At a glance
| Booth | J3234 |
| Country | TW |
| Website | www.winfoundry.com |
Company profile
WIN Semiconductors Corp. was founded in October 1999 and became the first pure-play 6-inch GaAs foundry in the world. To serve growing demand, the company established three advanced GaAs wafer fabs for cost-effective, high-speed and high-quality fabrication of GaAs MMICs, or monolithic microwave ICs, and RFICs, or radio-frequency ICs. WIN provides dedicated foundry services to design houses and integrated device manufacturers and supplies HBT and pHEMT MMIC fabrication services to IC corporations worldwide using GaAs technology. Building on its MMIC technology, WIN also provides optoelectronic-device fabrication services for optical-communication and 3D-sensing applications.
Exhibits
Since 2007, WIN Semiconductors Corp. has described itself as the world's largest 6-inch (150 mm) GaAs pure-play foundry, with three advanced fabs providing HBT, pHEMT, BiHEMT and GaN foundry services for MMIC applications. Since 2006, WIN has operated a four-shift 24/7 non-stop foundry service, and its annual capacity exceeded 340,000 wafers in 2018; WIN also states that it fulfilled more than 50% of global GaAs foundry demand. In addition to semiconductor fabrication, WIN provides IC layout support and automated DC/RF on-wafer testing and positions its foundry service around fast turnaround, cost-effective turn-key solutions and total quality control. Its in-house wafer-testing service covers both HBT and HEMT products, provides a standard WAT database for customers and a PCM database for SPC analysis, and uses a CIM-generated real-time yield report to judge whether a processed wafer meets shipping criteria. WIN also provides probe-card making and on-wafer DC/RF screening according to customer requests, with screening capabilities that include DC single-site and multiple-site parallel probing up to hex-site X16 and high-current measurement at 1A. RF test functions include insertion-loss and harmonic testing, four-port vector S-parameter testing in single-ended or differential modes, fixed or swept RF-power testing for Gain, P1dB and Psat, RF high-input-power testing above +10 dBm, and CW or pulse testing. For design support, WIN develops accurate device models and PDKs with EDA vendors to provide a complete design platform, accurate circuit simulation, more efficient layout sign-off and mask tape-out. Fast WIN PDK SERVICE supports industry-standard RF EDA tools with device and sub-circuit models, flexible P-cell layout, EM, DRC and LVS functions and a user-oriented interface for circuit design. WIN's in-house models are designed to match its processes closely for performance prediction and support corner and statistical simulation used in yield analysis. Its WebDRC system provides 24-hour online DRC verification and immediate rule updates without time-zone delay, enabling rapid layout sign-off, mask tape-out and entry into the production cycle. The design-support program also includes customer training covering WIN technology, the foundry-service flow, the design kit and the design-demonstration flow. Together, these services connect 6-inch GaAs wafer fabrication, HBT, pHEMT, BiHEMT and GaN MMIC foundry processes, optoelectronic fabrication, IC layout support, PDK-based design enablement and automated on-wafer DC/RF testing within WIN's foundry workflow.
Capabilities and products
- 6-inch GaAs foundry services
- GaAs MMIC/RFIC fabrication
- HBT MMIC fabrication services
- pHEMT MMIC fabrication services
- GaN MMIC foundry services
- optoelectronic-device fabrication for optical communications and 3D sensing
- automated DC/RF on-wafer testing
- IC layout support
- RF IC PDK design support