At a glance
| Booth | R7312 |
| Country | KR |
| Website | withsystem.co.kr/index_en.html |
Company profile
WITH SYSTEM CO.,LTD. was established in 2002 and has developed as an independent inspection-solution provider for IT fields including display and mobile products. In 2023, the company entered the semiconductor sector by launching a Semiconductor Business Division and establishing a manufacturing facility for semiconductor probes and test sockets. The Semiconductor Business Division produces key components for semiconductor testing and internalizes core processes including ultra-precision machining, spring production, surface treatment and assembly. Its in-house system extends from design and development through surface treatment, precision machining, assembly and inspection to customer-specific analysis, supporting both production quality and response to individual requirements. Spring contact probe production exceeds 2 million pins per month, and the company can manufacture probes as small as 0.11mm in diameter. The company also machines aluminum metal and engineering plastics and provides high-precision hole drilling down to 0.1mm for IC test socket production. Its semiconductor products are used by global semiconductor test houses, while the company continues to promote its probe and socket solutions to other global customers. The company's inspection-solution work is supported by employees with experience and professional technology across its operating fields. WITH SYSTEM CO.,LTD. is headquartered in Yulgok-dong, Gimcheon and also has a location in Suwon, Korea. Its affiliates include a company specializing in ultra-precision processing and manufacturing for advanced measurement and another business that manufactures pin blocks and sockets and provides related solutions. Its affiliates also include a Vietnam company specializing in precision processing and equipment manufacturing and a company providing IT inspection solutions.
Exhibits
For semiconductor testing, WITH SYSTEM CO.,LTD. supplies customized spring contact probes for customer-specific requirements and small-lot, high-mix production, together with IC test sockets for BGA, QFP, QFN and LGA packages. Its HYPER_SOCKET and BGA_SOCKET cover 32 to 5000 BGA packages at 0.2mm to 0.8mm pitch, with HYPER_SOCKET using aluminum material and BGA_SOCKET listed as a standard configuration. The IDTC_SOCKET covers 32 to 5000 BGA packages at 0.3mm to 0.8mm pitch and is specified for high-temperature use at 150 ℃, while QFP_SOCKET covers 32 to 240 pins at 0.4mm to 1.0mm pitch. LGA_SOCKET supports up to 4189 LGA at 0.4mm to 2.54mm pitch, and QFN_SOCKET covers 6 to 100 pins at 0.35mm to 1.0mm pitch. The Non-Magnetic Probe uses BeCu with Au plating for the top and barrel, PBT with Au plating for the bottom, and a BeCu Au-plated spring; its listed operating travel is 10.6gf @ 0.7mm and its life span at operating travel is 250,000Cycles. The same Non-Magnetic Probe is specified for -45℃ to 90℃ operation, 0.77nH self inductance, maximum relative permeability of 0.999549319 and a DC current rating of 1.5A, with applied current increased in 0.1A units for 10 Sec. per step. The display-signal range includes W6 for OLED and LCD module full testing, running Linux on TEGRA K1 or Exynos 9820, with DC 12V 10A power and LAN, RS-232 and SD-CARD connectivity; it is designed for AMOLED module inspection and for manual or automated line facilities. A6 is intended for OLED and LCD module aging tests, uses Linux with TEGRA K1 or Exynos 9820, operates at DC 12V 5A, and supports AMOLED module reliability evaluation with chamber conditions optimized at 85˚C temperature and 85% humidity. A7 performs OLED and LCD module full tests under Linux or Android with Exynos 9820, provides LAN, RS-232 and SD-CARD connections, and combines an OCTA display pattern generator with checks for TSP touch and draw, pen, proximity and luminance as well as AMOLED reliability evaluation. V6 is an OLED Cell Tester based on firmware with STM32F103 and FPGA, using 220VAC and LAN or RS-232 connections for LCD and OLED cell panel tests across 1CH to 10CH display configurations. V7 Air performs LCD cell inspection and final-product lighting tests before the module process, supports 48 signals and a +40V to -40V voltage range, while V7 Pro extends LCD and OLED cell-panel testing to lifespan evaluation with 96 signals and 16 EL powers. V8 likewise supports LCD and OLED cell-panel testing and lifespan evaluation with 96 signals and 16 EL powers, adds four high-power DC channels rated as 40A on three channels and 12A on one channel, and maintains a +40V to -40V voltage range. The embedded-board range includes TEGRA K1 and Exynos9820 core modules measuring 70mm(W) x 50mm(D) x 5.5mm(H) for embedded platforms. TEGRA K1 is listed for display drive, video, mass storage, networking, motor control, signal control, user UI and other interfaces, while Exynos9820 covers display drive, video, mass storage, networking, camera input, signal control, user UI and other interfaces. The automation-equipment portfolio covers logistics, inspection and tester automation, with functions including Auto Focus, Smart Vision Align, NFC communication, current-consumption measurement, film precision removal and attachment, ITV precision compression, and inspection of Vision (LED Chip) transmission characteristics. CVD Unloading M/C has a 3 Sec tact time and a PC Based Operating Interface, Driver IC Pick & Place also has a 3 Sec tact time, and Application Tester has a 5 Sec tact time; each is listed with its own equipment dimensions. CIPG Bonding Machine uses an articulated KUKA robot for small products such as cell phones and OCTA PANNEL, supports logistics and automatic input/discharge process automation, and is offered with Custom Design. UB Tape Press Machine uses a 4-axis orthogonal robot for small products such as cell phones and OCTA PANNEL, adds ITV precision crimping, logistics automation and automated tape attaching and pressing. The 6ch Panel Press Transfer Machine handles transfer and put-in or take-out work, discharges panels after compression and protective-vinyl attachment, and combines ITV precision crimping with logistics and automatic input/discharge automation. MCT Auto Work Machine automates raw-material input and discharge with a KUKA articulated robot and is available with Custom Design. The contact-block range includes ONESOKET for automatic B-to-B connector contact in unmanned production lines, with 12mm forward and reverse travel, 5 Bar working-air pressure, Ultem1000 material and a 12˚ open angle for LCM, TSP, camera-module and PCB ASSY applications. A Manual block provides passive B-to-B connector contact with TOP and BOTTOM one-touch-clamp methods for LCM, TSP, camera-module and PCB ASSY applications. MSWB0811.8 is an XZ two-stage cylinder using Clean Air at 2 to 7kgf/㎠ and 30 to 300mm/sec, with 11.8(±0.3)mm forward and backward stroke and 2(±0.3)mm up and down stroke. MSWB0812-3.5NC is another XZ two-stage cylinder, using Clean Air at 4kgf/㎠ and 30 to 200mm/sec, with 12(±0.3)mm forward and backward stroke and 3.5(±0.3)mm up and down stroke and a normally closed up and down cylinder. The Multi Auto Contact Unit is specified for 100% contact, 1mm or greater pitch and a Pogo Pin device. The vision-technology portfolio covers automatic optical inspection for display defective pixels at 20 to 30㎛, spot detection and compensation, and 3D precision measurement and inspection at 20㎛ for devices and electronic parts. An OLED Panel Pattern inspection System for products 7 inches or less is listed as an OLED panel tuning facility, while another OLED system combines Gamma, De-mura and AOI compensation with Gamma Brightness Gray Tuning, De-Mura pixel-smear and Mura removal, and visual AOI inspection. The Target Insertion System provides Real Vision Contact for products 7 inches or less and automatically makes contact after identifying the connector's actual location. FAI inspection System performs target vision inspection with product-dimension and appearance inspection, and Parts inspection System provides the same dimensional and appearance inspection for small-type parts. Laser 3D Scanner Inspection System performs target 3D scan inspection for small-type products and is specified as a 700(W) x 500(D) x 330(H) system weighing approximately 60Kg.
Capabilities and products
- customized Spring Contact Probe manufacturing
- small-lot, high-mix Spring Contact Probe production
- fine-pitch probe manufacturing down to 0.11mm diameter
- Spring Contact Probe monthly capacity exceeding 2 million pins
- ultra-precision machining for semiconductor probes/test sockets
- spring production for semiconductor probes
- surface treatment for semiconductor probes/test sockets
- assembly of semiconductor probes/test sockets
- IC Test Socket manufacturing
- precision machining of aluminum and engineering plastics
- 0.1mm high-precision drilling for IC Test Socket
- BGA Test Socket (32–5000 BGA, 0.2–0.8mm pitch)
- 150 ℃ high-temperature semiconductor test socket
- QFP Test Socket (32–240 Pin, 0.4–1.0mm pitch)
- LGA Test Socket (4189 LGA Under, 0.4–2.54mm pitch)
- QFN Test Socket (6–100 Pin, 0.35–1.0mm pitch)
- non-magnetic probe
- OLED/LCD module full testing
- OLED/LCD module aging testing
- AMOLED module reliability evaluation at 85˚C/85%
- OLED/LCD Cell Panel testing
- LCD Cell final-product lighting test
- OLED/LCD Cell lifespan evaluation
- OCTA DISPLAY Pattern Generator functional inspection
- core modules for embedded platforms
- Auto Focus for automation equipment
- Smart Vision Align vision alignment automation
- NFC communication for automation equipment
- current consumption measurement
- precision film removal/attachment automation
- ITV precision compression automation
- LED Chip transmission-characteristics inspection
- CVD unloading equipment
- Driver IC Pick & Place equipment
- logistics automatic input/discharge process automation
- automated tape attaching/pressing equipment
- panel press transfer and discharge after protective-vinyl attachment
- raw-material input/discharge automation
- B-to-B connector automatic contact socket
- B-to-B connector manual contact socket
- XZ two-stage cylinder
- Pogo Pin multi-auto-contact unit (pitch 1mm or greater)
- 20–30㎛ display-defective-pixel AOI detection and spot compensation
- 20㎛ 3D precision measurement/inspection for devices/electronic parts
- OLED Panel Pattern Inspection
- Gamma brightness gray tuning
- De-Mura pixel-smear/Mura removal
- visual inspection of AOI optical objects
- automatic connector contact after vision positioning
- product dimension and appearance vision inspection
- Laser 3D Scanner inspection system