At a glance
| Booth | S7004 |
| Country | TW |
| Website | www.unitechno.co.jp |
Company profile
Unitechno Inc., since its foundation in 1988, has been providing semiconductor package materials for many customers throughout the world. During the past decade, the company conducted a series of R&D studies on advanced technologies related to semiconductor assembly materials and function test tools. Our products, based on those studies, have been highly qualified among leading customers in semiconductor industry. We always keep a close eye on the industrial trends of semiconductor package and catch future demands to satisfy customer's requirements in timely manner. Based on this foreseeing attitude, we make every effort to establish a trust among customers by offering advanced technologies. Your satisfaction is our pride. Main Products: ・IC Test Sockets ・Image Sensor Sockets ・IC Burn-In Sockets ・Wafer Probe Units ・IC Trays ・Chip Trays ・IC Handler Fixtures ・Stiffeners Company History: October 1988 incorporated in Shinagawa Tokyo September 1991 UNITECHNO SINGAPORE (PTE) LTD incorporated July 1993 Malaysia Branch Office opened December 1994 Head Office relocated to Shibaura Tokyo November 1995 Osaka Sales Office opened February 2002 UNITECHNO USA INC incorporated March 2010 Paid Capital revised to JPY100,000,000.00 April 2012 UNITECHNO ENGINERING CO. LTD. Head Office: 13-9, 2-Chome,Shibaura,Minato-Ku, Tokyo Branch Office & Over Sea Subsidiary ・Osaka--2-1,1-Chome,Jounan,Ikeda-City, Osaka. ・Kyushu--8-16, Fumoto-Cho,Hitoyoshi-City, Kumamoto. 【Overseas】 ・USA--UNITECHNO USA,INC ・Singapore--UNITECHNO SINGAPORE (PTE) LTD ・Malaysia--UNITECHNO MALAYSIA BRANCH OFFICE. ・Taiwan--UNITECHNO Engineering Co., Ltd.
Capabilities and products
- IC Burn-In Sockets
- IC Handler Fixtures
- IC Test Sockets
- Image Sensor Sockets
- Wafer Probe Units
- function test tools for semiconductor assembly
- semiconductor assembly materials