At a glance
| Booth | Q5942 |
Company profile
Yen Ann Technology Company Limited is a Taiwan-registered technology company active in surface treatment, machinery, electronic-component related manufacturing, and trade. The company has import and export qualification and a registered business scope that combines manufacturing activities with wholesale and international trade. Its registered manufacturing activities include metal-product surface treatment and machinery-equipment manufacturing. The registered business scope also includes power, transmission, and distribution machinery and electronic-component manufacturing. Its listed wholesale activities cover metals and molds, chemical raw materials, machinery, and electronic materials. International trade is included among the registered business items, connecting the manufacturing and materials activities with commercial supply. Factory registration data points to metal-product manufacturing and processing as part of the company's production activity. The stated technology range centers on metallized substrates, thick-copper and DPC structures, aluminum-nitride substrate products, MEMS-related work, and through-glass-via metallization. Within that range, the company lists both high-uniformity and high-precision metallized substrate variants for optical-communication and heat-dissipation applications. It also lists foundry-style MEMS work and glass-substrate through-hole copper filling, extending the stated manufacturing scope from substrate metallization to microelectromechanical and TGV-related processing.
Exhibits
The listed product range includes metallized substrates and thick-copper metallized substrates. DPC thick-copper substrates are listed as a distinct product category, together with high-uniformity metallized substrates. The range includes aluminum-nitride ceramic metal substrates and ultra-thin aluminum-nitride substrates, including the listed ultra-thin aluminum-nitride ALN substrate category. MEMS probes are included in the product list as a microelectromechanical offering. The company also lists ultra-high-precision DPC metal as part of its DPC-related offering. For optical-communication applications, the listed range includes high-uniformity optical-communication metallized substrates and high-precision optical-communication metallized substrates. For thermal-management applications, it lists high-uniformity heat-dissipation substrates and enhanced copper heat-dissipation substrates. High-precision metallized substrates and high-uniformity metallized ceramic heat-dissipation substrates are also part of the stated substrate portfolio. The company lists ultra-thin metallized substrates as another form factor within its metallized-substrate range. Its service offerings include Laser-submount MEMS foundry work and general MEMS foundry work. For glass substrates, the company lists through-hole copper filling as a processing capability. It also lists TGV through-holes and TGV copper-filled metallization for through-glass-via structures. Through-Glass-Via is explicitly included in the stated offering, linking the glass-substrate work with TGV processing. Taken together, the stated exhibit range spans metallized ceramic and aluminum-nitride substrates, thick-copper and precision DPC products, MEMS probes and foundry work, optical-communication and heat-dissipation substrates, and copper-filled TGV processing.
Capabilities and products
- metallized substrates
- DPC thick-copper substrates
- high-uniformity metallized substrates
- aluminum-nitride ceramic metallized substrates
- ultrathin aluminum-nitride substrates
- MEMS probes
- high-uniformity metallized substrates for optical communications
- copper heat-dissipation substrates
- Laser-submount MEMS contract manufacturing
- TGV through-glass-via copper filling and metallization