At a glance
| Booth | R7312 |
| Country | KR |
| Website | withsystem.co.kr/index_en.html |
Company profile
Since its establishment in 2002, With System Co., Ltd. has steadily grown as an independent inspection solution provider in IT fields such as display and mobile. In 2023, the company expanded into the semiconductor sector by establishing a semiconductor probe and test socket manufacturing facility under its newly launched Semiconductor Business Division. The Semiconductor Business Division is responsible for producing key components essential for semiconductor testing. By fully internalizing all core processes—ultra-precision machining, spring production, surface treatment, and assembly—it is dedicated to earning customer trust and becoming a top-tier player in the industry. The division is committed to delivering a wide range of solutions for the manufacturing of semiconductor probes and test sockets used in the testing of various semiconductor product groups. 1) Spring Contact Probe Withsystem offers customized designs tailored to each customer’s requirements, and supports small-lot, high-mix production. We have a monthly production capacity exceeding 2 million pins, and are capable of manufacturing fine-pitch probes as small as 0.11mm in diameter. Our fully in-house production system covers all stages—from design and development, surface treatment, precision machining, and assembly, to inspection and customer-specific analysis—ensuring both quality and responsiveness. 2) IC Test Socket Withsystem has the capability to machine aluminum metal and various types of engineering plastics, and proudly offers high-precision hole drilling technology down to 0.1mm. We support a wide range of semiconductor package types—including BGA, QFP, QFN, and LGA—depending on application needs. Our products are currently used by world-class semiconductor test houses, and we continue to actively promote our solutions to these and other global customers.
Exhibits
Manufactures Spring Contact Probes and IC Test Sockets for semiconductor testing. Spring Contact Probes support custom designs, small-lot/high-mix production, and fine-pitch probes down to 0.11 mm diameter; IC Test Sockets support BGA, QFP, QFN, and LGA packages with high-precision hole drilling down to 0.1 mm.
Capabilities and products
- semiconductor probe and test socket manufacturing
- spring contact probe with customized designs
- monthly production capacity exceeding 2 million pins
- fine-pitch probes as small as 0.11mm in diameter
- ultra-precision machining and spring production
- fully internalizing all core processes
- IC test socket manufacturing
- machining aluminum metal and engineering plastics
- high-precision hole drilling down to 0.1mm
- supporting BGA, QFP, QFN and LGA package types
- small-lot, high-mix production
- used by world-class semiconductor test houses