基本資料
| 攤位 | P5612 |
| 國別 | TW |
| 產品分類 | Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi · Air Velocity (VA) Humidity and Moisture Sensing · Centrifuges · Chromatograph · CV (capacitance-to-voltage) Probe systems · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Die Inspection; Die Shear · Fiber Optic Inspection Instruments · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Flat; Notch Finding System · Instruments; Bench Top Test · Leak Detection Systems - Vacuum or Gas · Line Width; Critical Dimension (CD) Measurement · Microscopes: Atomic Force Microscopes (AFM) · Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes · Microscopes: Optical Microscopes · Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr · Overlay Measurement · Package Inspection; Lead Scanners · Particle Monitors; Analyzers - Airborne or Liquid · Plate Inspection Equipment · Resistivity Measurement; 4 point probe; Sheet resistance · Spectrometers; Fourier Transform Infrared (FTIR); Attenuated Total Reflectance FTIR (ATR-FTIR); Auge · Stress; Refractive Index; Reflectivity & Conductivity Measurement · Thermal Sensing, Measurement, Analysis · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Weight measurement; precision scales · Wire Bonding Inspection; Test · X-ray; XRF; 3-D X-Ray; LEXES Systems |
| 網站 | www.wantec.com.tw |
公司簡介
WA NEW TECHNOLOGY CO., LTD. 亦以 WANTEC 對外呈現，是位於台灣的半導體封裝設備與製程整合公司。公司於 2017 年在桃園展開業務，並於 2020 年改組，專注於半導體封裝設備與解決方案。它是半導體封裝設備與製程整合夥伴。WANTEC 的產品範圍包括 FOUP Open-Path AMC 分析儀、wafer 掃描聲學斷層檢測、粒子計數系統、wafer 翹曲量測、wafer 標記對位、plasma 相關設備、rotating joints、EFEM、grinding wheels 與 gas purifiers 等製程與檢測設備。該公司專注於封裝產線設備代理、整合、量測與製程支援，而非晶圓製造或化學品製造。
展出產品
華維新科技長期深耕半導體封裝與檢測應用，結合多家國際設備品牌與在地技術支援，協助客戶加速導入、穩定量產。
能力與產品項目
- EFEMs
- FOUP Open-Path AMC 分析儀
- 微粒子計數系統
- 旋轉接頭
- 晶圓掃描聲學斷層掃描
- 晶圓標記對位
- 晶圓翹曲量測
- 氣體純化器
- 研磨砂輪
- 電漿相關設備