At a glance
| Booth | S7004 |
| Country | TW |
| Website | www.unitechno.co.jp |
Company profile
UNITECHNO INC., founded in 1988, provides semiconductor package materials to customers around the world and has conducted R&D on advanced technologies related to semiconductor assembly materials and functional test tools. Products based on this work have been qualified among leading customers in the semiconductor industry, while the company tracks semiconductor-package industry trends and future demand to respond to customer requirements. Its main products are IC Test Sockets, Image Sensor Sockets, IC Burn-In Sockets, Wafer Probe Units, IC Trays, Chip Trays, IC Handler Fixtures, and Stiffeners. The company was incorporated in Shinagawa, Tokyo in October 1988, later relocated its head office to Shibaura, Tokyo, and has offices or subsidiaries in Osaka, Kyushu, the USA, Singapore, Malaysia, and Taiwan. Its history also records incorporation of UNITECHNO SINGAPORE (PTE) LTD in September 1991, opening of the Malaysia Branch Office in July 1993 and Osaka Sales Office in November 1995, incorporation of UNITECHNO USA INC in February 2002, revision of paid capital to JPY100,000,000.00 in March 2010, and UNITECHNO ENGINERING CO. LTD. in April 2012.
Exhibits
UNITECHNO INC. provides test-interface technology for advanced semiconductors, and its IC sockets for testing and burn-in are intended to help realize high-precision solutions for testing increasingly diverse semiconductor functions. Since its founding, the company has designed and manufactured sockets and contact units for customer test environments and requirements, with main product groups including IC Test Socket, IC Burn-In Test Socket, Probe head, Ancillary functions, and IC Tray. IC Test Sockets can be customized with in-house probe contacts for applications including image sensors, multi-function microcomputers, automotive devices, powered devices, long-term operation, special ICs requiring testing on both sides of the package, high-frequency testing, high and low temperatures, high current, Kelvin contact at narrow pitch, and non-magnetic requirements. The burn-in socket design incorporates burn-in requirements, including a standard molding socket frame, lower-cost structures using moldable or inexpensive substrates for device-specific contact retainers, high-temperature designs verified by evaluation tests, and high-current designs using heat-dissipating contacts with specially designed spring contacts. The in-house probe head uses low-resistance, durable vertical probes for high-precision functional tests, short conduction paths for high-frequency measurement, stable bump contact with crown-shaped tips, repairable or replaceable single-probe units, reduced PAD damage through vertical contact, and suppression of dust generation; examples include a 150μm pitch and a fine-pitch probe head of φ85μm. Ancillary functions include thermal control of IC packages through heat sinks and fans, heaters, or active Peltier heating and cooling, plus a board interface that flexibly connects the DUT Board and Test Head, accommodates X, Y, and Z positional shifts, provides a stable high-frequency transmission line, and supports several-thousand-volt applications. For IC trays, UNITECHNO INC. carries out design, tooling fabrication, and molding, manufactures JEDEC-standard trays and tip trays, and develops designs for uses such as device shipping and transport in manufacturing; listed types include JEDEC outline trays, custom shaped trays, and Chip trays.
Capabilities and products
- test socket and contact-unit design and manufacturing
- IC test sockets
- image sensor sockets
- IC burn-in test sockets
- wafer probe units and probe heads
- IC/chip tray design, tooling, and molding
- IC handler fixtures
- semiconductor stiffeners
- active Peltier IC temperature control
- DUT Board/Test Head board interface