At a glance
| Booth | K2976 |
| Country | TW |
| Product categories | Device Handling; Feeding Systems · Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Wafer Level Bonders · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Package Inspection; Lead Scanners · Burn-In Systems · Functional Test Systems · Handlers; Positioner Systems · Package Test Systems · System on a Chip (SOC); Mixed Signal Test Systems · Wireless, non-contact Test Systems · Handling; Transfer; Loading Systems; Lifting devices |
| Website | www.ytec.com.tw |
Company profile
YoungTek Electronics Corporations, established in 1991, is a professional turn-key test service provider based in Hsinchu, Taiwan. From IC testing, wafer sawing, wafer grinding to IC sorting, we provide wide range of diversified product portfolio to our customers in semiconductor, optoelectronics and wireless communications industry to test PC Peripheral ICs, Logic ICs, Analog ICs, Mixed-Signal ICs, Non-Volatile Memory ICs, MCU ICs、RF ICs、USB ICs、MEMS ICs, Touch Screen Controller ICs, Fingerprint Identification ICs, LCD Driver ICs and etc. We also offer services of LED testing, laser scribing, sorting and substrate sawing. More than being an OEM IC test company, we sell self-developed test equipment with YoungTek’s brand name. As we design and produce test equipment in-house, we are able to build our core competences to benefit customers with cost-effective, short delivery and high flexibility services to enhance competitiveness for both side to create a win-win situation. Website: www.ytec.com.tw
Capabilities and products
- IC sorting
- IC testing
- LED testing
- laser scribing
- self-developed YoungTek test equipment
- substrate sawing
- testing for logic, analog, mixed-signal, memory, RF and MEMS ICs
- turn-key IC test services
- wafer grinding
- wafer sawing
Related product topics
- IC Package Assembly, Test and Failure Analysis
- Laser Scribing & Drilling Systems
- Semiconductor Test Equipment
- IC and Power IC Testing Systems
- Optical Test Systems
- IC Sorting Systems
- Dicing Sawing and Scribing Equipment
- Wafer Grinding & Slicing Equipment
- Package Singulation and Die Sorting
- Wafer Backgrind Equipment