Omni Matcher · SEMICON Taiwan 2026 · Exhibitor List

Zeon Corporation

Exhibitor at SEMICON Taiwan 2026 · Booth S7830

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At a glance

BoothS7830
CountryTW
Product categoriesDevice; Wafer; Display Panel Handling Products · Other
Websitewww.zeon.co.jp/en/business/enterprise/resin/cop

Company profile

ZEON is chemical company. Head quarter is located in Tokyo, Japan. ZEON CSC is in charge of selling of COP (Cyclo Olefin Polymer)resin, COP film in Taiwan. This time of ZEON's exhibit material is ZEONOR® COP resin (Cyclo Olefin Polymer) Our Material are surely useful for manufacture of semiconductor products. Please feel free to visit ZEON booth. (Booth Q6238)

Exhibits

SDGs Contribution Product Certification Program Occupational Health and Safety / Health and Productivity Management ZEONEX® has earned high marks for low moisture absorption, good transparency and high precision molding. ZEONEX® can be utilized in many applications. It is also applied to medical applications that take advantage of its high purity property, as well as to electric insulating components that require low dielectric constant and dielectric tangent. ZEONOR®, is used in such products as light guide plates and automotive parts, utilizing properties such as high transparency, transferring, and high heat resistance. Extremely low water absorption (Less than 0.01% per 24 hours) allows for excellent dimensional stability even under high humidity conditions. Designed for optics requiring high heat resistance (Tg =123 - 156°C) and very low focal length change after heat and humidity exposure. High transparency, Low water absorption, Low birefringence, High heat resistance, Superior moldability ※ Please check the PL(Product Liability) before using it and consider it carefully. 1 Please observe the following precautions for the storage and use of the product and items molded from the product. 2 Avoid exposure to direct sunlight and high-energy light, which can make ZEONEX ® discoloration. 3 Do not use or expose to temperatures over heat distortion temperature, since ZEONEX ® may discolor, deform, or melt. 5 Do not use under high heat temperature and near heat source, ZEONEX ® may emit smoke or ignite. 6 Do not use near high-energy light source, ZEONEX ® may emit smoke or ignite due to heat generation by light absorption. 7 Improper molding conditions or use with a poorly designed mold may induce solvent cracking through residual stress. 8 Do not use for parts that are subject to continuing load (snap fit insert molded products, screw stops, etc.), the material may crack. 9 Do not expose to the following solvents and liquids which may cause ZEONEX ® to liquefy or swell. · Prior to use test other materials and liquids containing long-chain alkyl groups in their structure. 10 Test ZEONEX ® under the harshest conditions to be encountered to determine the safety and suitability of the materials prior to use.

Capabilities and products

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