At a glance
| Booth | P5612 |
| Country | TW |
| Product categories | Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi · Air Velocity (VA) Humidity and Moisture Sensing · Centrifuges · Chromatograph · CV (capacitance-to-voltage) Probe systems · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Die Inspection; Die Shear · Fiber Optic Inspection Instruments · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Flat; Notch Finding System · Instruments; Bench Top Test · Leak Detection Systems - Vacuum or Gas · Line Width; Critical Dimension (CD) Measurement · Microscopes: Atomic Force Microscopes (AFM) · Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes · Microscopes: Optical Microscopes · Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr · Overlay Measurement · Package Inspection; Lead Scanners · Particle Monitors; Analyzers - Airborne or Liquid · Plate Inspection Equipment · Resistivity Measurement; 4 point probe; Sheet resistance · Spectrometers; Fourier Transform Infrared (FTIR); Attenuated Total Reflectance FTIR (ATR-FTIR); Auge · Stress; Refractive Index; Reflectivity & Conductivity Measurement · Thermal Sensing, Measurement, Analysis · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Weight measurement; precision scales · Wire Bonding Inspection; Test · X-ray; XRF; 3-D X-Ray; LEXES Systems |
| Website | www.wantec.com.tw |
Company profile
WA NEW TECHNOLOGY CO., LTD., also presented as WANTEC, is a Taiwan-based semiconductor packaging equipment and process-integration company. The business began in Taoyuan in 2017 and was reorganized in 2020, with a focus on semiconductor packaging equipment and solutions. It is a partner for semiconductor packaging equipment and process integration. WANTEC's product scope includes process and inspection equipment such as FOUP Open-Path AMC analyzers, wafer scanning acoustic tomography, particle counting systems, wafer warpage metrology, wafer marking alignment, plasma-related equipment, rotating joints, EFEMs, grinding wheels and gas purifiers. The company focuses on packaging-line equipment distribution, integration, metrology and process support rather than wafer fabrication or chemical manufacturing.
Exhibits
華維新科技長期深耕半導體封裝與檢測應用，結合多家國際設備品牌與在地技術支援，協助客戶加速導入、穩定量產。
Capabilities and products
- EFEMs
- FOUP Open-Path AMC analyzers
- gas purifiers
- grinding wheels
- particle counting systems
- plasma-related equipment
- rotating joints
- wafer marking alignment
- wafer scanning acoustic tomography
- wafer warpage metrology
Related product topics
- EFEM Automation Modules
- Plasma Process Equipment and Technology
- Airborne Molecular Contamination Monitoring Solutions
- Acoustic Scanning Microscopy
- Scanning Acoustic Microscopy
- Wafer Laser Marking & Alignment
- Particle and AMC Contamination Monitors
- Air and Liquid Particle Counters
- Wafer Warpage and Roughness Metrology
- Wafer Thickness, Warp And Resistivity Gauges
- Gas Purifier Systems
- Grinding Wheels and Abrasives