are listed for ZEONEX® 1020R, 5000, 690R and 790R as 13885, 27657, 14084 and 17236 respectively. For storage and use of ZEONEX®, users are instructed to check product-liability information, avoid direct sunlight and high-energy light, and avoid temperatures above the heat-distortion temperature because discoloration, deformation or melting can occur. ZEONEX® should also be kept away from high heat and high-energy light sources because it may emit smoke or ignite, including from heat generated by light absorption. Improper molding conditions or poorly designed molds may create residual stress that induces solvent cracking, and parts under continuing load, including snap-fit insert-molded products and screw stops, may crack. Exposure to certain solvents and liquids may cause ZEONEX® to liquefy or swell, so materials and liquids containing long-chain alkyl groups should be tested before use. Zeon instructs users to test ZEONEX® under the harshest conditions expected in the intended application in order to determine safety and material suitability before use.

Capabilities and products

• COP resin and COP film supply
• low-impurity, low-water-absorption COP resin for semiconductor use
• ZEONEX® COP resin for optical components
• high-purity ZEONEX® material for medical applications
• ZEONEX® material for low-dielectric electrical insulation

Related product topics

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