Wings Global Technology Inc.

Exhibitor at SEMICON Taiwan 2026 · Booth S7546

Booth S7546Country TW2 product topics
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BoothS7546
CountryTW
Websitewww.wgti.com.tw
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Company profile

Wings Global Technology Inc. (WGTI), founded in June 2016, has been focusing on R&D and production of Photo Sensitive PolyImide (PSPI) products in the following applications. Advanced Packaging Stress Buffer in IC Substrates for Optoelectronic Display Devices These PSPI products including negative and positive ones are with the following properties and advantages to enable our customers to improve product quality and reduce cost mainly. High Electric Insulating / High Mechanical Strength / High Adhesion Strength to Substrates (Si, SiO2, Cu, Al…) Low Dielectric Constant & Dissipation Factor / Low Moisture Uptake / Low Inner Stress Corrosion, Hygrothermal and Irradiation Resistant High/Low Thermal Stable Easy Processing Harmless & Environmentally Friendly Also, our team is capable of providing customer-oriented adhesion promoter chemical which is related to PSPI application to solve delamination issue. We are committed to solving our customers’ challenging issue in their process or operation through material science of polymer synthesis and collaborative customerized products and system.

Exhibitor profile

Exhibits

Develops and produces positive and negative Photo Sensitive PolyImide (PSPI) materials for advanced packaging and stress-buffer applications in IC substrates for optoelectronic display devices. Also provides customer-oriented adhesion-promoter chemicals related to PSPI applications to address delamination issues.

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