At a glance
| Booth | K2976 |
| Country | TW |
| Website | www.ytec.com.tw |
Company profile
YoungTek Electronics Corp. was established in 1991 and is a professional turn-key test service provider based in Hsinchu, Taiwan. Its services cover IC testing, wafer sawing, wafer grinding, and IC sorting for customers in the semiconductor, optoelectronics, and wireless communications industries. The company tests PC Peripheral ICs, Logic ICs, Analog ICs, Mixed-Signal ICs, Non-Volatile Memory ICs, MCU ICs, RF ICs, USB ICs, MEMS ICs, Touch Screen Controller ICs, Fingerprint Identification ICs, and LCD Driver ICs. It also provides LED testing, laser scribing, sorting, and substrate sawing services. In addition to OEM IC testing, YoungTek Electronics Corp. sells self-developed test equipment under the YoungTek brand and designs and produces test equipment in-house to support cost-effective service, short delivery, and high flexibility.
Exhibits
YoungTek Electronics Corp. provides comprehensive back-end semiconductor subcontracting services including wafer testing, wafer grinding and dicing with die sorting, IC final testing, special substrate dicing, test program development, platform conversion, engineering support, and customer shipment services, with a diversified product line intended to meet different test requirements and help customers bring ICs to market quickly through competitive test cost and capacity. Its listed test categories include PC peripherals, Logic, Mix-Signal, Non-volatile memory, MCU, USB, Analog power-management ICs, CIS image-sensor ICs, MEMS, RF communications ICs, LCD driver ICs, loT/3C ICs, and automotive ICs. The service page also lists LED subcontracting services and RFID subcontracting services. The Technology Road headquarters in Hsinchu Science Park can test 6-, 8-, and 12-inch wafers for product categories including SoC, LCD Driver, CIS, and RF. Wafer-test equipment includes YTEC S100, YTEC S50 (V50), and ADVANTEST V93000 for SoC; Yokogawa 6730, Yokogawa 6731, ADVANTEST T6391, YTEC LCDD Gen.1, and YTEC LCDD Gen.3 for LCD Driver; and TSK UF190 and TSK UF200 Serials probers for 6- to 8-inch wafers plus TSK UF3000 Serials for 8- to 12-inch wafers. Wafer grinding, dicing, and die sorting at the Technology Road headquarters cover 6- to 12-inch wafers, with DISCO DGP8760+DFM2700 for 8- to 12-inch wafer grinding, dry polishing, and In-Line Wafer Mounter work, DISCO DGP8761 for 8- to 12-inch grinding and dry polishing, and DISCO DFG8540 for 6- to 8-inch wafers. Dicing and inspection equipment includes DISCO DFD6361 for 6- to 12-inch wafers on dicing frames, DISCO DFD6340 for 6- to 8-inch wafers on dicing frames, MACHVISION AVI-350 and TOPCON VI-4202 AOI for 6- to 8-inch wafers on dicing frames, and HON. PRECISION In Tray AOI HT-1200Y for 2- to 4-inch chip trays. Sorting equipment includes YTEC LS-serials and EMTEC WCS-822 for transferring 6- to 8-inch wafers on dicing frames to 2- to 4-inch chip trays, and YTEC IS-serials for transferring 6- to 12-inch wafers on dicing frames to 2- to 4-inch chip trays. The Innovation Road plant in Hsinchu Science Park provides final-test solutions for Logic, Mix signal, Power, and RF products together with program development, platform conversion, and engineering support; final-test package types include QFN, QFP, DFN, and BGA, and the plant also assists with L/B, Socket, and Kit outsourcing. Final-test equipment lists YTEC S100 and YTEC V50 as full-function testers, SEIKO EPSON Serials, YTEC Serials tray handling, and the ISMECA NY20 bowl feeder, while the Puding plant provides special substrate dicing. For test program development and platform conversion, YoungTek Electronics Corp. uses the flexibility and compatibility of its in-house development to reduce test-equipment cost and shorten platform-conversion and test time. Engineering support covers accessory and tooling design, including Printed Circuit Board (PCB), Probe Card, Load Board, and Docking design plus outsourcing support, and customized key-component development is used to improve test timeliness and speed. Its data-management services include customized data and feedback platforms through e-service or secure automatic transfer, customer-specific data and form formats, production-data retention for more than 3 years with longer retention on request, periodic B2B transfer of subcontracting data through networks such as FTP/sFTP, e-Service downloads, remote connection for tester control and engineering development or validation, and online e-Learning for test-platform training.
Capabilities and products
- turn-key semiconductor back-end test services
- 6/8/12-inch wafer testing
- wafer grinding, dicing and die sorting
- IC final testing
- special-substrate dicing
- test program development
- test platform conversion
- Logic/Mix Signal/Power/RF final testing
- QFN/QFP/DFN/BGA final testing
- LED testing services
- laser scribing services
- IC/LED sorting services
- RFID subcontracting services
- in-house test-equipment design, manufacturing and sales
- PCB/Probe Card/Load Board/Docking design
- FTP/sFTP B2B transfer of test subcontracting data