At a glance
| Booth | S8246 |
| Country | TW |
| Website | www.wellthin.com |
Company profile
WELL THIN TECHNOLOGY, LTD. was established in April 2003 and primarily serves semiconductor IC fabrication plants, positioning its work around machine-problem solving backed by design, manufacturing and practical engineering experience. Its early work focused on functional improvement of parts for semiconductor thin-film sputtering equipment, with goals of stronger performance and longer service life and with locally sourced specialist capabilities and special materials integrated to meet semiconductor-equipment specifications. The company states that it follows principles of fairness and honesty and emphasizes quality, price and delivery time while providing services intended to reduce FAB costs for technology manufacturers. For quality-system development, it records ISO9000 quality certification in 2008, ISO9001:2008 certification in the same year, and ISO9001:2015 certification in 2018. Its operating approach combines product knowledge with practical experience, cooperation among different technical teams and continuing updates to methods and equipment. The company timeline records capital of NT500萬元 in 2003, acquisition of a laser marking machine and a used helium leak detector in 2007, an increase of capital to NT:2500萬元 in 2008, expansion and relocation with acquisition of Inventor 3D design software in 2009, and introduction of ERP inventory and maintenance management plus HYPDM project-management software in 2010. Later milestones include purchase of a German vacuum helium leak detector in 2011, acquisition of BROWN&SHARP 2D and 3D precision measuring equipment and passage of a TSMC strategic-supplier Audit in 2012, Taiwan invention patent I393212 in 2013, three-axis and five-axis CNC machines plus a surface grinder in 2015, and Taiwan invention patent I532940 in 2016. In 2017, WELL THIN records Ministry of Economic Affairs SBIR approval for an 8-inch wafer tungsten-coating system integration development project and US PAT:9757865; in 2018 it records a larger combined factory and office relocation; and in 2019 it applied for a Ministry of Economic Affairs CITD project for an easy-maintenance, long-service-life throttle-valve system for semiconductor equipment.
Exhibits
WELL THIN TECHNOLOGY, LTD. lists Heater work, semiconductor-parts modification, new-part fabrication for Shield, PCB repair, vacuum-valve work, Spindle repair, pneumatic-cylinder repair, ceramic-part machining, semiconductor-part development and semiconductor-part improvement among its service and supply capabilities. Its service list also includes ceramic machining, metal machining, Valve repair and Cylinder repair, and the company describes an evolution from drawing and outsourced small-part fabrication toward instrument-based problem solving and CNC capacity for a more integrated one-stop service. The 8-inch wafer WCVD equipment retrofit project adds automatic wafer-center calibration so that the wafer center can be calibrated with each rotation, addressing wafer eccentricity in older equipment designs; the project received Ministry of Economic Affairs SBIR support and produced two patent designs. A DISCO equipment retrofit project was developed for factory automation so that automatic transfer could be connected through the modified tool, reducing labor requirements, and the company states that the modification can improve production efficiency by 200%. The I532940 TV retrofit simplifies a complex maintenance mechanism, reducing replacement time to 10% of the original time while strengthening function, improving precision and extending service life by 2 times. For I393212 Altus CIP parts, the company describes a one-piece Holder design for wafer support, with design, manufacturing, quality control and packaging provided as an integrated production flow. The same Altus CIP program uses improvements across a transfer mechanism in which more than half of eight components have CIP changes, with correction of individual-part weaknesses intended to improve fit, functional stability and service life and to extend MTBF by 2 times. Its Holder clamp improvement uses high-nickel material changes on three parts and addresses insufficient clamp gripping force so that lift pins do not rise abnormally while remaining easier to remove and replace. Under US patent 9757865, an 8-inch Robot plate wafer-transfer upgrade focuses on anti-slip performance, increasing wafer-transfer speed to 3 times and stating durability of more than 1 year, with a simple lift-and-press replacement method intended to ease maintenance. The related new Pivot assy is manufactured with controlled tolerances for quiet operation across high- and low-temperature conditions, and the project states that Robot repeated-positioning precision can reach 2 times. Across these projects, the common application is modification, repair, fabrication and performance improvement of semiconductor equipment and parts for IC fabrication plants, including work on sputtering-equipment components, wafer-handling functions and maintainability.
Capabilities and products
- functional improvement of semiconductor sputtering-equipment parts
- new Shield fabrication
- PCB repair
- vacuum valve repair
- spindle repair
- pneumatic-cylinder repair
- ceramic-part machining
- semiconductor-parts modification